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Khalifa University launching cooperative education from Fall 2026 across engineering, computing, and biomedical engineering
Khalifa University launching cooperative education from Fall 2026 across engineering, computing, and biomedical engineering

Zawya

time24-07-2025

  • Business
  • Zawya

Khalifa University launching cooperative education from Fall 2026 across engineering, computing, and biomedical engineering

Abu Dhabi-UAE – Khalifa University of Science and Technology today announced it will be launching Cooperative Education (Co-op) courses from Fall 2026, integrating academic learning with practical hands-on experience in engineering and computing fields. Each co-op semester spans 6 months, with the first earning 2 credits, while eligibility criteria include those with a CGPA of 3.25 and a minimum of 75 credits to apply and 90 credits to start. Students who would like to enroll need to demonstrate full-time commitment, compliance with guidelines, and completion of 26 weeks with the assigned organization, either on-site or in offices. The launch ceremony at the Main Campus included a panel discussion moderated by Maryam Alkindi, Director, Student Success and Alumni Services. Panelists included Professor Ehab El-Sadaany, Dean, College of Engineering and Physical Sciences, an industry representative, and two Co-op alumni from Waterloo University. Students will earn community service hours for attending the ceremony and the panel discussion. Professor Bayan Sharif, Provost, Khalifa University, said: 'The launch of the co-op course reflects our strong commitment to helping students acquire additional skills during their campus life. It integrates academic studies with work experience, alternating periods of study and work, involving a partnership between students, institutions, and employers. Khalifa University is proud to initiate such an arrangement that facilitates employability, and financial support, even as employers gain access to talented students, and reduced recruitment costs, while contributing to workforce development. This course also serves as part of our mandate to support the UAE's knowledge-economy transformation.' The co-op program helps students apply classroom knowledge to real-world engineering challenges through meaningful, supervised work placements, gain essential workplace skills, and explore potential career paths. Elements of co-operative education programs build quality into program delivery, while offering an enriched understanding of a student's academic program through practical application. Through the competitive co-op placement process, students develop the ability to assess their skill level, prepare a polished résumé, and to even go through the interview process successfully. Moreover, through their work experiences, students can develop and refine employability skills, gain an understanding of career opportunities in their areas of study and workplace realities. The co-op program assists in cultivating professional skills including communication, teamwork, and problem-solving, while offering exposure to the expectations and culture of the professional arena. It facilitates exploration of career interests and industry sectors, while enhancing employability through practical experience and networking. About Khalifa University of Science and Technology Khalifa University of Science and Technology, the UAE's top-ranked research-intensive institution, focuses on developing world leaders and critical thinkers in science, engineering and health science. The world-class university endeavors to be a catalyst to the growth of Abu Dhabi and the UAE's rapidly developing knowledge economy as an education destination of choice and a global leader among widely acknowledged international universities. For more information, please visit:

YES Delivers Multiple VertaCure LX Systems
YES Delivers Multiple VertaCure LX Systems

Business Wire

time07-07-2025

  • Business
  • Business Wire

YES Delivers Multiple VertaCure LX Systems

FREMONT, Calif.--(BUSINESS WIRE)--Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, today announced the delivery of multiple VertaCure™ LX curing systems to one of Taiwan's top outsourced semiconductor assembly and test (OSAT) providers. These systems will support advanced packaging processes for Edge Computing and HPC solutions, delivering critical low-temperature curing, annealing, and degassing for WLCSP, Plated Bump, and Cu Pillar applications. Adoption by leading IDMs and foundries has already validated the platform, and we're excited to see growing demand from OSAT customers as well. This momentum strengthens our market leadership in advanced packaging. Share The VertaCure LX is a fully automated vacuum curing and degassing system engineered to ensure uniform temperature distribution and precise control of heating and cooling rates. This results in complete solvent removal, improved film properties, elimination of outgassing after cure, and outstanding particle performance. YES products have consistently demonstrated superior quality in curing, coating, and annealing across both R&D and high-volume manufacturing environments. 'The VertaCure family has become the industry's most widely adopted high-volume manufacturing (HVM) curing solution for 2.5D packaging,' said Rezwan Lateef, President of YES. 'These systems deliver exceptional mechanical, thermal, and electrical performance across wafer-level, 2.5D, and 3D packages. Adoption by leading IDMs and foundries has already validated the platform, and we're excited to see growing demand from OSAT customers as well. This momentum strengthens our market leadership in advanced packaging.' Alex Chow, SVP of Sales and Business Development and Asia President at YES, added, 'VertaCure LX systems deliver more than 30% improvement in thermal uniformity and 30% lower cost of ownership in HVM. We anticipate follow-on and volume purchase orders from this customer in 2026. This shipment marks another milestone that solidifies YES as the market leader in curing technology for advanced packaging.' About YES YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems, and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company's products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit

