Latest news with #UALinkConsortium
Yahoo
3 days ago
- Business
- Yahoo
Astera Labs Leads in PCIe 6.0 & AI Connectivity: More Upside Ahead?
Astera Labs ALAB is emerging as a key player in next-gen data center connectivity with a full-stack portfolio spanning PCIe 6.0, UA Link, and CXL 3.0. It is the first to market with a complete PCIe 6.0 solution set, including retimers, gearboxes, smart fabric switches, and optical modules. The Aries 6 Smart Gearbox acts as a bridge between PCIe 5.0 and 6.0, addressing speed mismatches in complex hyperscale systems. Meanwhile, Scorpio P- and X-Series Smart Fabric Switches, now in preproduction, support both scale-up and modular scale-out AI topologies. Combined with Aries Retimers and the COSMOS software suite, the fabric switches deliver telemetry, diagnostics, and system-level optimizations for high-performance, low-latency AI infrastructure. Astera Labs is advancing next-gen data center infrastructure through strategic OEM collaborations and a broad standards-based product lineup. Its work with Wistron on NVIDIA's NVDA Blackwell-based MGX systems showcases its role in enabling full PCIe 6.0 support for AI servers. As a key contributor to the UA Link Consortium, Astera is gaining early momentum with the UA Link 1.0 standard. Beyond AI, it's expanding into general-purpose compute with design wins in SSDs, NICs and CPUs. Adoption of its Leo CXL controllers and Taurus Ethernet modules reflects growing demand for CXL 3.0 and 400G/800G Ethernet. Astera Labs leads with a full PCIe 6.0 portfolio comprising retimers, gearboxes, fabric switches, and optical modules tailored for hyperscaler AI clusters. Its Aries 6 Smart Gearbox bridges PCIe 5.0 and 6.0, while involvement in the UA Link Consortium strengthens its role in high-speed AI interconnects. In comparison, Broadcom AVGO has launched its PCIe Gen 6 portfolio, featuring high-port switches and retimers tested for interoperability with partners like Micron and Teledyne LeCroy. Broadcom's Interop Development Platform (IDP) offers advanced telemetry and diagnostics, facilitating system design for AI infrastructure. Broadcom's in-house SerDes technology and collaboration with ecosystem partners aim to support scalable AI clusters. Marvell Technology MRVL has expanded its connectivity offerings with the Alaska P PCIe retimer product line, built on 5nm PAM4 technology. These retimers, available in 8- and 16-lane configurations, are designed to scale connections between AI accelerators, GPUs and CPUs within servers. Marvell's focus on low power consumption and compatibility with PCIe Gen 6 and CXL standards addresses the needs of both AI and general-purpose server systems. Astera Labs has rallied 46.4% in a year compared with the industry's 37.4% growth and the sector's 11.7% rise. The S&P 500 index, meanwhile, has improved 12.5% during the said period. Image Source: Zacks Investment Research Astera Labs is presently trading at a forward 12-month price-to-sales of 18.93X, which is below its 1-year median of 20.01X. However, it remains overvalued compared to the industry. Image Source: Zacks Investment Research ALAB currently carries a Zacks Rank #2 (Buy). You can see the complete list of today's Zacks #1 Rank (Strong Buy) stocks here. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report NVIDIA Corporation (NVDA) : Free Stock Analysis Report Marvell Technology, Inc. (MRVL) : Free Stock Analysis Report Broadcom Inc. (AVGO) : Free Stock Analysis Report Astera Labs, Inc. (ALAB) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research
Yahoo
06-05-2025
- Business
- Yahoo
Astera Labs to Share Vision for Expanding Opportunities in AI Infrastructure with UALink
ASTERA LABS, INC. With broad industry support from 100+ companies in the UALink Consortium and the ratification of the UALink 200G 1.0 specification, UALink is emerging as the essential open standard for scale-up AI infrastructure SANTA CLARA, Calif., May 06, 2025 (GLOBE NEWSWIRE) -- Astera Labs, Inc. (Nasdaq: ALAB), a global leader in semiconductor-based connectivity solutions for AI and cloud infrastructure, today announced its upcoming webinar hosted by J.P. Morgan on Ultra Accelerator Link™ (UALink™) technology. Astera Labs is a Promoter Member of the UALink Consortium and is working closely with its UALink partners to advance an open connectivity ecosystem that will unleash the next generation of AI platforms that are performant, efficient, and scalable. Webinar: Astera Labs' Vision for Expanding Opportunities in AI Infrastructure with UALink UALink is an open, memory-semantic fabric that delivers the high bandwidth, low latency, and interoperability needed to power tomorrow's AI workloads. As a scale-up AI fabric, UALink can be deployed for both AI training and AI inferencing applications to support a broad range of AI models. Put simply, hyperscalers can build bigger, faster, and more cost-efficient AI systems within the rack leveraging UALink. Join this webinar to: Learn about the fundamentals of UALink technology and its transformative impact on AI applications in the cloud Gain insight into how UALink expands the total addressable market for AI infrastructure by standardizing memory-semantic connectivity, enabling broader adoption across the industry Understand how Astera Labs is uniquely positioned to lead in this space with deep expertise in silicon-based connectivity solutions and learn about its expanded market