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TECHx
30-04-2025
- Business
- TECHx
Intel Foundry Unveils New Process and Packaging Updates
Home » Tech Value Chain » Global Brands » Intel Foundry Unveils New Process and Packaging Updates Intel Foundry hosted its Direct Connect 2025 event, revealing progress across process technology, advanced packaging, and manufacturing. The company also introduced new ecosystem programs and partnerships that support its systems foundry strategy. CEO Lip-Bu Tan opened the event, highlighting Intel Foundry's commitment to building a world-class systems foundry. He emphasized customer trust and the importance of an engineering-first culture. Other keynote speakers included Naga Chandrasekaran, chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services. Throughout the day, Intel executives were joined by leaders from Synopsys, Cadence, Siemens EDA, PDF Solutions, MediaTek, Microsoft, and Qualcomm. They discussed collaborative efforts to help customers bring innovative products to market. Key Announcements Process Technology Intel Foundry shared early access to its new Intel 14A Process Design Kit (PDK). Multiple customers plan to build test chips on Intel 14A, the successor to Intel 18A. Intel 14A will feature PowerDirect, an enhancement over Intel 18A's PowerVia. Intel 18A is in risk production and will enter volume manufacturing this year. Two variants, Intel 18A-P and 18A-PT, are now in development. Intel 18A-P offers broader performance. Intel 18A-PT uses hybrid bonding with sub-5µm pitch. Intel's first 16nm tape-out is in the fab, with work underway on 12nm nodes in partnership with UMC. Advanced Packaging New offerings include EMIB-T, Foveros-R, and Foveros-B. These technologies enhance 3D stacking and high-bandwidth memory support. Intel is partnering with Amkor to expand packaging flexibility for customers. Manufacturing Intel's Arizona Fab 52 has processed its first 18A wafer. Volume production for 18A will begin in Oregon, with Arizona to follow. Intel 14A and 18A production will remain U.S.-based. Ecosystem Development Intel added new programs to its Foundry Accelerator Alliance. The new Intel Foundry Chiplet Alliance focuses on secure chiplet infrastructure. It aims to support government and commercial applications. The event demonstrated Intel Foundry's growing momentum across multiple fronts. With updates on process nodes, packaging technologies, domestic manufacturing, and ecosystem alliances, Intel continues to position itself as a strong player in the global semiconductor space. Intel Foundry plans to scale these capabilities further to support customers seeking trusted, U.S.-based manufacturing with advanced technology.
Zawya
30-04-2025
- Business
- Zawya
Intel Foundry gathers customers and partners, outlines priorities
UAE — Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company will also announce new ecosystem programs and partnerships, and welcome industry leaders to discuss how a systems foundry approach enables collaboration with partners and unlocks innovation for customers. Intel CEO Lip-Bu Tan will open the event by discussing Intel Foundry's progress and priorities as the company drives the next phase of its foundry strategy. Naga Chandrasekaran, Intel Foundry chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services, will also deliver keynotes during the morning session, sharing process and advanced packaging news while highlighting Intel Foundry's globally diverse manufacturing and supply chain. Tan will be joined on stage by ecosystem partners including Synopsys, Cadence, Siemens EDA and PDF Solutions to highlight collaboration in serving foundry customers. O'Buckley will be joined by executives from MediaTek, Microsoft and Qualcomm. 'Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing,' said Tan. 'Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term.' Event Press Kit: Intel Foundry Direct Connect 2025 Today's announcements encompass core process and advanced packaging technology, a milestone in domestic U.S. manufacturing, and ecosystem support required to earn the trust of foundry customers. They include: Process Technology Intel Foundry has engaged with lead customers on the Intel 14A process technology, the successor to Intel 18A. The company has distributed to lead customers an early version of the Intel 14A Process Design Kit (PDK), and multiple customers have expressed their intent to build test chips on the new process node. Intel 14A will feature PowerDirect direct contact power delivery, building on the PowerVia backside power delivery technology in Intel 18A. Intel 18A is now in risk production and expected to reach volume manufacturing this year. Intel Foundry's ecosystem partners have electronic design automation (EDA) enablement, reference flows and intellectual property (IP) ready for production designs today. The new Intel 18A variant, called Intel 18A-P, is designed to deliver enhanced performance to a broader set of foundry customers. Early wafers based on Intel 18A-P are in the fab now. Because Intel 18A-P will be design rule-compatible with Intel 18A, IP and EDA partners have already started updating their offerings for the variant. Intel 18A-PT is another new variant that builds on Intel 18A-P performance and power efficiency advancements. Intel 18A-PT can be connected to top die using Foveros Direct 3D with hybrid bonding interconnect pitch less