Latest news with #HBM4
Korea Herald
21-05-2025
- Business
- Korea Herald
Nvidia backs SK hynix in AI chip push at Computex
Nvidia CEO Jensen Huang made a surprise visit to SK hynix's booth at Computex 2025, expressing strong support for their partnership on critical AI memory chips at the major trade show, which kicked off Tuesday in Taiwan. At the booth, where SK hynix showcased a sample of its sixth-generation high-bandwidth memory or HBM 4 chip, Huang examined the prototype and remarked, 'So beautiful.' He also left handwritten messages on the displayed samples, including 'JHH LOVES SK HYNIX!' and 'One team!' His remarks are seen as a reaffirmation of the close ties between the two companies. SK hynix's HBM4 sample was exhibited alongside Nvidia's next-generation Blackwell GB200 chip. SK hynix is currently the main supplier of HBM3E, the latest generation HBM chip that plays a critical role in powering Nvidia's advanced AI processors. During the visit, Huang asked Kim Joo-sun, SK hynix president in charge of AI infrastructure, to 'support HBM4 well.' SK hynix was the first in the industry to begin mass production of 8-layer HBM3E in March last year, followed by 12-layer HBM3E in September. In March this year, it became the first to deliver samples of its sixth-generation 12-layer HBM4, giving it an early lead in the race for next-generation HBM market dominance. For SK hynix, Nvidia is a key customer. According to the chipmaker's consolidated earnings report, a single company accounted for an estimated 27.1 percent of SK hynix's first-quarter revenue, roughly 4.79 trillion won ($3.45 billion), which industry officials believe to be Nvidia. HBM technology also took center stage at Computex 2025. In his keynote speech, MediaTek CEO Rick Tsai emphasized the importance of HBM4 and HBM4E, which are expected to enter the market next year. As demand rises for chips with higher performance and lower power consumption, Tsai noted that the increasing complexity in designing and manufacturing HBM presents significant challenges for chipmakers, and stressed that key industry players must collaborate closely to meet those demands.
Korea Herald
20-05-2025
- Business
- Korea Herald
Nvidia CEO Huang makes surprise visit to SK hynix booth at Computex 2025
Nvidia Corp. chief executive officer (CEO) Jensen Huang on Tuesday made a surprise visit to the booth of South Korea's SK hynix Inc. at Computex 2025, a major information technology trade show held in Taiwan. Huang was personally guided through SK hynix's booth by Kim Joo-seon, head of the South Korean chipmaker's artificial intelligence (AI) infrastructure division, at the trade show held in the Taiwanese capital. During the visit, Huang examined a sample of the company's sixth-generation high-bandwidth memory (HBM), the HBM4, and remarked, "So beautiful." SK hynix is a key supplier of high-performance memory to Nvidia, currently providing HBM3E chips used in Nvidia's AI processors. The company has also supplied Nvidia with samples of its upcoming HBM4, which is set to enter mass production in the second half of this year. Earlier in the day, Huang appeared on stage alongside MediaTek CEO Rick Tsai and Foxconn CEO Young Liu for keynote speeches at Computex. Following the session, he visited booths of major partners across the venue as part of efforts to deepen collaboration within Taiwan's tech ecosystem. (Yonhap)
Yahoo
14-05-2025
- Business
- Yahoo
Camtek Ltd (CAMT) Q1 2025 Earnings Call Highlights: Record Revenues and Strategic Product ...
Release Date: May 13, 2025 For the complete transcript of the earnings call, please refer to the full earnings call transcript. Camtek Ltd (NASDAQ:CAMT) reported record Q1 2025 revenues of $119 million, marking a year-over-year increase of over 20%. The company achieved a significant improvement in gross margin, which rose to over 52%, contributing to a record operating income of over $37 million. Camtek Ltd (NASDAQ:CAMT) has a diverse customer base, selling systems to over 35 different customers in the quarter, highlighting the robustness of its business model. The company successfully launched two new models, the Eagle G5 and the Hawk, which have been well received by customers and are expected to account for a significant portion of revenue this year. Camtek Ltd (NASDAQ:CAMT) maintains a strong competitive position in the advanced packaging market, particularly in high-performance computing, supporting AI applications. Geopolitical issues and tariff policies are raising concerns about their potential negative impact on the global economy and demand for electronic components. Despite strong performance, there is uncertainty in the market environment, which could affect future visibility and order dynamics. Financial income for the quarter decreased due to exchange rate differences versus the US dollar. Operating expenses increased to $24.4 million from $20.2 million in the first quarter of last year, partially offsetting the increase in gross profit. The company faces competition from larger players like KLA in the sub-micron defect detection and 3D metrology markets. Warning! GuruFocus has detected 2 Warning Signs with CAMT. Q: Your competitor KLA is entering the sub-micron defect detection market, particularly in HPC applications. Are you concerned about larger competitors like KLA entering your market? A: Rami, Camtek's CEO, responded that Camtek has engaged with KLA multiple times and has demonstrated competitive systems. Camtek's mid-sized company status allows it to meet market demands quickly, and their latest products, the Hawk and Eagle G5, offer competitive advantages. Camtek's scale and flexibility are key reasons customers choose them over larger competitors. Q: With the introduction of HBM4, how do you position your products, Eagle G5 and Hawk, given their different