opportunity When: May 20, 2025, 4:30pm-5:30pm ET / 1:30pm-2:30pm PT J.P. Morgan Host: Harlan Sur, Semis Cap Equipment and Technology Hardware Equity Analyst Astera Labs Presenters: Thad Omura, Chief Business Officer Chris Petersen, Fellow, Technology & Ecosystems and UALink Board Director Nick Aberle, VP, Treasurer and Head of Investor Relations Register: Additional Resources About Astera Labs Astera Labs is a global leader in purpose-built connectivity solutions that unlock the full potential of AI and cloud infrastructure. Our Intelligent Connectivity Platform integrates PCIe®, CXL®, and Ethernet semiconductor-based solutions and the COSMOS software suite of system management and optimization tools to deliver a software-defined architecture that is both scalable and customizable. Inspired by trusted relationships with hyperscalers and the data center ecosystem, we are an innovation leader delivering products that are flexible and interoperable. Discover how we are transforming modern data-driven applications at
Malaysian Reserve
30-04-2025
- Business
- Malaysian Reserve
Open Compute Project Foundation and UALink™ Consortium Announce a New Collaboration
Establishing a Framework to Optimize Scale-up Interconnect for AI and HPC Clusters DUBLIN, April 29, 2025 /CNW/ — Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and the Ultra Accelerator Link™ (UALink™) Consortium announced a new collaboration to enhance scale-up interconnect performance in AI clusters and High-Performance Computing (HPC). The UALink Consortium is developing an open industry standard for high-performance accelerated compute scale-up interconnects tailored for AI and HPC workloads, while the OCP Community is actively designing sustainable, large-scale data center infrastructure with a focus on Open Systems for AI. Together, OCP and UALink aim to integrate UALink's scale-up AI interconnect technology into OCP Community-delivered AI clusters, providing the high-bandwidth, low-latency, low-power connectivity required for high-performance AI training and inference. 'The rapid adoption of AI across industries, from autonomous systems to enterprise analytics, is driving unprecedented demand for scalable, high-performance AI infrastructure. This has created a pivotal moment for data center investments, with hyperscale operators deploying large-scale AI clusters to meet these needs. By collaborating, the UALink Consortium and the OCP Community can shape system specifications to address critical challenges in interconnect bandwidth and scalability posed by advanced AI models,' said George Tchaparian, CEO at the OCP Foundation. Key aspects of the collaboration will focus on aligning OCP's community-led infrastructure development with UALink's interconnect innovations, ensuring seamless integration and shared objectives. The alliance will leverage the expertise of both organizations to advance scale-up AI interconnect performance. Following the release of UALink 1.0 Specification earlier this month, both organizations and their communities are setting up for collaboration across OCP's Open Systems for AI Strategic Initiative and OCP's Future Technologies Initiative Short-Reach Optical Interconnect workstream. 'AI and HPC workloads require ultra-low latency and massive bandwidth to handle the scale and complexity of accelerated compute data processing to meet LLM requirements. The UALink Consortium was formed to create an open standard for accelerated compute interconnects that meets these demands, enabling faster and more efficient data exchange. Partnering with the OCP Community will accelerate the adoption of UALink's innovations into complete systems, delivering transformative performance for AI markets,' said Peter Onufryk, UALink Consortium President. 'The surge in generative AI and HPC applications is placing immense pressure on data center interconnects to deliver the bandwidth and responsiveness needed for training and inference. The alliance between OCP and UALink creates a powerful collaborative framework to develop and integrate advanced interconnect solutions, enhancing the performance of large-scale AI clusters. This alliance has the potential to redefine industry solutions for AI infrastructure,' said Sameh Boujelbene, VP at Dell'Oro Group. About the Open Compute Project Foundation The Open Compute Project (OCP) brings at-scale innovations and hyperscaler best practices to all, spanning technology domains from the data center to the edge, and the technology stack from silicon, to systems, to site facilities and services. The international OCP Community is made up of organizations and people from hyperscale and tier-2 cloud data center operators, communications providers, colocation providers, diverse enterprises, and technology vendors. With the tenets of openness, impact, efficiency, scale and sustainability, the OCP engages and educates thousands of engineers every year. Across many projects and initiatives the OCP Foundation and Community are meeting the market today and shaping the future. Learn more at: About Ultra Accelerator Link Consortium The Ultra Accelerator Link (UALink) Consortium, incorporated in October 2024, is the open industry standard group dedicated to developing the UALink specifications, a high-speed, scale-up accelerator interconnect technology that advances next-generation AI & HPC cluster performance. The consortium is led by a board made up of stalwarts of the industry; Alibaba, AMD, Apple, Astera Labs, AWS, Cisco, Google, HPE, Intel, Meta, Microsoft, and Synopsys. The Consortium develops technical specifications that facilitate breakthrough performance for emerging AI usage models while supporting an open ecosystem for data center accelerators. For more information on the UALink Consortium, please visit Ultra Accelerator Link and UALink are trademarks of the UALink Consortium. All other trademarks are the property of their respective owners. Contacts Dirk Van Slyke Open Compute Project Foundation dirkv@ +1 303-999-7398 Nolan Morgan UALink Consortium +1 971-271-2657 press@
