Latest news with #MIPI
Yahoo
4 days ago
- Business
- Yahoo
MIPI Alliance Recognizes Members for Contributions and Leadership at 12th Annual Awards Ceremony
Seven receive recognition for their dedication to advancing MIPI specifications for mobile, automotive, camera, audio and flash storage applications BRIDGEWATER, N.J., July 02, 2025--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the 2024 MIPI Alliance Membership Award recipients, who were recognized at last week's 12th annual awards ceremony held in conjunction with MIPI Member Meeting #69 in Warsaw, Poland. "The annual membership awards program highlights our greatest strengths as an alliance—our members' technical leadership and dedication to creating innovative, unparalleled interface solutions for the industries we serve," said Hezi Saar, MIPI Alliance chair. "The 2024 honorees' exceptional achievements and industry knowledge have significantly contributed to MIPI's development of market-driven specifications and features. We extend our gratitude to all members for their continued contributions." The Awards Recognition Committee (ARComm), appointed by the MIPI Board of Directors, reviews the nominations submitted by MIPI members and recommends recipients to the board, which approves the final honorees. Seven award recipients in five categories were recognized during the recent ceremony. The Lifetime Achievement Award is presented to individuals who have at least seven years of service to MIPI Alliance and who have provided noteworthy contributions or leadership to a working group, the board of directors or another MIPI area. Niel Warren of Google LLC was recognized for his leadership as chair of the MIPI Audio Working Group and dedication to driving the industry-leading MIPI SoundWire and forthcoming MIPI SoundWire I3S (SWI3S) specifications. Warren brings not only his technical audio and industry expertise to the group, but he has also been instrumental in soliciting member input and facilitating collaboration. The Working Group Leadership Award is presented to leaders within MIPI working groups in recognition of their noteworthy contributions to the groups' activities or specification development. Ruben Sousa of Synopsys, Inc. was recognized for his substantial work on behalf of the MIPI M-PHY Working Group, including presenting a comprehensive MIPI M-PHY Gear 6 feasibility study and sharing an ADS test bench to ensure the robustness of the upcoming v6.0 specification. Two members received the Distinguished Service Award, which recognizes distinguished service based on momentous contributions to the MIPI specification development process or in the areas of the board, marketing or test. Ariel Lasry of Qualcomm Incorporated was honored for his significant contributions to the forthcoming MIPI UniPro v3.0. His leadership and collaboration helped ensure the specification includes key features to align with industry requirements for deployment in a JEDEC Universal Flash Storage update that will enhance implementation of AI in mobile. Haran Thanigasalam, MIPI camera and imaging consultant, was recognized for his dedicated work to ensure that MIPI CSI-2 continues to evolve to meet future-focused market needs in camera and imaging applications. Thanigasalam is credited with successfully managing the diverse technical activities and member inputs of the MIPI Camera Interest Group and the MIPI Camera Working Group, and has brought in new industry voices to participate in group activities. The Special Achievement Award is presented to individuals who have taken a lead role in the MIPI Alliance and who have actively and consistently performed and contributed toward MIPI objectives. Adi Menachem of Qualcomm Incorporated was recognized for her significant contributions to the forthcoming v1.0 of the MIPI CSI-2 & CCI Protocol Adaptation Layer Specification for USB (CCPAL/U), collaborating with other members to align development with the USB Implementers Forum, as well as providing valuable and timely editing to bring the specification to maturity. Chandrakanth Rapalli of Micron Technology, Inc. was honored for his considerable work on behalf of the MIPI UniPro Working Group and forthcoming MIPI UniPro v3.0 specification. Noteworthy efforts include providing a proposal for an equalization link training sequence feature and collaborating to manage multiple feature proposals and member inputs. The Legacy Award, presented posthumously for notable participation in MIPI Alliance, was awarded to Afshin Attarzadeh of BitifEye Digital Test Solutions GmbH. A dedicated contributor to the MIPI M-PHY Working Group since 2017, Attarzadeh led several efforts to further the growth of the M-PHY ecosystem and ensure members would have reliable M-PHY test solutions. For photos and information about the MIPI Alliance Membership Awards, visit To keep up with MIPI Alliance, subscribe to the MIPI blog and stay connected by following MIPI on X, LinkedIn and YouTube. About MIPI Alliance MIPI Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. There is at least one MIPI specification in every smartphone manufactured today. Founded in 2003, the organization has over 375 member companies worldwide and more than 15 active working groups delivering specifications within the extended mobile ecosystem. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, automotive OEMs and Tier 1 suppliers, and test and test equipment companies, as well as camera, display, tablet and laptop manufacturers. For more information, please visit MIPI®, CSI-2®, M-PHY®, SoundWire® and UniPro® are registered trademarks owned by MIPI Alliance. CCPAL/UTM and SWI3STM are trademarks of MIPI Alliance. View source version on Contacts Press Contact:Lisa McCauslandGeneva Street Marketing for MIPI Alliance+1 303.888.2137lisa@ Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Business Wire
