Latest news with #SiCSem
Time of India
2 days ago
- Business
- Time of India
Cabinet approves four semiconductor units in Odisha, Andhra Pradesh and Punjab
The Union Cabinet has approved the establishment of four new semiconductor manufacturing units at a total cost of ₹4,594 crore. Two of the facilities will be set up in Odisha, with one each in Andhra Pradesh and Punjab, according to a statement by the Ministry of Electronics & IT. These four proposals approved are from SiCSem , Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. While SiCSem and 3D Glass will be set up in Odisha, CDIL is located in Punjab and ASIP will be set up in Andhra Pradesh. Union Minister for Information and Technology Ashwini Vaishnaw had earlier said that India's first domestically produced semiconductor chip would be rolled out 'very soon', with six other semiconductor plants already under construction in Gujarat, Assam and Uttar Pradesh. Vaishnaw reiterated the government's objective of making artificial intelligence technologies widely accessible. He said the India AI mission has made 34,000 graphics processing units (GPUs) available as a common computing resource for innovators. With the approval of these projects, semiconductor ecosystem in the country would get a significant boost as these projects include the country's first commercial compound fab as well as highly advanced glass-based substrate semiconductor packaging unit, the ministry said. About the projects To establish an integrated facility of Silicon Carbide (SiC)-based compound semiconductors in Info Valley, Bhubaneshwar, Odisha, SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK. This will be the first commercial compound fab in the country. Also, 3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. On the other hand, Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, under technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units, the statement added. In addition, Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab, that will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide.
Hans India
2 days ago
- Business
- Hans India
Big Push For ‘Make In India': Cabinet clears 4 new chip plants
New Delhi: The Union Cabinet on Tuesday approved four semiconductor manufacturing projects worth Rs 4,600 crore in Andhra Pradesh, Odisha and Punjab under the India Semiconductor Mission. The India Semiconductor Mission (ISM) aims to build a strong semiconductor and display ecosystem, positioning India as a global hub for electronics manufacturing and design. The four approved proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc, and Advanced Systems in Package (ASIP) Technologies. SiCSem and 3D Glass Solutions Inc will set up their manufacturing facilities in Odisha. Continental Device India Private Limited (CDIL) is already based in Punjab, and it will expand its discrete manufacturing facility, and ASIP Technologies will start its manufacturing plant in Andhra Pradesh. These proposals are worth Rs 4600 crore and are expected to generate employment opportunities for about 2034 skilled professionals, which will drive up the major creation of indirect jobs. With these four approvals, the total approved projects under ISM reach 10, with cumulative investments of about Rs 1.60 lakh crore in six states. Under this proposal, SiCSem Private Limited partners with Clas-SiC Wafer Fab Ltd, UK, for establishing the integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneswar, Odisha. This is the country's first compound facility producing almost 60,000 wafers and a packaging capacity of 96 million units. Moreover, the products made at this facility will have applications in Missiles, Defence Equipment, Electric Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters. 3D Glass Solutions Inc (3DGS) will also set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubneshwar, Odisha. This step will bring the world's most advanced packaging technologies to India for powering the efficiency of the Semiconductor Industry. This facility has a large variety of advanced technologies, including glass interposers and 3D heterogeneous Integration Modules with a planned production capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. Advanced System in Package (ASIP) Technologies has a tech tie-up with APACT Co., Ltd, South Korea. These companies will jointly set up a semiconductor manufacturing unit in Andhra Pradesh with an annual production capacity of 96 billion units. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab, and manufacture devices like MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors both in Silicon and Silicon carbide. Devices manufactured at this facility will have applications in Automotive Electronics, including EVs, renewable energy systems, power conversion applications, industrial applications, and communication infrastructure. New facilities will support the growing chip design capabilities in the country. The government already supported it by providing 278 academic institutions and 72 start-ups. The decision to set up an additional four plants will drive India's momentum in both the chip and electronics markets. Setting up new plants will also cater to the growing employees. This mission achieved great success as India's semiconductor chip market is expected to reach USD 100- 110 billion by 2030, as per the report. Plus, India's electronics exports witnessed a surge of over 47 pc YoY in Quarter 1 of FY26 as per the India Cellular and Electronics Association (ICEA).