Associated Press
29-04-2025
- Business
- Associated Press
Open Compute Project Foundation and UALink™ Consortium Announce a New Collaboration
Establishing a Framework to Optimize Scale-up Interconnect for AI and HPC Clusters DUBLIN, April 29, 2025 /PRNewswire/ -- Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and the Ultra Accelerator Link™ (UALink™) Consortium announced a new collaboration to enhance scale-up interconnect performance in AI clusters and High-Performance Computing (HPC). The UALink Consortium is developing an open industry standard for high-performance accelerated compute scale-up interconnects tailored for AI and HPC workloads, while the OCP Community is actively designing sustainable, large-scale data center infrastructure with a focus on Open Systems for AI. Together, OCP and UALink aim to integrate UALink's scale-up AI interconnect technology into OCP Community-delivered AI clusters, providing the high-bandwidth, low-latency, low-power connectivity required for high-performance AI training and inference. 'The rapid adoption of AI across industries, from autonomous systems to enterprise analytics, is driving unprecedented demand for scalable, high-performance AI infrastructure. This has created a pivotal moment for data center investments, with hyperscale operators deploying large-scale AI clusters to meet these needs. By collaborating, the UALink Consortium and the OCP Community can shape system specifications to address critical challenges in interconnect bandwidth and scalability posed by advanced AI models,' said George Tchaparian, CEO at the OCP Foundation. Key aspects of the collaboration will focus on aligning OCP's community-led infrastructure development with UALink's interconnect innovations, ensuring seamless integration and shared objectives. The alliance will leverage the expertise of both organizations to advance scale-up AI interconnect performance. Following the release of UALink 1.0 Specification earlier this month, both organizations and their communities are setting up for collaboration across OCP's Open Systems for AI Strategic Initiative and OCP's Future Technologies Initiative Short-Reach Optical Interconnect workstream. 'AI and HPC workloads require ultra-low latency and massive bandwidth to handle the scale and complexity of accelerated compute data processing to meet LLM requirements. The UALink Consortium was formed to create an open standard for accelerated compute interconnects that meets these demands, enabling faster and more efficient data exchange. Partnering with the OCP Community will accelerate the adoption of UALink's innovations into complete systems, delivering transformative performance for AI markets,' said Peter Onufryk, UALink Consortium President. 'The surge in generative AI and HPC applications is placing immense pressure on data center interconnects to deliver the bandwidth and responsiveness needed for training and inference. The alliance between OCP and UALink creates a powerful collaborative framework to develop and integrate advanced interconnect solutions, enhancing the performance of large-scale AI clusters. This alliance has the potential to redefine industry solutions for AI infrastructure,' said Sameh Boujelbene, VP at Dell'Oro Group. About the Open Compute Project Foundation The Open Compute Project (OCP) brings at-scale innovations and hyperscaler best practices to all, spanning technology domains from the data center to the edge, and the technology stack from silicon, to systems, to site facilities and services. The international OCP Community is made up of organizations and people from hyperscale and tier-2 cloud data center operators, communications providers, colocation providers, diverse enterprises, and technology vendors. With the tenets of openness, impact, efficiency, scale and sustainability, the OCP engages and educates thousands of engineers every year. Across many projects and initiatives the OCP Foundation and Community are meeting the market today and shaping the future. Learn more at: About Ultra Accelerator Link Consortium The Ultra Accelerator Link (UALink) Consortium, incorporated in October 2024, is the open industry standard group dedicated to developing the UALink specifications, a high-speed, scale-up accelerator interconnect technology that advances next-generation AI & HPC cluster performance. The consortium is led by a board made up of stalwarts of the industry; Alibaba, AMD, Apple, Astera Labs, AWS, Cisco, Google, HPE, Intel, Meta, Microsoft, and Synopsys. The Consortium develops technical specifications that facilitate breakthrough performance for emerging AI usage models while supporting an open ecosystem for data center accelerators. For more information on the UALink Consortium, please visit Ultra Accelerator Link and UALink are trademarks of the UALink Consortium. All other trademarks are the property of their respective owners. Contacts Dirk Van Slyke Open Compute Project Foundation [email protected] +1 303-999-7398 Nolan Morgan UALink Consortium +1 971-271-2657 [email protected] View original content to download multimedia: SOURCE Open Compute Project Foundation