than 5 micrometers (µm). Intel Foundry's first production 16 nanometer (nm) tape-out is in the fab now, and the company is engaging with lead customers on a 12nm node and derivatives built in collaboration with UMC. Advanced Packaging Intel Foundry offers system-level integration using Intel 14A on Intel 18A-PT, connected via Foveros Direct (3D stacking) and embedded multi-die interconnect bridging (2.5D bridging). New advanced packaging technology offerings include EMIB-T to enable future high bandwidth memory needs and two new additions to the Foveros architecture: Foveros-R and Foveros-B provide additional efficient and flexible options for customers. A new engagement with Amkor Technology increases customer flexibility in choosing the right advanced packaging technology for their needs. Manufacturing Fab 52 in Arizona has successfully 'run the lot,' marking the first wafer processed through the facility, demonstrating progress in domestic manufacturing of leading-edge Intel 18A wafers. Intel 18A volume production will begin in Intel's Oregon fabs as Arizona manufacturing ramps later this year. Intel 18A and Intel 14A research, development and wafer production will all be U.S.-based. Ecosystem New programs have been added within Intel Foundry's Accelerator Alliance – Intel Foundry Chiplet Alliance and Value Chain Alliance – along with a range of announcements from top ecosystem partners. Delivering Trusted Ecosystem Tools and IP Intel Foundry is supported by a comprehensive portfolio of IP, EDA and design services solutions delivered by trusted, proven ecosystem partners to drive advancements beyond traditional node scaling. As the newest program in Intel Foundry's Accelerator Alliance, the new Intel Foundry Chiplet Alliance will initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets. (Quote Sheet: Introducing the Intel Foundry Chiplet Alliance) The Intel Foundry Accelerator Alliance also includes IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance.
Techday NZ
30-04-2025
- Business
- Techday NZ
Intel reveals chip advances, new partnerships & foundry progress
Intel has released details of advancements in its process technology and packaging roadmap, along with updates on ecosystem partnerships and manufacturing progress at the recent Intel Foundry Direct Connect event. Chief Executive Officer Lip-Bu Tan addressed customers and partners, highlighting the company's foundry strategy and commitment to enabling customer innovation. Tan's keynote was followed by presentations from Naga Chandrasekaran, Chief Technology and Operations Officer, and Kevin O'Buckley, General Manager of Foundry Services, who provided updates on Intel's manufacturing and supply chain operations. During the event, Tan was joined by representatives from ecosystem partners such as Synopsys, Cadence, Siemens EDA and PDF Solutions, who discussed the importance of collaboration in supporting foundry customers. O'Buckley also held discussions with executives from MediaTek, Microsoft and Qualcomm. Tan commented: "Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing. Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term." On process technology, Intel Foundry announced engagement with lead customers on the forthcoming Intel 14A process node, which follows Intel 18A. The early version of the Intel 14A Process Design Kit has been distributed, and several customers intend to create test chips using this node. Intel 14A will introduce PowerDirect direct contact power delivery, progressing from PowerVia technology in Intel 18A. Intel 18A itself has reached risk production with the expectation of entering volume manufacturing later in the year. Key partners within the foundry's electronic design automation ecosystem have made available the enablement, reference flows and intellectual property components required for production designs using Intel 18A. Intel introduced Intel 18A-P, a new variant targeting broader foundry use by enhancing performance. Early wafers relying on Intel 18A-P are reportedly being processed now, and this variant maintains design rule compatibility with Intel 18A. Partner intellectual property and design tool offerings are actively being updated to support Intel 18A-P. Intel also highlighted Intel 18A-PT, which advances performance and power efficiency, and can be integrated using Foveros Direct 3D hybrid bonding with an interconnect pitch below 5 micrometres. The foundry provided further detail on customer engagement with its 16 nanometre production tape-out, with development ongoing for a 12nm node and related products created alongside foundry partner UMC. On the packaging front, Intel Foundry is enabling system-level integration by combining Intel 14A on Intel 18A-PT, with connections achieved through Foveros Direct (3D stacking) and embedded multi-die interconnect bridging. The company introduced EMIB-T technology aimed at high bandwidth memory needs, and expanded the Foveros architecture with two new options: Foveros-R and Foveros-B, to provide additional flexibility and efficiency. Intel's collaboration with Amkor Technology is intended to increase the range of advanced packaging choices available to customers. In manufacturing, Intel announced that its Fab 52 in Arizona has successfully processed its first lot of wafers, considered a milestone for domestic Intel 18A wafer manufacturing. Oregon facilities will lead volume production as the Arizona fab