Latest news with #IntelFoundry
The Independent
21-05-2025
- Business
- The Independent
Intel Foundry: A resilient, sustainable, secure technology supply chain
Intel Foundry is a Business Reporter client We depend on artificial intelligence (AI) and other complex computing tasks to help us in our daily lives. However, these applications place ever-increasing workload stress on the data centres and high-performance computing (HPC) systems supporting them. That means we need to keep building more—and bigger—data centres. Plus, each one will need faster and more powerful semiconductors. Complex workloads such as AI require more than just computing chips (CPUs). Graphical processors (known as GPUs), plus networking and other specialised chips all factor into the equation. Therefore, if the supply of semiconductors in any of these categories runs short, we face a big problem. Resilient, unified supply chains are vital for modern businesses. During COVID we witnessed the harm fragile supply networks create for manufacturers. Car production, for example, slowed dramatically when needed materials dwindled. As this scenario illustrates, weak supply chains can have far-reaching repercussions. Shortages of vital materials make it impossible for manufacturers and suppliers to keep up with customer demand. Should the impact of this problem snowball across multiple business sectors, it could slow the worldwide economy. According to Gartner®, managing supply chain disruptions includes risk management (source of disruption), uncertainty management (uncertainty of disruption), agility management (capacity to cope with disruption) and responsiveness management (speed to cope with disruption). In short, we believe businesses that adopt a secure, holistic, end-to-end approach for their supply chain are much less vulnerable to unexpected changes. Unified supply chains are resilient enough to withstand disruptions while maintaining the flexibility to adapt to an evolving marketplace. Intel recognizes the importance of prioritizing security in its products, our customer's products and our manufacturing processes. Securing the supply chain is also critical. Factors such as geopolitical tensions, trade disputes and pandemics can disrupt semiconductor supply lines. Intel has fabrication facilities in North America, Europe, Asia and the Middle East. By operating in multiple geographic regions, Intel fabs can maintain production even if a region faces unexpected challenges. Intel works closely with a network of worldwide suppliers and stakeholders to build diverse, sustainable and responsible global pipelines. That robust supply network allows Intel to build the technologies that empower its customers to develop better products. Chipping away at the challenge Some estimates say we will need 60 times improvement in computing performance over the next decade to keep pace with ever-larger computing tasks. However, today's chip manufacturing techniques cannot maintain that rapid pace without new approaches and innovations. Intel Foundry, the world's first systems foundry for the AI era, is a vital piece of that plan. One way to address these challenges is the introduction of 'chiplet' technology. Chiplets are small-scale processors created for different tasks. By utilising chiplets, Intel can help customers design solutions to handle specialised workloads. Intel Foundry also embraces advanced packaging technologies and leadership in creating industry standards. For example, the Universal Chiplet Interconnect Express (UCIe)—a standard Intel Foundry helped establish—allows Intel to mix and match chiplets that help customers tackle increasingly complex computing tasks. Other breakthrough innovations include Intel Foundry's Embedded Multi-die Interconnect Bridge (EMIB) technology that can integrate multiple chiplets into a single package through silicon bridges in the substrate. Foveros technology complements EMIB by stacking chiplets atop each other to improve processor density, speed, and energy efficiency. Another Intel Foundry advancement, Foveros Direct 3D, takes processor design a step further. It employs a hybrid bonding approach for chiplets that fuses copper bumps, less than ten microns each, rather than using traditional soldered connections. Intel Foundry—a multi-faceted approach Intel Foundry builds upon Intel's decades of experience, advanced intellectual property (IP) and production methods. The approach will speed up innovation, deliver advanced technologies and package new systems. Intel Foundry 18A process technology embraces a sub-two nanometre (2nm) architecture for its chips making room for processor improvements that generate significant performance gains. To put that size in perspective, a single sheet of paper is around 100,000 nanometres thick! Intel Foundry facilities around the world are accessible to ecosystem partners and customers who want to design and assemble their own chips. Intel Foundry offers them the foundational IP, tools and system technology optimisation to bring new semiconductors to life more rapidly. Plus, operation in four global regions make Intel Foundry more accessible with a more secure supply chain. Intel Foundry is committed to green manufacturing processes, using 99% renewable energy in 2023. Intel also restored more water than it had used in manufacturing to nearby communities that year. By 2030, Intel's manufacturing processes will eliminate its landfill waste generation. Intel takes a standards-based and open approach to its products so partners and customers can quickly develop applications using the applications of their choice. Intel also contributes to multiple organisations that adopt best practices for security. Looking ahead While no one can predict the future, it's clear we'll need faster and more powerful computing systems in the years ahead. As a leader in US-based semiconductor manufacturing, Intel remains committed to innovating through Intel Foundry's advanced manufacturing processes and strengthening the supply chain to best serve customers. Bob Brennan, Intel Vice President of Foundry Services and General Manager of Customer Solutions Engineering, sees a bright future ahead. 'There are only a handful of companies in the world that have the scope and scale to make a difference in the world. AI is going to change the way we work and live…We're at the beginning of an inflection point and it's very exciting to be at the forefront.' Intel has, for decades, pioneered research and development of the most advanced technologies and has deployed those at scale, securely through its manufacturing facilities and global network of resilient supply chain. Intel Foundry remains committed to advance next generations of innovation and to strengthen supply chain that meet the evolving needs of our customers and industry.
