Latest news with #BardiaPezeshki
National Post
14-05-2025
- Business
- National Post
Avicena Announces Series B Funding Round Led by Tiger Global with Participation from SK hynix
Article content Amid unprecedented demand for ultra-low power optical interconnects in AI datacenters and future disaggregated memory fabrics, Avicena is preparing for the next phase of growth Article content Article content SUNNYVALE, Calif. — Avicena, the leader in ultra-low power high-density microLED-based interconnects, announced today it has raised $65M in Series B Funding, bringing the total capital raised to $120M. The round was led by Tiger Global with participation from new and existing investors including Maverick Silicon, Prosperity7 Ventures, Venture Tech Alliance, SK hynix, Cerberus Capital Management, Hitachi Ventures and Lam Research. Article content 'This highly oversubscribed funding round is another testament that Avicena is in a leading position to disrupt the AI interconnect market, and reflects the magnitude of business opportunity before us,' says Bardia Pezeshki, Founder and CEO of Avicena. 'We will use the new funds to further scale our team and ramp our first product into production. Our LightBundle ™ microLED-based interconnects provide superior bandwidth density, energy efficiency, reliability and cost compared to all other optical interconnect technologies.' Article content Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance. Avicena's groundbreaking LightBundle ™ technology is based on arrays of GaN microLEDs that leverage the large display ecosystem and can be integrated directly onto any high-performance CMOS IC. The microLED transmit arrays are coupled into multi-fiber cables which connect to matching arrays of integrated silicon detectors, enabling class-leading optical interconnects which provide superior performance, reliability and cost compared to laser-based solutions. Article content 'Avicena's unique technology has transformative potential for improving the bandwidth and reducing the power consumption of AI computing systems,' says Rohit Iragavarapu, Partner at Tiger Global. 'We are excited to be investing behind them and their vision for a better AI interconnect.' Article content 'Energy-efficient optical interconnects are becoming a major topic in the architecture of next generation disaggregated memory fabrics,' says Rene Do, Senior Director, Venture Investment, SK hynix. 'Since high speed electrical interconnects have fundamental reach limitations, and laser-based optical links are too power hungry, microLED-based interconnects like Avicena's LightBundle represent a very promising solution for low power links in future memory fabrics. We are excited to join this round and potentially collaborate with the Avicena team on the development of next generation memory interconnects.' Article content 'AI is evolving faster than anyone could have predicted, pushing the limits of datacenter sustainability,' says Manish Muthal, Senior Managing Director at Maverick Silicon. 'The demand for AI supercomputers and datacenters that will power the next wave of AI models is accelerating, but this growth must be sustainable, and Avicena's energy efficient interconnects have the potential to deliver exactly what's needed. We look forward to continuing this transformative journey with the Avicena team.' Article content 'In the rapidly evolving landscape of generative AI, the demand for new compute and chip communication solutions is unprecedented,' says Abhishek Shukla, Managing Director at Prosperity7 Ventures. 'Avicena is well positioned to deliver superior next generation interconnects for AI supercomputers and datacenters which will help to unlock the next era of AI innovation at scale in a sustainable way. We are pleased to back the Avicena team on the next leg of their journey.' Article content AvicenaTech, Corp. is a privately held company located in Sunnyvale, CA, developing LightBundle, a next generation optical interconnect architecture for AI/ML, HPC, sensors, 5G wireless and aerospace applications. This unique, flexible ultra-low energy technology is based on microLEDs, offering very high bandwidth density and low latency. Now, system designers can disaggregate functions like compute and memory and radically grow system throughput. Avicena's technology is a key building block in the evolution of networking and computing that will reduce the energy impact on our planet. Article content Article content Article content Article content Article content Article content
Business Wire
14-05-2025
- Business
- Business Wire
Avicena Announces Series B Funding Round Led by Tiger Global with Participation from SK hynix
SUNNYVALE, Calif.--(BUSINESS WIRE)--Avicena, the leader in ultra-low power high-density microLED-based interconnects, announced today it has raised $65M in Series B Funding, bringing the total capital raised to $120M. The round was led by Tiger Global with participation from new and existing investors including Maverick Silicon, Prosperity7 Ventures, Venture Tech Alliance, SK hynix, Cerberus Capital Management, Hitachi Ventures and Lam Research. 'Energy-efficient optical interconnects are becoming a major topic in the architecture of next generation disaggregated memory fabrics,' says Rene Do, Senior Director, Venture Investment, SK hynix. Share 'This highly oversubscribed funding round is another testament that Avicena is in a leading position to disrupt the AI interconnect market, and reflects the magnitude of business opportunity before us,' says Bardia Pezeshki, Founder and CEO of Avicena. 'We will use the new funds to further scale our team and ramp our first product into production. Our LightBundle ™ microLED-based interconnects provide superior bandwidth density, energy efficiency, reliability and cost compared to all other optical interconnect technologies.' Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance. Avicena's groundbreaking LightBundle ™ technology is based on arrays of GaN microLEDs that leverage the large display ecosystem and can be integrated directly onto any high-performance CMOS IC. The microLED transmit arrays are coupled into multi-fiber cables which connect to matching arrays of integrated silicon detectors, enabling class-leading optical interconnects which provide superior performance, reliability and cost compared to laser-based solutions. 