Time of India
2 days ago
- Business
- Time of India
Union Cabinet approves 2 semiconductor projects worth Rs 4,009cr for Odisha
Bhubaneswar: Union Cabinet on Tuesday approved two major semiconductor manufacturing units worth Rs 4,009 crore for Odisha. The two projects, to be set up in Bhubaneswar's Info Valley, will generate thousands of high-skilled jobs, catalyse electronics manufacturing and help place Odisha on the global semiconductor map, sources said. The two manufacturing units will be built by SiCSem and 3D Glass. Given the growing demand for semiconductors in telecom, automotive, data centres, consumer electronics and industrial electronics, the newly approved projects will significantly contribute to creating an ' Atmanirbhar Bharat ', official sources said. Thanking Prime Minister Narendra Modi for the Cabinet's approval, chief minister Mohan Majhi said in an X post, "The recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness, and sustainability, together with this significant Cabinet approval, marks a major milestone in the state's industrial and technological advancement. I look forward to continued partnership between the state and central govts to further this strategic initiative for the comprehensive development of Odisha and the nation." SiCSem Pvt Ltd, in collaboration with UK-based Clas-SiC Wafer Fab Ltd, will set up India's first commercial compound semiconductor fabrication facility here. The plant will manufacture silicon carbide (SiC) devices, known for their efficiency in high-power applications, with an annual capacity of 60,000 wafers and 96 million packaged units. The SiC devices will have applications across critical sectors, including missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances and solar power inverters. The facility is expected to give India a strategic edge in producing next-generation power electronics domestically. The second project, by US-headquartered 3D Glass Solutions Inc (3DGS), will introduce the world's most advanced semiconductor packaging technology. The unit will manufacture glass interposers, silicon bridges and 3D heterogeneous integration (3DHI) modules. The component are crucial for miniaturisation, high performance and energy efficiency in electronics. With a planned capacity of about 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, the facility will cater to applications in defence, high-performance computing, artificial intelligence, RF and automotive electronics, photonics and co-packaged optics. Officials said the two projects will not only bring cutting-edge technology to Odisha but also create a ripple effect in the state's electronics ecosystem, encouraging ancillary industries and boosting technical skill development. Apart from two Odisha projects, the Cabinet also approved one project each for Punjab and Andhra Pradesh under the India Semiconductor Mission (ISM). Union education minister Dharmendra Pradhan hailed the Cabinet's decision to set up the two units in Odisha. He said the decision is a pivotal moment for the state, emphasising its potential to create jobs and generate substantial revenue. Pradhan expressed his gratitude to the PM and highlighted that this move marks a new chapter in the 'Purvodaya' mission. Stay updated with the latest local news from your city on Times of India (TOI). Check upcoming bank holidays , public holidays , and current gold rates and silver prices in your area.
Time of India
2 days ago
- Business
- Time of India
Cabinet approves four semiconductor factories in Odisha, Andhra Pradesh & Punjab
The Union Cabinet on Tuesday approved the establishment of four new semiconductor manufacturing units across the country at the cost of Rs 4,594 crore. Of these, two factories will be set up in Odisha, while one each will come up in Andhra Pradesh and four approved proposals are expected to generate a cumulative employment for 2034 skilled professionals which would catalyse the electronic manufacturing ecosystem resulting in the creation of many indirect jobs, as per central these four more approvals today, total approved projects under ISM reaches to 10 with cumulative investments of around Rs 1.60 lakh crore in 6 states."Given the growing demand of semiconductors in telecom, automotive, datacentres, consumer electronics and industrial electronics, these four new approved semiconductors projects would significantly contribute to making Atmanirbhar Bharat. "SiCSem and 3D Glass will be set up in Odisha. CDIL is located in Punjab and ASIP will be set up in Andhra Information and Technology Minister Ashwini Vaishnaw had said earlier that the country is set to witness the rollout of its first made-in-India chip "very soon" as six semiconductor plants are already under construction in Gujarat, Assam and Uttar the government's resolve for the easy accessibility of Artificial Intelligence (AI) technologies, he said, "AI is shaping our world today. Our Prime Minister's vision is of democratising technology. It should be accessible to all. It should not be limited to a few. It should be available to all. That's why we have done the India AI mission in which 34,000 GPUs (Graphics Processing Units) are available today as a common compute facility for all our innovators."In addition, the PM Modi-led Cabinet also gave the green light for the extension of the Lucknow Metro line at a budget of Rs 5,801 crore, aiming to enhance urban mobility and cater to the growing transportation needs of the city's residentsIt also approved a Bill to establish a new Indian Institute of Management (IIM) in Guwahati and the construction of a Tato-II hydroelectric Project worth 700 MW at the cost of Rs 8,146 would mark the second IIM in the northeast, after the first one in Shillong.
Hans India
2 days ago
- Business
- Hans India
Cabinet okays 4 semiconductor manufacturing units with Rs 4,600 crore outlay
New Delhi: The Union Cabinet, chaired by Prime Minister Narendra Modi, on Tuesday approved four more semiconductor projects under the India Semiconductor Mission (ISM) with an outlay of Rs 4,600 crore. The four proposals approved are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. With these, the total approved projects under the ISM have reached 10, with cumulative investments of around Rs 1.60 lakh crore in six states. "These four approved proposals will set up semiconductor manufacturing facilities with a cumulative investment of around Rs 4,600 crore and are expected to generate a cumulative employment for 2,034 skilled professionals, which would catalyse the electronic manufacturing ecosystem, resulting in the creation of many indirect jobs," a Cabinet communique said. SiCSem and 3D Glass will be set up in Odisha. CDIL is located in Punjab, and ASIP will be set up in Andhra Pradesh. SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish an integrated facility of silicon carbide-based Compound Semiconductors in Info Valley, Bhubaneshwar. This will be the first commercial compound fab in the country. The project proposes to manufacture silicon carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and a packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railways, fast chargers, data centre racks, consumer appliances, and solar power inverters, the Cabinet note said. 3D Glass Solutions Inc. (3DGS) will set up a vertically integrated advanced packaging and embedded glass substrate unit in Odisha. This unit will bring the world's most advanced packaging technology to India. The facility will have a large variety of advanced technologies, including glass interposers with passives and silicon bridges, and 3D heterogeneous integration (3DHI) modules. Planned capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics, etc. According to the Cabinet, the Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, under a technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in silicon and silicon carbide. The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these proposed units will have applications in automotive electronics, including EVs and their charging infrastructure, renewable energy systems, power conversion applications, industrial applications and communication infrastructure. "These would complement the growing world-class chip design capabilities coming up in the country, which are propelled by design infrastructure support provided by the government to 278 academic institutions and 72 start-ups. Already more than 60,000 students have availed the benefits of the talent development programme," said the Cabinet.