Yahoo
21-05-2025
- Business
- Yahoo
Intel CFO: Division responsible for Ohio plant remains on track; layoffs have dual purpose
NEW ALBANY, Ohio (WCMH) — Intel's chief financial officer clarified updates for the division behind Ohio's Intel plant this month, including impending layoffs. Dave Zinsner, executive vice president and CFO of Intel, spoke at a Global Technology, Media and Communications Conference on May 13. In his discussion, he addressed changes under new CEO Lip-Bu Tan and the future of Intel Foundry, the division responsible for the $28 billion Ohio One plant. See previous coverage of Intel's Ohio plant in the video player above. $250M facility opens down the road from Intel in New Albany, creating 225 jobs 'While it's not to where we were driving, when you look back, it's actually a fair amount of progress that we have made,' Zinsner said. Once the face of American semiconductor manufacturing, Intel announced its New Albany project in 2022, preparing to build two chip factories across 1,000 acres in Licking County in the largest private investment in Ohio history. Those plants were originally scheduled to be up and running this year, but financial turmoil contributed to a delay into the early 2030s. When Tan stepped into the role of CEO in March, it was unclear where he would take Ohio One and rumors of a buyout persisted. Ohio's plant is still far from central to Tan's public plans, but Zinsner said he is committed to the Foundry business. Despite initial concerns that Tan could abandon the Ohio plant or Intel Foundry entirely, Zinsner said Tan isn't thinking about massive changes. Instead, Tan is focused on streamlining internal operations and addressing customer needs. 'We have lost talent at the company and we do need to rebuild that and the great thing about Lip-Bu is that he's a magnet for talent,' Zinsner said. Zinsner said he believes Tan's biggest concern is a lack of execution, he said he will 'flatten' the organization, which he has already done at the executive level. Tan has far more engineers and leaders reporting directly to him, and he hopes decision-making will be easier with less bureaucracy. Teen on the mend after tree falls into house during storm Part of this streamlining process involves significant layoffs, with Bloomberg reporting 20% cuts across the board and Tan confirming a mass firing will happen by the end of July. Although layoffs help with finances, Zinsner said cuts had less to do with cost reductions and more to do with restructuring and becoming more nimble. 'What he (Tan) wants is the lowest level of the organization to be closer to him so that he's hearing the good, the bad, the ugly of what's going on,' Zinsner said. Zinsner, who served as co-interim CEO before Tan was selected, said the Foundry business behind Ohio's plant was in good shape. He said he was 'highly confident' that Foundry will break even in 2027, positive news for Ohio's expensive plant. Zinsner said many of the problems Intel Foundry faces stem from the makeup of the company. As a Foundry business, Intel wants to develop and manufacture semiconductors for external companies, many of whom compete directly with Intel's other half, Intel Products. Zinsner said that can make it difficult to earn trust as a Foundry. Investigation alleges Kroger overcharges customers on for sale items 'What we have to do is make sure they feel confident that IP is getting protected, but maybe more important that supply is getting protected, that we aren't going to disadvantage their products in terms of supply,' Zinsner said. Tan has a plan for that, too. Zinsner said Tan spends much of his time meeting with customers to hear what they need and earn trust. He recalled Tan had 22 meetings on a weekend once, trying to gather insight from customers. Zinsner did not address the Ohio plant directly, and he also did not address any other developing manufacturing hubs. Construction continues at the Ohio One plant. Copyright 2025 Nexstar Media, Inc. All rights reserved. This material may not be published, broadcast, rewritten, or redistributed.