4 days ago
- Business
- Business Wire
MIPI Alliance Recognizes Members for Contributions and Leadership at 12th Annual Awards Ceremony
BRIDGEWATER, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the 2024 MIPI Alliance Membership Award recipients, who were recognized at last week's 12th annual awards ceremony held in conjunction with MIPI Member Meeting #69 in Warsaw, Poland. Seven award recipients in five categories were recognized during the recent 2024 MIPI Alliance Membership Awards ceremony in Warsaw. 'The annual membership awards program highlights our greatest strengths as an alliance—our members' technical leadership and dedication to creating innovative, unparalleled interface solutions for the industries we serve,' said Hezi Saar, MIPI Alliance chair. 'The 2024 honorees' exceptional achievements and industry knowledge have significantly contributed to MIPI's development of market-driven specifications and features. We extend our gratitude to all members for their continued contributions.' The Awards Recognition Committee (ARComm), appointed by the MIPI Board of Directors, reviews the nominations submitted by MIPI members and recommends recipients to the board, which approves the final honorees. Seven award recipients in five categories were recognized during the recent ceremony. The Lifetime Achievement Award is presented to individuals who have at least seven years of service to MIPI Alliance and who have provided noteworthy contributions or leadership to a working group, the board of directors or another MIPI area. Niel Warren of Google LLC was recognized for his leadership as chair of the MIPI Audio Working Group and dedication to driving the industry-leading MIPI SoundWire and forthcoming MIPI SoundWire I3S (SWI3S) specifications. Warren brings not only his technical audio and industry expertise to the group, but he has also been instrumental in soliciting member input and facilitating collaboration. The Working Group Leadership Award is presented to leaders within MIPI working groups in recognition of their noteworthy contributions to the groups' activities or specification development. Ruben Sousa of Synopsys, Inc. was recognized for his substantial work on behalf of the MIPI M-PHY Working Group, including presenting a comprehensive MIPI M-PHY Gear 6 feasibility study and sharing an ADS test bench to ensure the robustness of the upcoming v6.0 specification. Two members received the Distinguished Service Award, which recognizes distinguished service based on momentous contributions to the MIPI specification development process or in the areas of the board, marketing or test. Ariel Lasry of Qualcomm Incorporated was honored for his significant contributions to the forthcoming MIPI UniPro v3.0. His leadership and collaboration helped ensure the specification includes key features to align with industry requirements for deployment in a JEDEC Universal Flash Storage update that will enhance implementation of AI in mobile. Haran Thanigasalam, MIPI camera and imaging consultant, was recognized for his dedicated work to ensure that MIPI CSI-2 continues to evolve to meet future-focused market needs in camera and imaging applications. Thanigasalam is credited with successfully managing the diverse technical activities and member inputs of the MIPI Camera Interest Group and the MIPI Camera Working Group, and has brought in new industry voices to participate in group activities. The Special Achievement Award is presented to individuals who have taken a lead role in the MIPI Alliance and who have actively and consistently performed and contributed toward MIPI objectives. Adi Menachem of Qualcomm Incorporated was recognized for her significant contributions to the forthcoming v1.0 of the MIPI CSI-2 & CCI Protocol Adaptation Layer Specification for USB (CCPAL/U), collaborating with other members to align development with the USB Implementers Forum, as well as providing valuable and timely editing to bring the specification to maturity. Chandrakanth Rapalli of Micron Technology, Inc. was honored for his considerable work on behalf of the MIPI UniPro Working Group and forthcoming MIPI UniPro v3.0 specification. Noteworthy efforts include providing a proposal for an equalization link training sequence feature and collaborating to manage multiple feature proposals and member inputs. The Legacy Award, presented posthumously for notable participation in MIPI Alliance, was awarded to Afshin Attarzadeh of BitifEye Digital Test Solutions GmbH. A dedicated contributor to the MIPI M-PHY Working Group since 2017, Attarzadeh led several efforts to further the growth of the M-PHY ecosystem and ensure members would have reliable M-PHY test solutions. For photos and information about the MIPI Alliance Membership Awards, visit To keep up with MIPI Alliance, subscribe to the MIPI blog and stay connected by following MIPI on X, LinkedIn and YouTube. About MIPI Alliance MIPI Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. There is at least one MIPI specification in every smartphone manufactured today. Founded in 2003, the organization has over 375 member companies worldwide and more than 15 active working groups delivering specifications within the extended mobile ecosystem. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, automotive OEMs and Tier 1 suppliers, and test and test equipment companies, as well as camera, display, tablet and laptop manufacturers. For more information, please visit
Yahoo
16-06-2025
- Business
- Yahoo
Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes
Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies Highlights Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler to reduce turnaround time by 10X New Synopsys certified AI-driven digital and analog flows on SF2P accelerate development of high-performance designs AI-driven design technology co-optimization collaboration delivers superior PPA results on the SF2P process New Synopsys IP, including 224G, UCIe, MIPI and LPDDR6, on SF2P and SF4X speeds time-to-market for next-generation designs and offers a low-risk path to silicon-success SUNNYVALE, Calif., June 16, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with Samsung Foundry to power the next generation of designs for advanced edge AI, HPC, and AI applications. The collaboration between the companies is helping mutual customers achieve successful tape-outs of their complex designs using Synopsys' 3DIC Compiler and Samsung's advanced packaging technologies with fast turnaround time. Mutual customers can improve power, performance and area (PPA) with certified EDA flows for SF2P process, and minimize IP integration risk with the high-quality portfolio of IP on Samsung's most advanced process technologies. "The adoption of Edge AI applications is driving the need for advancements in semiconductor technologies to enable complex computational tasks, improve efficiency, and expand AI capabilities across various industries and applications," said John Koeter, senior vice president for the Synopsys IP Group. "Together with Samsung Foundry, we're enabling the most advanced AI processors across a broad spectrum of use cases from high-performance AI inference engines for data centers to ultra-efficient Edge AI devices like cameras and drones, all optimized for development on sub-2nm Samsung Foundry process technologies." "Synopsys and Samsung have deepened their collaboration to optimize PPA for designs using Samsung's advanced technologies," said Hyung-Ock Kim, vice president and head of the Foundry Design Technology Team at Samsung Electronics "With Synopsys' AI-driven design flows certified for Samsung's SF2 and SF2P processes, customers can seamlessly integrate these solutions into their workflows. This collaboration also provides access to Synopsys' broad portfolio of IP optimized for Samsung's advanced nodes. Additionally, our joint efforts in delivering multi-die solutions, including 2.5D automated routing with Synopsys' 3DIC Compiler and Samsung's I-CubeS™ technology, are pushing the boundaries of innovation in this domain." Successful Collaboration on Multi Die DesignSynopsys and Samsung are powering the most complex multi-die designs to enable mutual customers to rapidly deliver advanced technologies to the market. The companies' most recent collaboration includes a successful tape-out of a customer design using Synopsys' 3DIC Compiler, a unified exploration-to-signoff platform, and Samsung's I-CubeS 2.5D packaging technology, which allows several HBM stacked dies on a silicon interposer. In addition to substantially reducing HBM routing time to 4 hours, the Synopsys 3DIC Compiler improved worst-case eye opening by 6% for better performance and reliability. The ongoing projects leverage 3DIC Compiler's rapid 3D floorplanning with bump and Through-silicon via (TSV) planning and early thermal analysis, which is certified by Samsung for Samsung's X-Cube technology. Collaboration on Design Technology Co-Optimization and EDA FlowsSynopsys and Samsung Foundry have had a decades-long collaboration using AI-driven design technology co-optimization (DTCO) to achieve superior PPA entitlement on SF2 and SF2P processes. Synopsys and Samsung also continue to collaborate on AI-driven flows using Synopsys resulting in a new schematic migration flow to efficiently migrate Samsung SF4 analog IPs to the SF2 process. In addition, Synopsys' AI-driven digital and analog flows have achieved certification on Samsung Foundry's SF2P process with hypercells enablement for more efficient use of standard cell space, improving overall PPA, along with certified digital and analog flows for SF2/SF2P generation nodes. The flows, powered by the full-stack EDA suite, allow mutual customers to accelerate development of differentiated SoCs on Samsung's advanced process technologies. Broad Portfolio of Synopsys IP for Samsung Foundry Speeds Time to MarketSynopsys and Samsung Foundry continue a strategic relationship to provide chipmakers with a comprehensive portfolio of high-quality IP optimized for performance, power, area, and latency across Samsung's advanced process nodes, from 14LPP/U, 8LPU, SF5A to the latest SF4X and SF2P/A. This collaboration supports a wide range of applications, including high-performance computing, consumer electronics, mobile devices, IoT, and automotive markets. Synopsys offers a broad portfolio of interface IP – such as and 224G, UCIe, PCIe 7.0, MIPI, LPDDR6X and USB4 – alongside foundation IP, including embedded memories, logic libraries, GPIOs, and PVT sensors, as well as security IP and Silicon Lifecycle Management (SLM) IP. By delivering trusted, low-risk solutions tailored to Samsung's processes, Synopsys enables mutual customers to accelerate time-to-market and gain a competitive edge for their advanced designs. About SynopsysCatalyzing the era of pervasive intelligence, Synopsys, Inc. (Nasdaq: SNPS) delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at © 2025 Synopsys, Inc. All rights reserved. Synopsys, the Synopsys logo, and other Synopsys trademarks are available at Other company or product names may be trademarks of their respective owners. Editorial Contact Kelli Wheeler Synopsys, View original content to download multimedia: SOURCE Synopsys, Inc. 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