Cision Canada
29-04-2025
- Business
- Cision Canada
Open Compute Project Foundation and UALink™ Consortium Announce a New Collaboration
Establishing a Framework to Optimize Scale-up Interconnect for AI and HPC Clusters DUBLIN, April 29, 2025 /CNW/ -- Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and the Ultra Accelerator Link™ (UALink™) Consortium announced a new collaboration to enhance scale-up interconnect performance in AI clusters and High-Performance Computing (HPC). The UALink Consortium is developing an open industry standard for high-performance accelerated compute scale-up interconnects tailored for AI and HPC workloads, while the OCP Community is actively designing sustainable, large-scale data center infrastructure with a focus on Open Systems for AI. Together, OCP and UALink aim to integrate UALink's scale-up AI interconnect technology into OCP Community-delivered AI clusters, providing the high-bandwidth, low-latency, low-power connectivity required for high-performance AI training and inference. "The rapid adoption of AI across industries, from autonomous systems to enterprise analytics, is driving unprecedented demand for scalable, high-performance AI infrastructure. This has created a pivotal moment for data center investments, with hyperscale operators deploying large-scale AI clusters to meet these needs. By collaborating, the UALink Consortium and the OCP Community can shape system specifications to address critical challenges in interconnect bandwidth and scalability posed by advanced AI models," said George Tchaparian, CEO at the OCP Foundation. Key aspects of the collaboration will focus on aligning OCP's community-led infrastructure development with UALink's interconnect innovations, ensuring seamless integration and shared objectives. The alliance will leverage the expertise of both organizations to advance scale-up AI interconnect performance. Following the release of UALink 1.0 Specification earlier this month, both organizations and their communities are setting up for collaboration across OCP's Open Systems for AI Strategic Initiative and OCP's Future Technologies Initiative Short-Reach Optical Interconnect workstream. "AI and HPC workloads require ultra-low latency and massive bandwidth to handle the scale and complexity of accelerated compute data processing to meet LLM requirements. The UALink Consortium was formed to create an open standard for accelerated compute interconnects that meets these demands, enabling faster and more efficient data exchange. Partnering with the OCP Community will accelerate the adoption of UALink's innovations into complete systems, delivering transformative performance for AI markets," said Peter Onufryk, UALink Consortium President. "The surge in generative AI and HPC applications is placing immense pressure on data center interconnects to deliver the bandwidth and responsiveness needed for training and inference. The alliance between OCP and UALink creates a powerful collaborative framework to develop and integrate advanced interconnect solutions, enhancing the performance of large-scale AI clusters. This alliance has the potential to redefine industry solutions for AI infrastructure," said Sameh Boujelbene, VP at Dell'Oro Group. About the Open Compute Project Foundation The Open Compute Project (OCP) brings at-scale innovations and hyperscaler best practices to all, spanning technology domains from the data center to the edge, and the technology stack from silicon, to systems, to site facilities and services. The international OCP Community is made up of organizations and people from hyperscale and tier-2 cloud data center operators, communications providers, colocation providers, diverse enterprises, and technology vendors. With the tenets of openness, impact, efficiency, scale and sustainability, the OCP engages and educates thousands of engineers every year. Across many projects and initiatives the OCP Foundation and Community are meeting the market today and shaping the future. Learn more at: About Ultra Accelerator Link Consortium The Ultra Accelerator Link (UALink) Consortium, incorporated in October 2024, is the open industry standard group dedicated to developing the UALink specifications, a high-speed, scale-up accelerator interconnect technology that advances next-generation AI & HPC cluster performance. The consortium is led by a board made up of stalwarts of the industry; Alibaba, AMD, Apple, Astera Labs, AWS, Cisco, Google, HPE, Intel, Meta, Microsoft, and Synopsys. The Consortium develops technical specifications that facilitate breakthrough performance for emerging AI usage models while supporting an open ecosystem for data center accelerators. For more information on the UALink Consortium, please visit Ultra Accelerator Link and UALink are trademarks of the UALink Consortium. All other trademarks are the property of their respective owners. Contacts Dirk Van Slyke Open Compute Project Foundation [email protected] +1 303-999-7398 Nolan Morgan UALink Consortium +1 971-271-2657 [email protected] SOURCE Open Compute Project Foundation