Yahoo
19-05-2025
- Business
- Yahoo
AEM Expands Access to Production-Proven SLT and Burn-In Ecosystem for Advanced Computing Customers
Collaboration with Intel Foundry opens access to a proven SLT and Burn-In test ecosystem and test engineering, accelerating time-to-market for fabless customers SINGAPORE, May 20, 2025 (GLOBE NEWSWIRE) -- AEM Holdings Ltd. (SGX: AWX, Reuters: Bloomberg: AEM:SP) today announced it is working with Intel Foundry to expand access to their established System-Level Test (SLT) and Burn-In capabilities, tailored for advanced computing devices, to Intel Foundry's customer base. Built on decades of collaboration, AEM and Intel Foundry have developed one of the most extensive and mature SLT and Burn-In ecosystems. As chips grow in complexity, particularly in high-performance computing (HPC) and artificial intelligence (AI) applications, the need for Burn-In and SLT test solutions has become more critical than ever, to ensure test coverage while reducing the total cost of test. Conducted after the advanced package assembly process, Burn-in and SLT tests ensure chips meet reliability and performance standards in real-world environments — a crucial step to reduce field failures and improve product quality. The partnership between AEM and Intel Foundry offers a proven solution and strategic roadmap, delivering precise thermal control and validation capabilities for next-generation devices, with specifications including power exceeding 2,000 watts and support for package sizes surpassing 200mm x 200mm. Through this collaboration, AEM brings device-specific configurable test units, advanced handlers and consumables, PiXL™ Active Thermal Control (ATC), along with software and application support for customer native boards — delivering a fully integrated approach to SLT and Burn-In enablement. This complements Intel Foundry's comprehensive suite of services, including factory automation, adaptive test data management, turnkey Burn-In Board (BIB) solutions, test program development, customer board integration, and full product debug and execution support. Key customer benefits include: Faster Time-to-Market: Built on a scalable, production-proven platform used across high-volume fabs. Supported by AEM and Intel Foundry global engineers on hardware integration, test consumable designs, software development, and test application engineers. Lower Capital Expenditure: Minimal new infrastructure required, leveraging an established install base of thousands of systems worldwide. U.S.-based Engineering and Production Ecosystem: Local teams from both companies enable rapid deployment and support standards-based qualification, including High Temperature Operating Life (HTOL). "With chiplet-based architectures redefining integration and performance expectations, our open SLT and Burn-In ecosystem—developed with AEM—provides semiconductor manufacturers with a fast, scalable path to high-quality production. This collaboration enhances test coverage, accelerates time-to-market, and ensures the reliability required for AI and HPC applications," said Mark Gardner, Vice President, Intel Foundry Services, Package and Test Business Group. 'As performance demands rise and chiplet integration becomes the new norm, manufacturers need more than just tools—they need a proven ecosystem. Together with Intel Foundry, we're enabling customers to reduce capital costs, accelerate qualification, and benefit from deep engineering collaboration that drives product success,' said Amy Leong, CEO of AEM Holdings Ltd. About AEM Holdings Ltd. AEM is a global leader in test innovation. We provide the most comprehensive semiconductor and electronics test solutions based on the best-in-class technologies, processes, and customer support. AEM has a global presence across Asia, Europe, and the United States. With manufacturing plants located in Singapore, Malaysia (Penang), Indonesia (Batam), Vietnam, and Finland (Lieto), South Korea, and the United States (Tempe) and a global network of engineering support, sales offices, associates, and distributors, we offer our customers a robust and resilient ecosystem of test innovation and support. AEM Holdings Ltd. is listed on the main board of the Singapore Exchange (SGX: AWX, Reuters: Bloomberg: AEM:SP). AEM's head office is in Singapore. Safe Harbour StatementThis document contains forward-looking statements, including but not limited to, statements regarding AEM Holdings Ltd.'s collaboration with Intel Foundry, the capabilities and benefits of the System-Level Test (SLT) and Burn-In ecosystem, and expected outcomes for customers. These forward-looking statements are based on current expectations, projections, and assumptions about future events and are subject to risks, uncertainties, and other factors that may cause actual results to differ materially from those expressed or implied in such statements. Factors that could cause actual outcomes to differ materially include, but are not limited to, changes in market conditions, technological advancements, competitive pressures, and regulatory changes. AEM Holdings Ltd. undertakes no obligation to update or revise any forward-looking statements, whether as a result of new information, future events, or otherwise, except as required by law. Media Contacts AEM Holdings Ltd. Name: Lisa Schwartz, Director of Marketing Email Office Phone 1.480.566.6605
Yahoo
16-05-2025
- Business
- Yahoo
Intel says foundry business won't break even until 14A in 2027