Unisys (UIS) Announces Pricing of $700 Million Senior Secured Notes Due 2031
Unisys (UIS) Announces Pricing of $700 Million Senior Secured Notes Due 2031

Yahoo

time24-06-2025

  • Business
  • Yahoo

Unisys (UIS) Announces Pricing of $700 Million Senior Secured Notes Due 2031

Unisys Corporation (NYSE:UIS) is . On June 16, Unisys announced the pricing of its previously announced private offering of $700 million aggregate principal amount of Senior Secured Notes due 2031. This is a private offering extended to persons reasonably believed to be qualified institutional buyers. everything possible/ According to Unisys, the notes will be issued at par and carry an annual interest rate of 10.625%. The interest is payable semi-annually on January 15 and July 15, starting from January 15, 2026. The offering is anticipated to close on June 27, 2025, subject to customary closing conditions. Unisys intends to use the net proceeds from this offering to finance a cash tender offer and consent solicitation for all of its existing notes worth $485 million. The notes are due November 1, 2027. The proceeds will also cover related premiums, fees, and expenses, while another portion is earmarked to partially fund the company's U.S. pension plan deficit and postretirement liabilities. The remaining funds, if any, will be used for general corporate purposes. Unisys Corporation (NYSE:UIS) is an information technology company that provides digital workplace, cloud, and enterprise computing solutions. It operates through three segments: Digital Workplace Solutions (DWS), Cloud, Applications & Infrastructure (CA&I), and Enterprise Computing Solutions (ECS). Its offerings include IT support services, cloud migration, cybersecurity, and ClearPath Forward. While we acknowledge the potential of UIS as an investment, we believe certain AI stocks offer greater upside potential and carry less downside risk. If you're looking for an extremely undervalued AI stock that also stands to benefit significantly from Trump-era tariffs and the onshoring trend, see our free report on the best short-term AI stock. READ NEXT: Goldman Sachs China Stocks: 10 Stocks to Buy and 10 Undervalued Blue Chip Stocks Analysts Recommend for Smart Investing. Disclosure: None. Sign in to access your portfolio

Unisys (UIS) Announces Pricing of $700 Million Senior Secured Notes Due 2031
Unisys (UIS) Announces Pricing of $700 Million Senior Secured Notes Due 2031

Yahoo

time24-06-2025

  • Business
  • Yahoo

Unisys (UIS) Announces Pricing of $700 Million Senior Secured Notes Due 2031

Unisys Corporation (NYSE:UIS) is . On June 16, Unisys announced the pricing of its previously announced private offering of $700 million aggregate principal amount of Senior Secured Notes due 2031. This is a private offering extended to persons reasonably believed to be qualified institutional buyers. everything possible/ According to Unisys, the notes will be issued at par and carry an annual interest rate of 10.625%. The interest is payable semi-annually on January 15 and July 15, starting from January 15, 2026. The offering is anticipated to close on June 27, 2025, subject to customary closing conditions. Unisys intends to use the net proceeds from this offering to finance a cash tender offer and consent solicitation for all of its existing notes worth $485 million. The notes are due November 1, 2027. The proceeds will also cover related premiums, fees, and expenses, while another portion is earmarked to partially fund the company's U.S. pension plan deficit and postretirement liabilities. The remaining funds, if any, will be used for general corporate purposes. Unisys Corporation (NYSE:UIS) is an information technology company that provides digital workplace, cloud, and enterprise computing solutions. It operates through three segments: Digital Workplace Solutions (DWS), Cloud, Applications & Infrastructure (CA&I), and Enterprise Computing Solutions (ECS). Its offerings include IT support services, cloud migration, cybersecurity, and ClearPath Forward. While we acknowledge the potential of UIS as an investment, we believe certain AI stocks offer greater upside potential and carry less downside risk. If you're looking for an extremely undervalued AI stock that also stands to benefit significantly from Trump-era tariffs and the onshoring trend, see our free report on the best short-term AI stock. READ NEXT: Goldman Sachs China Stocks: 10 Stocks to Buy and 10 Undervalued Blue Chip Stocks Analysts Recommend for Smart Investing. Disclosure: None. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data

Is AMD Stock a Buy, Sell, or Hold on Untether AI Acquisition?
Is AMD Stock a Buy, Sell, or Hold on Untether AI Acquisition?