'Avicena's unique technology has transformative potential for improving the bandwidth and reducing the power consumption of AI computing systems,' says Rohit Iragavarapu, Partner at Tiger Global. 'We are excited to be investing behind them and their vision for a better AI interconnect.' 'Energy-efficient optical interconnects are becoming a major topic in the architecture of next generation disaggregated memory fabrics,' says Rene Do, Senior Director, Venture Investment, SK hynix. 'Since high speed electrical interconnects have fundamental reach limitations, and laser-based optical links are too power hungry, microLED-based interconnects like Avicena's LightBundle represent a very promising solution for low power links in future memory fabrics. We are excited to join this round and potentially collaborate with the Avicena team on the development of next generation memory interconnects.' 'AI is evolving faster than anyone could have predicted, pushing the limits of datacenter sustainability,' says Manish Muthal, Senior Managing Director at Maverick Silicon. 'The demand for AI supercomputers and datacenters that will power the next wave of AI models is accelerating, but this growth must be sustainable, and Avicena's energy efficient interconnects have the potential to deliver exactly what's needed. We look forward to continuing this transformative journey with the Avicena team.' 'In the rapidly evolving landscape of generative AI, the demand for new compute and chip communication solutions is unprecedented,' says Abhishek Shukla, Managing Director at Prosperity7 Ventures. 'Avicena is well positioned to deliver superior next generation interconnects for AI supercomputers and datacenters which will help to unlock the next era of AI innovation at scale in a sustainable way. We are pleased to back the Avicena team on the next leg of their journey.' About Avicena AvicenaTech, Corp. is a privately held company located in Sunnyvale, CA, developing LightBundle, a next generation optical interconnect architecture for AI/ML, HPC, sensors, 5G wireless and aerospace applications. This unique, flexible ultra-low energy technology is based on microLEDs, offering very high bandwidth density and low latency. Now, system designers can disaggregate functions like compute and memory and radically grow system throughput. Avicena's technology is a key building block in the evolution of networking and computing that will reduce the energy impact on our planet. For more information, visit
Business Wire
22-04-2025
- Business
- Business Wire
Avicena Works with TSMC to Enable PD Arrays for LightBundle™ MicroLED-Based Interconnects
SUNNYVALE, Calif.--(BUSINESS WIRE)--Avicena, headquartered in Sunnyvale, CA, announced today that the company will work with TSMC to optimize photodetector (PD) arrays for Avicena's revolutionary LightBundle microLED-based interconnects. LightBundle supports > 1Tbps/mm shoreline density and extends ultra-high density die-to-die (D2D) connections to > 10 meters at class-leading sub-pJ/bit energy efficiency. This will enable AI scale-up networks to support large clusters of GPUs across multiple racks, eliminating reach limitations of current copper interconnects while drastically reducing power consumption. Increasingly sophisticated AI models are driving an unprecedented surge in demand for compute and memory performance, requiring interconnects with higher density, lower power, and longer reach for both processor-to-processor (P2P) and processor-to-memory (P2M) connectivity. LightBundle technology has been developed specifically to address extreme I/O requirements of AI clusters with extremely high shoreline densities and ultra-low power consumption. LightBundle transmitters use microLED arrays optimized for dense, high-speed interconnects achieving < 1pJ/bit energy efficiency. LightBundle optical receivers utilize silicon PD arrays optimized for the visible light wavelengths transmitted by the microLEDs. LightBundle chiplet transceivers are well-suited to various packaging architectures including co-packaged optics (CPO), on-board optics (OBO), and pluggable optical modules. Both LED and PD arrays are bonded directly to the surface of CMOS ICs for a variety of process nodes. This work harnesses TSMC's leadership in image and optic sensor technologies to produce high-performance PD arrays for visible light, while also benefiting from TSMC's manufacturing excellence. 'Avicena has been working with TSMC since our very beginning. TSMC's world-class manufacturing capabilities and deep experience in silicon optical sensors are critical for developing and producing key components of our LightBundle interconnects,' says Bardia Pezeshki, co-founder and CEO of Avicena. 'We are delighted to collaborate with innovators like Avicena to advance AI infrastructure, addressing the growing demands for compute scalability through efficient connectivity,' said Lucas Tsai, Vice President of Business Management at TSMC North America. 'TSMC provides foundry's most comprehensive CMOS image sensor (CIS) technology portfolio, and we're excited to support Avicena with our leading processes and manufacturing expertise.' Avicena will exhibit in the Innovation Zone at the TSMC 2025 North America Technology Symposium in Santa Clara, CA, where it will showcase its LightBundle interconnect platform at Booth IZ09 and Co-Founder & CEO Bardia Pezeshki will present at the 'Innovate with TSMC!' Forum. About Avicena Avicena Tech Corp. is a privately held company located in Sunnyvale, CA, developing LightBundle, a next generation optical interconnect architecture for AI/ML, HPC, sensors, 5G wireless and aerospace applications. This unique, flexible ultra-low energy technology is based on microLEDs, offering both very high bandwidth and low latency. Now, system designers can disaggregate functions like compute and memory and radically grow system throughput. Avicena's technology is a key building block in the evolution of networking and computing that will reduce the energy impact on our planet.