When you buy through links on our articles, Future and its syndication partners may earn a commission. Currently, Intel's Foundry division loses billions every quarter as it invests heavily in new process technologies and production capacity. However, the company hopes that the Intel Foundry unit will break even sometime in 2027, which will coincide with the rollout out Intel's 14A manufacturing technology and production start on 18A-P node. Intel this week reaffirmed that the first product made on its 18A (1.8nm-class) fabrication process, the client PC processor (codenamed Panther Lake), will hit the market late this year and will ramp next year. The manufacturing technology will also be adopted for Xeon 'Clearwater Forest' and some third-party products, but from Intel's Foundry business perspective, 18A is will be a proof-of-concept for external clients. If this production node is a success, more potential customers will adopt its successors, including 18A-P, and 14A (1.4nm-class). "I think we do need to see more external volume come from 14A versus versus 18A, said David Zinsner, chief financial officer of Intel, at the J.P. Morgan Global Technology, Media and Communications Conference. "We have […] a bunch of bunch of potential customers, and then we get test chips, and then some customers fall out in the test chips, and then there is a certain amount of customers that kind of hang in there. So, committed volume is not significant right now, for sure. But, you know, I think we have got to partly prove ourselves a little bit with our own product and eat our own dog food here, and then […] we start to see some engagement around customers." Zinsner admitted that if the company choses to use High-NA EUV lithography with its 14A process technology — as it plans to at the moment — its costs will go up initially. Intel hopes that advantages enabled by the new fab tools will outweigh those higher costs. Like other contract chipmakers, Intel does not comment on its clients. The company also intends to produce more of its own silicon in house with its Panther Lake and Nova Lake CPUs, which will improve Intel's margins and its utilization of production capacities. As a result, Intel hopes that its Foundry unit will break even in 2027 and will be profitable from then on. "We still feel on track to to hit breakeven sometime in 2027," Zinsner said. "You know, I think when we committed to it in 2024, we said, 'it is going to be somewhere between 2024 and 2030, most people kind of settled in that that must mean 2027, and that is generally kind of what we are thinking is we can be breakeven." To break even, Intel Foundry only needs low- to mid-single-digit billions in annual external revenue, according to Zinsner. Most of 18A's volume will come from Intel's internal products, while 14A will require more external adoption. Intel's breakeven strategy also includes revenue from advanced packaging, mature nodes (like Intel 16), and partnerships with UMC and Tower. The company will continues to follow its 'smart capital' model, balancing internal and external wafer sourcing, and expects Foundry to compete for internal product demand to ensure efficiency and cost Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
Yahoo
16-05-2025
- Business
- Yahoo
Intel says foundry business won't break even until 14A in 2027
When you buy through links on our articles, Future and its syndication partners may earn a commission. Currently, Intel's Foundry division loses billions every quarter as it invests heavily in new process technologies and production capacity. However, the company hopes that the Intel Foundry unit will break even sometime in 2027, which will coincide with the rollout out Intel's 14A manufacturing technology and production start on 18A-P node. Intel this week reaffirmed that the first product made on its 18A (1.8nm-class) fabrication process, the client PC processor (codenamed Panther Lake), will hit the market late this year and will ramp next year. The manufacturing technology will also be adopted for Xeon 'Clearwater Forest' and some third-party products, but from Intel's Foundry business perspective, 18A is will be a proof-of-concept for external clients. If this production node is a success, more potential customers will adopt its successors, including 18A-P, and 14A (1.4nm-class). "I think we do need to see more external volume come from 14A versus versus 18A, said David Zinsner, chief financial officer of Intel, at the J.P. Morgan Global Technology, Media and Communications Conference. "We have […] a bunch of bunch of potential customers, and then we get test chips, and then some customers fall out in the test chips, and then there is a certain amount of customers that kind of hang in there. So, committed volume is not significant right now, for sure. But, you know, I think we have got to partly prove ourselves a little bit with our own product and eat our own dog food here, and then […] we start to see some engagement around customers." Zinsner admitted that if the company choses to use High-NA EUV lithography with its 14A process technology — as it plans to at the moment — its costs will go up initially. Intel hopes that advantages enabled by the new fab tools will outweigh those higher costs. Like other contract chipmakers, Intel does not comment on its clients. The company also intends to produce more of its own silicon in house with its Panther Lake and Nova Lake CPUs, which will improve Intel's margins and its utilization of production capacities. As a result, Intel hopes that its Foundry unit will break even in 2027 and will be profitable from then on. "We still feel on track to to hit breakeven sometime in 2027," Zinsner said. "You know, I think when we committed to it in 2024, we said, 'it is going to be somewhere between 2024 and 2030, most people kind of settled in that that must mean 2027, and that is generally kind of what we are thinking is we can be breakeven." To break even, Intel Foundry only needs low- to mid-single-digit billions in annual external revenue, according to Zinsner. Most of 18A's volume will come from Intel's internal products, while 14A will require more external adoption. Intel's breakeven strategy also includes revenue from advanced packaging, mature nodes (like Intel 16), and partnerships with UMC and Tower. The company will continues to follow its 'smart capital' model, balancing internal and external wafer sourcing, and expects Foundry to compete for internal product demand to ensure efficiency and cost Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
