Latest news with #Intel14A
Phone Arena
05-05-2025
- Phone Arena
Your next laptop could get wild – if Intel's new chip can finally beat Apple
Receive the latest mobile news Subscribe By subscribing you agree to our terms and conditions and privacy policy Intel has announced performance metrics for its upcoming 14A silicon process node in San Jose . The Intel Foundry's aim is Apple silicon, and most particularly, Apple's M4 chip. The company is seeing both performance and power efficiency improvements but has yet to launch a chip that competes on both this may change soon. In the fall, Intel is expected to launch its first chips using the 18A process, and in 2027, the company is set to unleash its A14 process which helps it achieve increased power and the 14A silicon process node's performance metrics are looking quite promising, and may bring Intel closer to competing better with Apple's first-party the Intel 14A is a silicon wafer process node operating at 1.4 nanometers for its smallest component. When you have smaller transistors on a wafer, this generally means you can make faster chips. Right now, the current computer hardware is generally constructed using 3nm to 5nm yep, a chip made with a 1.4nm wafer is significantly faster than one made with a 3nm what does this mean in numbers? According to Intel's testing and projections, the 14A process will give 25-35% better power consumption than the upcoming 18A process (which uses a 1.8nm process node).Also, the 14A chips are also likely to experience a 15-20% performance per watt increase over the 18A ones. Intel is also planning to include some new features with the 14A node, like the introduction of turbo cells (this would be a new design approach aiming to provide maximum CPU frequency and boost performance in the GPU).The new process node chips are expected to enter full production in 2027. They could be a game changer for Intel to catch up to Apple and compete with the Cupertino chips. But for now, Intel will have the 18A chips to try to match the M5 this M5 series chips are expected soon. They could come as early as next month, and they are reportedly going to be using a TSMC 3nm process node, similar to the M3 and M4. This fall, Intel will debut its first 18A (1.8nm) chips to answer Apple's challenge, with the Intel's Panther Lake mobile chip is likely going to be known as the Intel Core Ultra 300 series. It is expected to be a successor to Intel's Lunar Lake, at least when it comes to power efficiency and mighty GPU 18A node is said to bring 25% more performance at 36% lower power than the current 3 node. Also, the Intel 18A would be the first silicon wafer process node that supports backside power delivery, which is an industry is a tough nut to crack though. It's excellent when it comes to laptop performance and battery life. The thing is, when Intel's chips beat Apple in performance, they lose in battery life and vice versa, but so far, they haven't been able to cover both super important aspects of a Qualcomm's Snapdragon X Elite is so far the only chipset for Windows machines that can close the gap more to Apple's M series, but... well, it doesn't have proper gaming is expected to move to TSMC's 2nm process node for the M6 chip, which is expected in late Spring 2026, or even later. Well, we also have the 14A by Intel expected in 2027. Things are looking quite hopeful for laptop buyers: you know, after all, there's a clear winner in all these competitions: and it is us, the see what Intel has in store to challenge Apple and its first-party laptop processors.