Yahoo
31-03-2025
- Business
- Yahoo
Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit
Avicena is unveiling its modular LightBundle interconnect platform with industry-leading power efficiency and density based on microLEDs, aimed at AI scale-up networks SAN FRANCISCO, March 31, 2025--(BUSINESS WIRE)--Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle™ interconnect platform at OFC 2025 in San Francisco, CA ( LightBundle supports > 1Tbps/mm shoreline density and extends ultra-high density die-to-die (D2D) connections to > 10 meters at class leading sub-pJ/bit energy efficiency. This will enable AI scale-up networks to support large clusters of GPUs across multiple racks, eliminating reach limitations of current copper interconnects while drastically reducing power consumption. Increasingly sophisticated AI models are driving an unprecedented surge in demand for compute and memory performance, requiring interconnects with higher density, lower power, and longer reach for both processor-to-processor (P2P) and processor-to-memory (P2M) connectivity. Nowhere is the demand higher than in the scale-up domain of AI datacenters where GPUs in a compute cluster are densely interconnected. Today the typical scale-up interconnect is passive copper with a reach limited to ~1 meter, constraining a GPU cluster to a single rack. The LightBundle interconnect extends the reach to more than 10 meters, enabling a single cluster to scale to hundreds or even thousands of GPUs across multiple racks. At the same time, LightBundle dramatically reduces the power consumption of these interconnects, significantly easing power delivery and cooling burdens. The LightBundle interconnect is a modular transceiver chiplet-based architecture. Transceiver chiplets contain integrated microLED and PD arrays that are connected to other LightBundle transceiver chiplets via multi-core fiber bundles. They support dense, low power D2D interfaces such as UCIe or BOW. LightBundle chiplet transceivers are well-suited to various packaging architectures including co-packaged optics (CPO), on-board optics (OBO), and pluggable optical modules as well as active optical cables (AOC). Unlike silicon photonics, LightBundle interfaces can be integrated onto almost any IC process from a wide variety of foundries. "At Avicena, we are excited to announce our modular, ultra-low power, scalable chiplet interconnect based on our LightBundle technology," says Bardia Pezeshki, Co-Founder and CEO of Avicena. "Working with our hyperscale datacenter partners we have optimized our platform to address the specific needs of large clusters of GPUs in future Scale Up networks. We support shoreline densities of greater than 1Tbps/mm at power efficiencies at least 5x better than competing solutions." "As generative AI continues to evolve, the role of high bandwidth-density, low-power and low latency interconnects in scale-up networks cannot be overstated", says Michael Fox, Founder & Managing Partner of InflectionPoint Research. "Avicena's microLED based interconnect technology has the potential to deliver a paradigm shift in this domain of hyperscale AI Scale Up networks." Avicena at OFC 2025: In addition to showcasing its LightBundle interconnect technology at Booth #1956, Avicena will participate in the following events: Bardia Pezeshki, Co-Founder & CEO, will be presenting at the Workshop: How do Co-Packaged Optics Become Manufacturable? Workshops provide an opportunity for attendees to interact informally on particularly compelling technological March 30, 2025 – 16:00 – 18:30 Chris Pfistner, VP of Sales and Marketing, will be chairing Session 5 at the Optica Executive Forum:Photonic Interconnects in AI Clusters with speakers from Microsoft, NVIDIA, Meta & March 31, 2025 – 15:40 to 16:40 – Marriott Marquis, San Francisco, CA Chris Pfistner, VP of Sales and Marketing, will also be presenting at the Market Watch Session:MW Panel 5: Optical Network Evolution for AI/ML, Architectures & DriversThursday, April 3, 2025, 10:15 – 11:45 About Avicena AvicenaTech Corp. is a privately held company located in Sunnyvale, CA, developing LightBundle, a next generation optical interconnect architecture for AI/ML, HPC, sensors, 5G wireless and aerospace applications. This unique, flexible ultra-low energy technology is based on microLEDs, offering both very high bandwidth and low latency. Now, system designers can disaggregate functions like compute and memory and radically grow system throughput. Avicena's technology is a key building block in the evolution of networking and computing that will reduce the energy impact on our planet. For more information, visit View source version on Contacts Avicena Media Contact:Sama Pourmojibemail: sama@ Sign in to access your portfolio