Yahoo

time23-06-2025

  • Business
  • Yahoo

Is AMD Stock a Buy, Sell, or Hold on Untether AI Acquisition?

Over the past decade, Advanced Micro Devices (AMD) has thrived, rewriting its legacy in the fiercely competitive semiconductor arena. The company has evolved from an industry underdog to a headline name in innovation, particularly in artificial intelligence (AI). Adding another feather to its cap, in early June, AMD announced it has brought onboard the team behind Untether AI. These engineers, known for building AI inference chips that outperform rivals in both speed and energy efficiency, will now strengthen AMD's skills in enterprise data centers and edge computing. Robotaxis, Powell and Other Key Things to Watch this Week Make Over a 2.4% One-Month Yield Shorting Nvidia Out-of-the-Money Puts Is Quantum Computing (QUBT) Stock a Buy on This Bold Technological Breakthrough? Stop Missing Market Moves: Get the FREE Barchart Brief – your midday dose of stock movers, trending sectors, and actionable trade ideas, delivered right to your inbox. Sign Up Now! Far more than just a hiring spree, the strategic agreement brings in deep expertise in AI hardware, software, compiler engineering, kernel development, and system-on-chip design, all critical in the fast-moving AI race. The move is no isolated bet. Just weeks ago, AMD acquired silicon photonics firm Enosemi to scale its co-packaging capabilities, and days later, it snapped up open-source software player Brium. So, let us now examine whether the latest move strengthens AMD's position as a compelling investment opportunity. Advanced Micro Devices (AMD), headquartered in Santa Clara, California, holds a market cap of $205.6 billion and leads the charge in high-performance computing. The company delivers a powerful mix of CPUs, GPUs, FPGAs, Adaptive SoCs, and deep software capabilities to build cutting-edge platforms that support cloud infrastructure, edge computing, and end-user systems. Over the past three months, AMD has been on an upward march, posting gains of 22.5%. In just the last five trading days, the stock has leapt another 4.7%, a sharp spike that points to fresh tailwinds lifting the company higher. On May 6, Advanced Micro Devices lifted the curtain on its Q1 2025 earnings, and its performance beat analyst expectations. The chipmaker reported revenue of $7.44 billion, rising 35.9% year over year and exceeding Wall Street's forecast of $7.12 billion. At the heart of this impressive run was the data center segment, which delivered $3.7 billion in revenue, marking a 57% surge from the same period last year. Other divisions joined the rally too. The client and gaming business generated $2.9 billion combined. While the client unit saw a dramatic upswing of 68%, bringing in $2.3 billion, the gaming segment faced continued headwinds, falling 30% to $647 million. Still, the gains elsewhere helped AMD widen its gross margin to 50%, a solid jump from 47% a year ago, aided by a richer product mix and stronger data center sales. Non-GAAP net income climbed 54.6% to reach $1.6 billion, reinforcing the company's strong operational grip. Adjusted EPS came in at $0.96, up 54.8% from the prior year and again beating the Street's projection of $0.93. But despite the bullish results, AMD struck a cautious tone. Management has flagged export restrictions on A.I. chips to China, estimating a $700 million revenue hit this quarter and a total impact of $1.5 billion for the fiscal year. Even so, AMD forecast Q2 revenue at $7.4 billion. While analysts see EPS dipping 30% year over year to $0.35 in Q2, they expect it to rise 20.6% to $3.16 for the full year and jump 54.1% to $4.87 in fiscal 2026. AMD stands firm in the market, demonstrating steady confidence as it secures a 'Moderate Buy' consensus. Out of 42 analysts closely following the stock, 28 give it an enthusiastic 'Strong Buy' rating, one leans toward a 'Moderate Buy,' and 13 adopt a cautious 'Hold' stance. The average price target of $133.32 represents potential upside of 5.6%. Meanwhile, the Street-High target of $200 hints at a 58.7% climb from current levels. On the date of publication, Aanchal Sugandh did not have (either directly or indirectly) positions in any of the securities mentioned in this article. All information and data in this article is solely for informational purposes. This article was originally published on

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