Yahoo
01-05-2025
- Business
- Yahoo
Intel's 14A chips might finally prove a match for Apple Silicon
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel Foundry is making major strides in 2025, and that could help Intel close the lead on Apple Silicon. While Intel has taken aim at Apple's M4 in both performance and power efficiency, team blue hasn't yet been able to release a chip that competes on both metrics. But that could change soon. This fall, Intel is expected to launch its first chips using the 18A process, codenamed Panther Lake. And in 2027, Intel will unleash its 14A process, which boasts increased power and enhanced efficiency. Intel announced performance metrics for its upcoming 14A silicon process node during the Intel Foundry Direct Connect event in San Jose on Tuesday. But what is Intel 14A, and what does it mean? Intel 14A is a silicon wafer process node that will operate at 1.4 nanometers (nm) for its smallest component (typically based on the width of a transistor). Smaller transistors on a wafer generally means we can make faster chips out of those wafers. The current generation of computer hardware is generally constructed using 3nm to 5nm wafers. So a chip made with a 1.4nm wafer should be significantly faster than a 3nm chip. According to Intel's current testing and projections, the 14A process will be 25-35% better in terms of power consumption over the upcoming 18A (1.8nm) process node that will be used in Panther Lake. Intel is also claiming that 14A chips will see a 15-20% performance per watt increase over 18A. This is due to some of the novel features Intel has packed into the 14A node, including a wider threshold voltage range and the introduction of turbo cells. Expected to hit full production in 2027, Intel's 14A process node chips could be the game changer Intel needs to compete with Apple Silicon "without any compromises." Apple is expected to release its latest silicon, the M5 series, this year, possibly as early as next month. Apple's M5 chips will be using a similar TSMC 3nm process node as the M3 and M4 generations. And Intel is expected to debut its first 18A (1.8nm) chips this fall with the launch of Intel's Panther Lake mobile CPU. Likely hitting the shelves as the Intel Core Ultra 300 series, these chips are expected to be a direct successor to Intel's Lunar Lake, at least as far as power efficiency and a powerful GPU are concerned. According to previous announcements, Intel's 18A node is expected to deliver 25% more performance than the current Intel 3 node, at 36% lower power. Making it more powerful and more efficient than the current Intel 3 chips, used in the Intel Core Ultra 200U series processors (Arrow Lake U). Intel's 18A is the first silicon wafer process node that supports backside power delivery, making it an industry first. All of this should make Panther Lake a solid competitor for Apple's upcoming generation, but exactly how close Intel manages to get on the performance and efficiency metrics remains to be seen. Despite the best efforts of AMD, Intel, and Qualcomm, Apple Silicon remains the benchmark to beat when it comes to laptop performance and battery life. Intel's Lunar Lake chips could close the battery life gap and had shockingly good graphics performance, but these ultra-efficient CPUs fell short in terms of raw computing power. Intel's Arrow Lake H chips provided a direct competitor to Apple's M4 in terms of computing strength, but couldn't quite close the battery life gap. While Intel's most powerful mobile chip this generation, the HX series processors have outperformed the Apple M4, and come close to hitting the same performance as the Apple M4 Pro, they can't compete in terms of battery life. Of course, Arrow Lake HX is pretty much always combined with a discrete GPU, which is part of the efficiency problem. Qualcomm's Snapdragon X Elite is so far the only Windows chipset that can come close to touching Apple's proprietary silicon in terms of performance power and battery efficiency, but suffers compared to other Windows chips due to its smaller app library and lack of proper gaming support. While most people will decide their next laptop purchase based on operating system or manufacturer, you shouldn't need to make any serious compromises by choosing a Windows system over a MacBook. Which is why we still look at Apple as a comparison for Windows systems, and especially for x86 and Windows on Arm chipsets. If Intel (and AMD and Qualcomm) keep pushing against Apple's lead, that can only mean better things for laptop buyers. You'll be getting more power and more efficiency regardless of what silicon you take home. It's entirely possible Intel could overtake Apple in the future, especially with Panther Lake coming in the fall. While Apple is expected to move to TSMC's smaller 2nm process node for the M6 generation, that chip is expected in late Spring 2026 at the absolute earliest. And then there's the 14A 2027 manufacturing timeline, which could clinch the lead for Intel, depending on how well Panther Lake performs later this year. Of course, all of this is speculation. But we are rapidly hurtling into the future where your next laptop will be more powerful than you need. Intel's new CEO Lip-Bu Tan has a retro vision for Intel's future, but is nostalgia the key to success? We're just trying to make computers faster, more power efficient, and AI is the new face of that": Intel's Robert Hallock on the impact of AI and the myth of the "killer app" 6 months later, has Intel finally fixed desktop performance?