increases output. Intel outlined that research, development and wafer production for Intel 18A and Intel 14A will remain within the United States. The foundry detailed updates to its ecosystem strategy, noting the expansion of the Intel Foundry Accelerator Alliance to include the new Intel Foundry Chiplet Alliance and Value Chain Alliance. According to Intel, the Chiplet Alliance will "initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets." The Accelerator Alliance program also encompasses the IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance, intended to provide a comprehensive suite of intellectual property, design automation and design service solutions through ecosystem partnerships. Intel's announcements were made alongside guidance regarding forward-looking statements. The company outlined risks related to industry competition, research and development investment, technology commercialisation, market demand, global supply chain challenges, and macroeconomic factors. The risk statement further referenced supply chain instability, potential product issues, security considerations and shifts in global trade policy as factors that could influence outcomes compared with those anticipated in strategic planning.
Forbes
29-04-2025
- Business
- Forbes
EDA Vendors Help Intel Get The USA Back Into Chip Manufacturing
The US Semiconductor industry desperately needs to rebuild the country's ability to produce the advanced chips that are the cornerstone of AI and every electronic device you can imagine. Most of those chips are built today in Taiwan by TSMC. Merely the thought of any potential Chinese aggression in Taiwan sends shivers down the spines of industry, market, and government officials, and an outright attack would put the worldwide economy in a tailspin. Intel is the primary (only) hope for revitalizing advanced domestic manufacturing in the USA, and the entire industry is anxiously awaiting adoption of Intel '18A' fabrication capability and solid proof of its performance. Today, during the Intel Foundry Direct Connect 2025 event in San Jose, Calif., all three EDA vendors (Cadence, Synopsys, and Siemens) announced collaborations with Intel Foundry to accelerate the development of optimized chip designs on the Intel 18A and Intel 18A-P advanced process nodes as well as packaging technology. (Cadence, Intel and Synopsys are all clients of Cambrian-AI Research.) The three primary global EDA companies announced the availability of production-ready AI-driven design flows for the Intel 18A process node. In addition, all three vendors are preparing for the next step from Intel, engaging in early design technology co-optimization for Intel 14A-E to establish readiness for the next-generation advanced node. Intel CEO Lip-Bu Tan welcomes Synopsys CEO Sassine Ghazi to the stage at the Intel Foundry Direct ... More Connect event. Of course, Intel welcomes investment and collaboration from its EDA partners. "Our continued collaboration with Synopsys enables engineering teams to accelerate 'systems of chips' innovation utilizing our unique systems foundry capabilities and optimized Synopsys EDA flows and IP on Intel 18A and Intel 18A-P process nodes to create differentiated designs with faster time-to-results," said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. "Together, Intel Foundry and Synopsys are furthering design, manufacturing, and packaging co-optimization so our customers can meet the demands of the AI era." Mr. Lee expressed similar optimism and appreciation for Cadence and Siemens, whose CEOs each (in turn) took the stage with the new Intel CEO. Each vendor said they have certified design flows for 18A, and all three support the new RibbonFET gate-all-around transistor architecture and backside power delivery. All three joined the Intel Foundry Accelerator Chiplet Alliance – the newest Accelerator Alliance program that aims to define and drive chiplet design infrastructure, interoperability, and security requirements. All three enable Intel's EMIB-T advanced packaging technology and provide IP to accelerate the time to market for things like I/O and memory controllers. "Cadence is at the forefront of facilitating next-generation AI, HPC, and mobility designs with Intel 18A and 18A-P technologies, and our collaboration ensures that our mutual customers can leverage our robust design IP and AI-driven digital and analog/custom solutions for unparalleled performance and efficiency," said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. "Our expanded design IP portfolio for Intel Foundry builds on our commitment to delivering best-in-class silicon solutions, and our advanced implementations of leading standards are key to achieving scalable, high-performance designs. We look forward to continuing to partner with Intel Foundry to build out IP solutions for the AI factories and compute platform needs of the future and today." What this means for Intel The unison of AI-driven EDA support for Intel 18A tells the chip development community that they can depend on their chosen EDA vendor(s) (most use a combination of tools) to help them select Intel if and when they are ready to try 18A out and build their chips with a domestic manufacturing partner. Now, there's nothing stopping designers from considering Intel. It will take time to see this play out in the industry, but as 18A gets more design wins, Intel will earn the right to get even more.
