Latest news with #ValensSemiconductor
Yahoo
07-08-2025
- Business
- Yahoo
Valens Semiconductor to Participate in Upcoming Investor Conferences
HOD HASHARON, Israel, Aug. 7, 2025 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN) ("Valens"), a leader in high-performance connectivity, today announced that Guy Nathanzon, Chief Financial Officer, will participate in the following investor events in August: Oppenheimer 28th Annual Technology, Internet & Communications ConferenceFormat: Presentation and virtual one-on-one meetingsWhen: Monday, August 11 to Wednesday, August 13. Presentation is scheduled for August 11 at 2:05 pm ETWebcast Link: Needham 6th Annual Virtual Semiconductor & SemiCap ConferenceFormat: Virtual one-on-one meetingsWhen: Wednesday, August 20 and Thursday, August 21 Jefferies Semiconductor, IT Hardware & Communications ConferenceFormat: In-person one-on-one meetingsWhen: Tuesday, August 26Location: Chicago, IL Evercore ISI Semi, IT Hardware & Networking ConferenceFormat: In-person one-on-one meetingsWhen: Wednesday, August 27Location: Chicago, IL Investors interested in scheduling one on one meetings with Valens during any of the upcoming conferences are encouraged to contact their sales representative or reach out to Miri Segal at msegal@ About Valens Semiconductor Valens Semiconductor (NYSE: VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit Forward-Looking StatementsThis press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements include, but are not limited to, statements regarding our anticipated future results, including financial results, our five-year plan, currency exchange rates, and contract wins, and future economic and market conditions. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of Valens Semiconductor's ("Valens") management and are not predictions of actual performance. These forward-looking statements are provided for illustrative purposes only and are not intended to serve as and must not be relied on by any investor as a guarantee, an assurance, a prediction or a definitive statement of fact or probability. Actual events and circumstances are difficult or impossible to predict and will differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers; any difficulty selling Valens' products if customers do not design its products into their product offerings; Valens' dependence on winning selection processes; even if Valens succeeds in winning selection processes for its products, Valens may not generate timely or sufficient net sales or margins from those wins; sustained yield problems or other delays or quality events in the manufacturing process of products; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; further deterioration of macroeconomic conditions due to ongoing global political and economic uncertainty, including with respect to China-Taiwan relations and increasing trade and other tariff-related tensions (as our current guidance assumes the estimated production and/or demand impact on us of current tariff conditions); political, economic, governmental and tax consequences associated with our incorporation and location in Israel; and those factors discussed in Valens' Form 20-F filed with the SEC on February 26, 2025 under the heading "Risk Factors," and other documents of Valens filed, or to be filed, with the SEC. If any of these risks materialize or our assumptions prove incorrect, actual results could differ materially from the results implied by these forward-looking statements. There may be additional risks that Valens does not presently know or that Valens currently believes are immaterial that could also cause actual results to differ from those contained in the forward-looking statements. In addition, forward-looking statements reflect Valens' expectations, plans or forecasts of future events and views as of the date of this press release. Valens anticipates that subsequent events and developments may cause Valens' assessments to change. However, while Valens may elect to update these forward-looking statements at some point in the future, Valens specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing Valens' assessment as of any date subsequent to the date of this press release. Accordingly, undue reliance should not be placed upon the forward-looking statements. Logo: For more information, please contact: Investor Contacts: Michal Ben AriInvestor Relations ManagerValens Semiconductor Miri SegalMS-IR IR for Valensmsegal@ Media Contact: Yoni DayanHead of CommunicationsValens Semiconductor View original content: SOURCE Valens Semiconductor
Forbes
28-07-2025
- Automotive
- Forbes
The Weak Link: Hidden Chip Connections Crash Your Calls, Cars And Care