ASP and throughput? Will customers buy new tools or upgrade existing ones? A: Rami explained that customers typically buy new equipment rather than upgrading existing ones. The Hawk offers advantages in performance and footprint, while the Eagle, with its large install base, remains attractive. Camtek's multiple product offerings position them well against competitors. Q: What is the outlook for HPC revenue for the full year, given it accounted for 45-50% of Q1 revenue? A: Rami stated that while it's hard to predict exact figures, HPC is expected to remain a strong segment. The percentage may vary quarterly, but overall, HPC continues to be a growth driver. Q: With a healthy backlog for Q3, how do you view growth into the back half of the year, and what visibility do you have from customers? A: Rami mentioned that Camtek has a solid business outlook for Q3, supported by a strong backlog and pipeline. However, predicting beyond Q3 is challenging, and more information will be available in the coming months. Q: Can you provide an update on your new products and any changes in expectations since three months ago? A: Rami noted that the new products are performing well, meeting or exceeding specifications. Camtek has received more orders, and both the G5 and Hawk are expected to generate significant revenue this year, reflecting customer confidence in their products. For the complete transcript of the earnings call, please refer to the full earnings call transcript. This article first appeared on GuruFocus. Sign in to access your portfolio
CNA
23-04-2025
- Business
- CNA
Besi posts strong bookings as AI drives demand for hybrid bonding tech
BE Semiconductor Industries (Besi), a supplier of advanced packaging tools for chipmakers, said on Wednesday its order bookings grew in the first quarter as Asian subcontractors ordered more AI-related data centre applications. Investors are banking on growing orders for Besi's hybrid bonding solutions, a critical chip technology allowing two chips to be bonded directly on top of each other, and its first-mover advantage amid a surge in demand for AI-enabling technology. "We received hybrid bonding orders from two leading memory (chip) producers for HBM 4 applications as well as follow-on orders from a leading Asian foundry for logic applications," CEO Richard Blickman said in a statement. The Dutch group's quarterly order bookings, an important indicator of future growth, grew 8.2 per cent to 131.9 million euros ($150.1 million) compared to the fourth quarter of 2024. Besi's shares, which had fallen 30 per cent this year as of the last close, were up 9 per cent by 0730 GMT. Analysts from KBC Securities said in a note that Besi's new orders were "very positive", underscoring its long term potential even if there will be some volatility in the short run. Besi's revenue fell 6.1 per cent quarter-on-quarter to 144.1 million euros, weighed down by muted shipments for mobile and automotive applications. It expects the metric to remain at a similar level in the second quarter, with a possible deviation of 5 per cent into either direction. The timing and trajectory of the expected demand upturn is more difficult to predict now given the uncertainties around the escalating trade war, Blickman said. Besi had said in February it expected mainstream assembly markets to start to recover only in the second half of the year, depending on end market trends and the course of the global trade restrictions. "However, demand for advanced packaging for AI applications remains strong given upcoming new device introductions and use cases planned in the 2026-2028 period," Blickman added. Degroof Petercam analysts said the upturn, which they expect to materialise in late 2025 or early 2026, should be stronger for Besi given its lead in hybrid bonding technology. ($1 = 0.8787 euros)
Korea Herald
11-04-2025
- Business
- Korea Herald
SK chief visits Taiwan to bolster ties with TSMC ahead of HBM4 launch
SK Group Chair Chey Tae-won visited Taiwan this week to strengthen partnerships with TSMC and other key players in the semiconductor and IT industries, accompanied by SK hynix CEO Kwak Noh-jung. According to industry sources on Friday, Chey departed for Taiwan on Wednesday and held a closed-door meeting with executives of Taiwan Semiconductor Manufacturing Co. His visit comes ahead of SK hynix's planned mass production of its next-generation AI memory chip, HBM4, which incorporates TSMC's base die. During the trip, Chey also visited several major Taiwanese tech companies, including Asus and Wistron. The SK chief last visited Taiwan in June last year. At that time, he met with TSMC Chair C.C. Wei in Taipei, proposing collaboration to 'lay the foundation for an era of artificial intelligence that benefits humanity.' SK hynix, the memory chip affiliate of SK Group, surpassed larger rival Samsung Electronics in the global DRAM market for the first time during the January–March period this year, becoming the world's top DRAM supplier by revenue. SK hynix accounted for 36 percent of the global DRAM market, ahead of Samsung's 34 percent and Micron Technology's 25 percent, according to market tracker Counterpoint Research. The company's strong performance is largely attributed to its early lead in HBM chips and its key supplier role to Nvidia, the world's top maker of graphics processing units and the largest consumer for high-bandwidth memory. With SK hynix's upcoming HBM4 chips incorporating TSMC's logic base die, its partnership with the Taiwanese contract chipmaker is critical. SK hynix will also participate in a technology symposium hosted by TSMC in Santa Clara, California, where it plans to showcase its latest HBM4 and advanced packaging technologies. The Korean chipmaker also attended last year's event, where it introduced its fifth-generation HBM3E.