Yahoo
01-05-2025
- Business
- Yahoo
Intel's 14A chips might finally prove a match for Apple Silicon
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel Foundry is making major strides in 2025, and that could help Intel close the lead on Apple Silicon. While Intel has taken aim at Apple's M4 in both performance and power efficiency, team blue hasn't yet been able to release a chip that competes on both metrics. But that could change soon. This fall, Intel is expected to launch its first chips using the 18A process, codenamed Panther Lake. And in 2027, Intel will unleash its 14A process, which boasts increased power and enhanced efficiency. Intel announced performance metrics for its upcoming 14A silicon process node during the Intel Foundry Direct Connect event in San Jose on Tuesday. But what is Intel 14A, and what does it mean? Intel 14A is a silicon wafer process node that will operate at 1.4 nanometers (nm) for its smallest component (typically based on the width of a transistor). Smaller transistors on a wafer generally means we can make faster chips out of those wafers. The current generation of computer hardware is generally constructed using 3nm to 5nm wafers. So a chip made with a 1.4nm wafer should be significantly faster than a 3nm chip. According to Intel's current testing and projections, the 14A process will be 25-35% better in terms of power consumption over the upcoming 18A (1.8nm) process node that will be used in Panther Lake. Intel is also claiming that 14A chips will see a 15-20% performance per watt increase over 18A. This is due to some of the novel features Intel has packed into the 14A node, including a wider threshold voltage range and the introduction of turbo cells. Expected to hit full production in 2027, Intel's 14A process node chips could be the game changer Intel needs to compete with Apple Silicon "without any compromises." Apple is expected to release its latest silicon, the M5 series, this year, possibly as early as next month. Apple's M5 chips will be using a similar TSMC 3nm process node as the M3 and M4 generations. And Intel is expected to debut its first 18A (1.8nm) chips this fall with the launch of Intel's Panther Lake mobile CPU. Likely hitting the shelves as the Intel Core Ultra 300 series, these chips are expected to be a direct successor to Intel's Lunar Lake, at least as far as power efficiency and a powerful GPU are concerned. According to previous announcements, Intel's 18A node is expected to deliver 25% more performance than the current Intel 3 node, at 36% lower power. Making it more powerful and more efficient than the current Intel 3 chips, used in the Intel Core Ultra 200U series processors (Arrow Lake U). Intel's 18A is the first silicon wafer process node that supports backside power delivery, making it an industry first. All of this should make Panther Lake a solid competitor for Apple's upcoming generation, but exactly how close Intel manages to get on the performance and efficiency metrics remains to be seen. Despite the best efforts of AMD, Intel, and Qualcomm, Apple Silicon remains the benchmark to beat when it comes to laptop performance and battery life. Intel's Lunar Lake chips could close the battery life gap and had shockingly good graphics performance, but these ultra-efficient CPUs fell short in terms of raw computing power. Intel's Arrow Lake H chips provided a direct competitor to Apple's M4 in terms of computing strength, but couldn't quite close the battery life gap. While Intel's most powerful mobile chip this generation, the HX series processors have outperformed the Apple M4, and come close to hitting the same performance as the Apple M4 Pro, they can't compete in terms of battery life. Of course, Arrow Lake HX is pretty much always combined with a discrete GPU, which is part of the efficiency problem. Qualcomm's Snapdragon X Elite is so far the only Windows chipset that can come close to touching Apple's proprietary silicon in terms of performance power and battery efficiency, but suffers compared to other Windows chips due to its smaller app library and lack of proper gaming support. While most people will decide their next laptop purchase based on operating system or manufacturer, you shouldn't need to make any serious compromises by choosing a Windows system over a MacBook. Which is why we still look at Apple as a comparison for Windows systems, and especially for x86 and Windows on Arm chipsets. If Intel (and AMD and Qualcomm) keep pushing against Apple's lead, that can only mean better things for laptop buyers. You'll be getting more power and more efficiency regardless of what silicon you take home. It's entirely possible Intel could overtake Apple in the future, especially with Panther Lake coming in the fall. While Apple is expected to move to TSMC's smaller 2nm process node for the M6 generation, that chip is expected in late Spring 2026 at the absolute earliest. And then there's the 14A 2027 manufacturing timeline, which could clinch the lead for Intel, depending on how well Panther Lake performs later this year. Of course, all of this is speculation. But we are rapidly hurtling into the future where your next laptop will be more powerful than you need. Intel's new CEO Lip-Bu Tan has a retro vision for Intel's future, but is nostalgia the key to success? We're just trying to make computers faster, more power efficient, and AI is the new face of that": Intel's Robert Hallock on the impact of AI and the myth of the "killer app" 6 months later, has Intel finally fixed desktop performance?