Invisible 'in‑between' links still sabotage modern tech. Specialist chipmakers are now racing to secure signals and restore reliability Every modern action, from tapping a phone to steering a car, relies on semiconductor muscle. Yet our video calls still freeze, medical images blur, driver‑assist alerts misfire, and everyday functions fail far too often. What consistently breaks is not the headline compute, it is the fragile 'in‑between' layer that ferries raw signals from sensor to processor and from board to board. It is the fragile 'in‑between' layer that ferries raw signals from sensor to processor and from ... More illustration photo taken in Krakow, Poland on July 19, 2023. (Photo by Jakub Porzycki/NurPhoto via Getty Images) 'It's often not your internet, it could be your USB cable maxing out its bandwidth, or a flaky connector dropping frames before they even hit your screen,' says Valens Semiconductor CEO Gideon Ben Zvi. "While we keep blaming 'the network,' the real fault often lies a few centimeters of copper away." Industry‑wide, only a minority of the roughly 600 U.S. chip firms keep dedicated signal‑integrity teams; most chase clock speeds and process nodes instead, and that leaves huge swaths of functionality exposed. Valens Semiconductor, public on the NYSE since a $1.1 billion SPAC merger in 2021, focuses specifically on these 'in‑between' layers, building chips that keep video, control, data, and power signals clean and synchronized over interference‑prone cables in cars, medical devices, industrial vision, and pro‑AV. "The 'in‑between' fragility ripples through critical domains. In a U.S. hospital network, intermittent, low‑resolution endoscope feeds were undermining confidence in minimally invasive procedures until the system migrated to a disposable‑scope architecture built on hardened long‑reach link," says Ben Zvi. 'Moving to a disposable‑endoscope architecture with our chipsets, would eliminate feed errors 98% of the time, giving doctors the real-time clarity they need to save lives." The same approach shows up elsewhere; for video calls, they collapse camera video, audio, control, USB (and often power) into a single long‑reach, interference‑robust cable so the 4K image actually arrives intact. In vehicles they move multi‑sensor ADAS data over resilient links that shrug off EMI bursts before those errors can silently erode perception. "solving the problems that show up in real‑world systems." Valens isn't alone. More suppliers are targeting the 'in‑between' layer. Texas Instruments' active EMI filter ICs inject counter‑phase currents to reduce conducted and common‑mode noise, helping designers shrink traditional filtering components. Samtec's Flyover® twinax assemblies lift high‑speed lanes off lossy PCB traces to extend reach while maintaining signal margin. Spectra7 integrates analog equalization into ultra‑thin VR/AR cables so high‑resolution, low‑latency video can traverse lighter, more flexible tethers. Alphawave provides power‑efficient high‑speed SerDes IP tuned for longer, noisier channels, helping complex SoCs meet bit‑error and latency targets without excessive board complexity. Different markets, same takeaway. As commodity performance plateaus in perceived user benefit, reliability and integrity in the 'in‑between' become sharper differentiators. 'We're not chasing headlines. We're solving the problems that show up in real‑world systems,' Ben Zvi says, and that stance illustrates a broader strategic shift. Fixing the 'in‑between' won't make benchmark splash, but it is what keeps surgeries sharp, cars safer, factories running, collaboration fluid, and without it, every layer of modern life remains vulnerable to silent, preventable failure.
Yahoo
21-07-2025
- Automotive
- Yahoo
Valens (VLN) Powers First MIPI A-PHY Embedded Vision System
Valens Semiconductor Ltd. (NYSE:VLN) is one of the 11 Best Semiconductor Penny Stocks to Buy According to Hedge Funds. On July 15, Valens Semiconductor Ltd. (NYSE:VLN) reported that its VA7000 chipsets are now being used in D3 Embedded's MIPI A-PHY platform for embedded vision. These VA7000 chipsets by Valens Semiconductor Ltd. (NYSE:VLN) are the main connectivity solution for a comprehensive camera-to-processor MIPI A-PHY platform. This platform is the first product-ready solution in the market that brings the advanced A-PHY connectivity standard to embedded vision systems. A close-up of a digital circuit board with chips illuminated by LED lights. The A-PHY platform offers several advantages for D3's customers, such as strong resistance to electromagnetic interference (EMI), longer link distances, and operation with basic, low-cost cables. The MIPI A-PHY standard ensures excellent Electromagnetic Compatibility (EMC) performance, which means reliable data transmission even in industrial settings with electrical noise. Chipsets based on A-PHY technology support high-speed data transmission over cables as long as 30 meters or more without losing signal quality. Additionally, these chips allow for multi-gigabit connectivity through both Unshielded Twisted Pair (UTP) and micro-coaxial cables. This helps system designers to balance cost, weight, and mechanical requirements as per their specific application needs. These chipsets also provide built-in diagnostics for link monitoring and preventive maintenance so that systems can run around