Business Wire
29-04-2025
- Business
- Business Wire
Intel Foundry Gathers Customers and Partners, Outlines Priorities
SAN JOSE, Calif.--(BUSINESS WIRE)--Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company will also announce new ecosystem programs and partnerships, and welcome industry leaders to discuss how a systems foundry approach enables collaboration with partners and unlocks innovation for customers. Intel CEO Lip-Bu Tan will open the event by discussing Intel Foundry's progress and priorities as the company drives the next phase of its foundry strategy. Naga Chandrasekaran, Intel Foundry chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services, will also deliver keynotes during the morning session, sharing process and advanced packaging news while highlighting Intel Foundry's globally diverse manufacturing and supply chain. Tan will be joined on stage by ecosystem partners including Synopsys, Cadence, Siemens EDA and PDF Solutions to highlight collaboration in serving foundry customers. O'Buckley will be joined by executives from MediaTek, Microsoft and Qualcomm. 'Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing,' said Tan. 'Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term.' Event Press Kit: Intel Foundry Direct Connect 2025 Today's announcements encompass core process and advanced packaging technology, a milestone in domestic U.S. manufacturing, and ecosystem support required to earn the trust of foundry customers. They include: Process Technology Intel Foundry has engaged with lead customers on the Intel 14A process technology, the successor to Intel 18A. The company has distributed to lead customers an early version of the Intel 14A Process Design Kit (PDK), and multiple customers have expressed their intent to build test chips on the new process node. Intel 14A will feature PowerDirect direct contact power delivery, building on the PowerVia backside power delivery technology in Intel 18A. Intel 18A is now in risk production and expected to reach volume manufacturing this year. Intel Foundry's ecosystem partners have electronic design automation (EDA) enablement, reference flows and intellectual property (IP) ready for production designs today. The new Intel 18A variant, called Intel 18A-P, is designed to deliver enhanced performance to a broader set of foundry customers. Early wafers based on Intel 18A-P are in the fab now. Because Intel 18A-P will be design rule-compatible with Intel 18A, IP and EDA partners have already started updating their offerings for the variant. Intel 18A-PT is another new variant that builds on Intel 18A-P performance and power efficiency advancements. Intel 18A-PT can be connected to top die using Foveros Direct 3D with hybrid bonding interconnect pitch less than 5 micrometers (µm). Intel Foundry's first production 16 nanometer (nm) tape-out is in the fab now, and the company is engaging with lead customers on a 12nm node and derivatives built in collaboration with UMC. Learn more about Intel Foundry process technology. Advanced Packaging Intel Foundry offers system-level integration using Intel 14A on Intel 18A-PT, connected via Foveros Direct (3D stacking) and embedded multi-die interconnect bridging (2.5D bridging). New advanced packaging technology offerings include EMIB-T to enable future high bandwidth memory needs and two new additions to the Foveros architecture: Foveros-R and Foveros-B provide additional efficient and flexible options for customers. A new engagement with Amkor Technology increases customer flexibility in choosing the right advanced packaging technology for their needs. Learn more about Intel Foundry advanced packaging and test technology. Manufacturing Fab 52 in Arizona has successfully 'run the lot,' marking the first wafer processed through the facility, demonstrating progress in domestic manufacturing of leading-edge Intel 18A wafers. Intel 18A volume production will begin in Intel's Oregon fabs as Arizona manufacturing ramps later this year. Intel 18A and Intel 14A research, development and wafer production will all be U.S.