Forbes
30-04-2025
- Business
- Forbes
Key Takeaways From Intel Foundry Direct Connect 2025
Intel CEO Lip-Bu Tan On Stage At Direct Connect. Day one of Intel Foundry's Direct Connect event, which is currently underway in San Jose, California, just wrapped and I wanted to share some thoughts. The day was filled with interesting developments from both Intel itself and its diverse array of ecosystem partners. There was a time when no one in the semiconductor industry could build transistors like Intel, but a series of missteps and changes in strategy spread out over the better part of the last decade shifted that paradigm. Now, Intel is attempting to propel its manufacturing processes back into a leadership position, while simultaneously trying to woo fabless semiconductor customers to manufacture their chips in Intel's fabs. To do that, Intel has to establish more trust in the industry and not only prove the competitiveness of its processes, but also that partners can make the chips with familiar and established workflows, consistently and with high reliability. Just about everything I heard today made me believe Intel is on track to do just that. Intel's Dr. Naga Chandrasekaran Holding A Intel 14A Test Wafer. The day began with a keynote address by newly-minted CEO Lip-Bu Tan. Lip-Bu was refreshingly direct and to the point. He outlined a number of Intel Foundry's challenges, and what moves the company was making to address them and chart a successful course for Intel Foundry's future. What I found most assuring during Lip-Bu's time speaking, however, was the parade of partners he brought out on stage and what they had to say. In today's advance semiconductor market, there is no single entity that can be successful on its own – there are simply too many technologies and packaging innovations at play in modern multi-chiplet devices. To that end, Lip-Bu brought out the CEOs of essentially all of the leading EDA tools providers. Sassine Ghazi, Synopsys CEO, At Intel Foundry Direct Connect. Sassine Ghazi of Synopsys, Cadence's Anirudh Devgan, Mike Ellow of Siemens EDA, and PDF/Solutions' John Kibarian came out in succession and all explained how their tools, IP and/or flows have been optimized for Intel's upcoming 18A process and the work is underway for future nodes, like 18A-P, 14A and its derivatives (among others). This strong commitment from Intel's ecosystem partners should carry a lot of weight; the overwhelming majority of fabless semiconductor players will be familiar with these tools, which should facilitate transitions to Intel Foundry's manufacturing processes. All of the EDA providers also voiced their impressions of Intel 18A, which were universally positive. In fact, the scuttlebutt amongst industry insiders has been mostly positive regarding 18A for quite a while. Multiple conversations I've had with trusted folks from the automotive, mobile, and processor industries have all suggested Intel 18A is a highly competitive process. That said, there weren't any new customer announcements today. I suspect there will be more coming soon, however, once Intel Foundry begins talking more about Intel 18A-P, which is a higher performance derivative of 18A that's better suited to a wider array of applications. 18A is already a competitive process and Intel will be shipping its next-generation Panther Lake-based processors built on 18A in volume later this year, but 18A-P addresses some technical issues that should make it a better fit for a more diverse array of architectures. Cadence President & CEO Anirudh Devgan At Direct Connect. Anyone scrutinizing and paying close attention to Intel and its moves with Intel Foundry needs to understand some fundamental realities related to 18A. In addition to being a leading-edge process, with smaller features, it introduces two innovations – Ribbon FETs and PowerVia backside power delivery. It's hard enough to bring a new manufacturing process to market, let alone one with two new key technologies. And to realize the full capabilities of 18A requires chip designers to make specific considerations from the start. To move an existing design or a design that was already in-flight that was originally slated for an existing process to18A is possible, but it may not benefit from Ribbon FETs and to utilize backside power delivery, can incur additional cost. However, optimizing a design for 18A from the start will offset most of the cost related to backside power delivery by easing density requirements and eliminating the need for some metal layers on the frontside. It will also enable designers to realize the maximum benefits of Ribbon FETs, and optimize power, performance, and area. Of course, chip designs don't happen overnight, so it's going to take some time for Intel Foundry's future customers to navigate these waters and decide if 18A, one of its derivatives, or a future process will be the best fit. Intel 18A Details. As for the processes themselves, Intel made plenty of encouraging claims. 