-based. Learn more about Intel Foundry manufacturing capabilities. Ecosystem New programs have been added within Intel Foundry's Accelerator Alliance – Intel Foundry Chiplet Alliance and Value Chain Alliance – along with a range of announcements from top ecosystem partners. Learn more about Intel Foundry ecosystem alliances. Delivering Trusted Ecosystem Tools and IP Intel Foundry is supported by a comprehensive portfolio of IP, EDA and design services solutions delivered by trusted, proven ecosystem partners to drive advancements beyond traditional node scaling. As the newest program in Intel Foundry's Accelerator Alliance, the new Intel Foundry Chiplet Alliance will initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets. The Intel Foundry Accelerator Alliance also includes IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance. Forward-Looking Statements This release contains forward-looking statements that involve a number of risks and uncertainties, including with respect to our business plans and strategy and anticipated benefits therefrom, our fabrication process technology roadmap, our advanced packaging roadmap, our manufacturing facilities, and our ecosystem alliances, tools and IP. Such statements involve many risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including those associated with: the high level of competition and rapid technological change in our industry; the significant long-term and inherently risky investments we are making in R&D and manufacturing facilities that may not realize a favorable return; the complexities and uncertainties in developing and implementing new semiconductor products and manufacturing process technologies; our ability to time and scale our capital investments appropriately and successfully secure favorable alternative financing arrangements and government grants; implementing new business strategies and investing in new businesses and technologies; changes in demand for our products; macroeconomic conditions and geopolitical tensions and conflicts, including geopolitical and trade tensions between the U.S. and China, the impacts of Russia's war on Ukraine, tensions and conflict affecting Israel and the Middle East, and rising tensions between mainland China and Taiwan; the evolving market for products with AI capabilities; our complex global supply chain, including from disruptions, delays, trade tensions and conflicts, or shortages; recently elevated geopolitical tensions, volatility and uncertainty with respect to international trade policies, including tariffs and export controls, impacting our business, the markets in which we compete and the world economy; product defects, errata and other product issues, particularly as we develop next-generation products and implement next-generation manufacturing process technologies; potential security vulnerabilities in our products; increasing and evolving cybersecurity threats and privacy risks; IP risks including related litigation and regulatory proceedings; the need to attract, retain and motivate key talent; strategic transactions and investments; sales-related risks, including customer concentration and the use of distributors and other third parties; our significantly reduced return of capital in recent years; our debt obligations and our ability to access sources of capital; complex and evolving laws and regulations across many jurisdictions; fluctuations in currency exchange rates; changes in our effective tax rate; catastrophic events; environmental, health, safety and product regulations; our initiatives and new legal requirements with respect to corporate responsibility matters; and other risks and uncertainties described in this release, our 2024 Form 10-K, our Q1 2025 Form 10-Q, and our other filings with the SEC. Given these risks and uncertainties, readers are cautioned not to place undue reliance on such forward-looking statements. Readers are urged to carefully review and consider the various disclosures made in this release and in other documents we file from time to time with the SEC that disclose risks and uncertainties that may affect our business. Unless specifically indicated otherwise, the forward-looking statements in this release do not reflect the potential impact of any divestitures, mergers, acquisitions, or other business combinations that have not been completed as of the date of this filing. In addition, the forward-looking statements in this release are based on management's expectations as of the date of this release, unless an earlier date is specified, including expectations based on third-party information and projections that management believes to be reputable. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law. About Intel Foundry Intel Foundry is a full-service systems foundry dedicated to delivering leading-edge silicon process and advanced packaging technology. We provide an unparalleled blend of industry-leading technology with a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. For further information, visit About Intel Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore's Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers' greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel's innovations, go to and © Intel Corporation. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.