18A has already achieved 95%+ of its targets and the optimization areas have already been identified to tweak the process to hit or exceed 100% of those targets next quarter. Intel 18A should deliver a >15% improvement in performance per watt, with 1.3x improvement in chip density versus Intel 3, with an additional ~8% improvement in perf-per-watt coming with 18A-P, along with support for 3D die stacking. Intel 14A Disclosures. Intel Foundry also disclosed some numbers related to its future 14A process. 14A is looking particularly strong at this early stage; Intel is expecting a 15-20% performance per watt increase versus 18A, with another 1.3x increase in density, and a 25-35% reduction in power. Intel 14A will also make use of High NA EUV and introduce second generation Ribbon FETs and PowerDirect. PowerDirect is an evolution of PowerVia that enables direct contact power delivery. Intel Foundry Process Roadmap There was a lot more disclosed during Intel Foundry Direct Connect, including a number of advancements in packing technology that improve interconnect density and performance, but it's just too much to cram into this report. Suffice it to say, after digesting day one's disclosures, my confidence in Intel's foundry efforts has reached a new high. The innovations, technologies, and tools to enable them appear to be in place. Now it's a matter of bringing in new customers, executing, and getting new products to market. Considering the company's huge investments, and the geopolitical pressures to bring more advanced semiconductor manufacturing back to the U.S., I think Intel Foundry can pull this off.
TECHx
30-04-2025
- Business
- TECHx
Intel Foundry Unveils New Process and Packaging Updates
Home » Tech Value Chain » Global Brands » Intel Foundry Unveils New Process and Packaging Updates Intel Foundry hosted its Direct Connect 2025 event, revealing progress across process technology, advanced packaging, and manufacturing. The company also introduced new ecosystem programs and partnerships that support its systems foundry strategy. CEO Lip-Bu Tan opened the event, highlighting Intel Foundry's commitment to building a world-class systems foundry. He emphasized customer trust and the importance of an engineering-first culture. Other keynote speakers included Naga Chandrasekaran, chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services. Throughout the day, Intel executives were joined by leaders from Synopsys, Cadence, Siemens EDA, PDF Solutions, MediaTek, Microsoft, and Qualcomm. They discussed collaborative efforts to help customers bring innovative products to market. Key Announcements Process Technology Intel Foundry shared early access to its new Intel 14A Process Design Kit (PDK). Multiple customers plan to build test chips on Intel 14A, the successor to Intel 18A. Intel 14A will feature PowerDirect, an enhancement over Intel 18A's PowerVia. Intel 18A is in risk production and will enter volume manufacturing this year. Two variants, Intel 18A-P and 18A-PT, are now in development. Intel 18A-P offers broader performance. Intel 18A-PT uses hybrid bonding with sub-5µm pitch. Intel's first 16nm tape-out is in the fab, with work underway on 12nm nodes in partnership with UMC. Advanced Packaging New offerings include EMIB-T, Foveros-R, and Foveros-B. These technologies enhance 3D stacking and high-bandwidth memory support. Intel is partnering with Amkor to expand packaging flexibility for customers. Manufacturing Intel's Arizona Fab 52 has processed its first 18A wafer. Volume production for 18A will begin in Oregon, with Arizona to follow. Intel 14A and 18A production will remain U.S.-based. Ecosystem Development Intel added new programs to its Foundry Accelerator Alliance. The new Intel Foundry Chiplet Alliance focuses on secure chiplet infrastructure. It aims to support government and commercial applications. The event demonstrated Intel Foundry's growing momentum across multiple fronts. With updates on process nodes, packaging technologies, domestic manufacturing, and ecosystem alliances, Intel continues to position itself as a strong player in the global semiconductor space. Intel Foundry plans to scale these capabilities further to support customers seeking trusted, U.S.-based manufacturing with advanced technology.