the clock. According to the report by Valens Semiconductor Ltd. (NYSE:VLN), these features make A-PHY-based chipsets a great fit for a broad range of applications, including robotics, industrial vehicles, industrial automation, and medical imaging. Valens Semiconductor Ltd. (NYSE:VLN) is an Israeli fabless manufacturing company that focuses on high-performance connectivity. The company provides semiconductor solutions to the automotive and audio-video industries. While we acknowledge the potential of VLN as an investment, we believe certain AI stocks offer greater upside potential and carry less downside risk. If you're looking for an extremely undervalued AI stock that also stands to benefit significantly from Trump-era tariffs and the onshoring trend, see our free report on the best short-term AI stock. READ NEXT: 10 Best American Semiconductor Stocks to Buy Now and 11 Best Fintech Stocks to Buy Right Now. Disclosure: None. This article is originally published at Insider Monkey. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
16-07-2025
- Automotive
- Yahoo
Valens Semiconductor to Announce Second Quarter 2025 Financial Results on August 6, 2025
HOD HASHARON, Israel, July 16, 2025 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, today announced that it will release its second quarter 2025 financial results before the market opens on Wednesday, August 6, 2025. Gideon Ben Zvi, Chief Executive Officer, and Guy Nathanzon, Chief Financial Officer, will host a conference call on Wednesday, August 6, 2025, at 8:30 a.m. Eastern Time (ET) to discuss the company's second quarter 2025 financial results and business outlook. To access this call, please dial: U.S: +1 (888) 281-1167 UK: 0 (808) 101-2717 Israel: 03 918 0610 Other: +972 3 918 0610 A live webcast of the conference call will be available via the investor relations section of Valens Semiconductor's website at Valens - Financials - Quarterly Results. The live webcast can also be accessed by clicking here. A replay of the conference call will be available on Valens Semiconductor's website shortly after the call concludes. About Valens Semiconductor Valens Semiconductor (NYSE: VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit Investor Contacts:Michal Ben AriInvestor Relations ManagerValens Semiconductor Miri SegalMS-IR IR for Valensmsegal@ Media Contact:Yoni DayanHead of CommunicationsValens Semiconductor Logo - View original content: SOURCE Valens Semiconductor
Yahoo
15-07-2025
- Business
- Yahoo
Valens Semiconductor's VA7000 Chipsets Enable the Market's First MIPI A-PHY Platform for Embedded Vision by D3 Embedded
Product suite, including Nvidia processors and Sony sensors, are available for sale on the D3 Embedded website. HOD HASHARON, Israel, July 15, 2025 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN) announced that its chipsets are the keystone connectivity solution for a comprehensive camera-to-processor MIPI A-PHY platform offered by D3 Embedded. The platform brings to market the first product-ready solution for implementing the high-performance A-PHY connectivity standard in embedded vision systems. The A-PHY platform offers D3's customers a series of unique benefits, including unparalleled EMI resilience, longer link distances, and the ability to operate over simple, low-cost cabling. "D3 Embedded's comprehensive camera-to-processor platform is a practical, ready-to-deploy solution that significantly lowers the barrier to entry for companies looking to adopt A-PHY in their embedded vision systems," said Gili Friedman, Head of the Cross-Industry Business Unit at Valens Semiconductor. "Valens sees significant demand for MIPI A-PHY in this market, and we look forward to seeing how this collaboration between our companies will lead to broad adoption of A-PHY, changing the way embedded vision and AI systems are deployed across industries." "A-PHY's ability to deliver high-speed data over long distances with exceptional electromagnetic compatibility is a game-changer for the industry," said Scott Reardon, CEO of D3 Embedded. "Investing in this technology was crucial because it addresses the key challenges our customers face - reliable connectivity in harsh environments and simplified system design, including the industry's first ever use of Unshielded Twisted Pair (UTP) channels for multi-gig use cases. By building this platform around MIPI A-PHY and partnering with Valens Semiconductor, we're giving developers a powerful, flexible toolset to accelerate innovation in embedded vision." On the compute side of the platform, D3 Embedded is offering an NVIDIA® Jetson Orin™ processor (NX or Nano) and 8 A-PHY input ports. The platform has an option for an industrial, fanless enclosure, while each port operates at 8Gbps (7.2Gbps net). On the camera side, D3 Embedded is offering six A-PHY DesignCore® Discovery Series SKUs, all based on the Sony ISX031 sensor. Each camera is offered with an option for a ruggedized IP69K enclosure for the highest level of protection against dust, liquid, and chemicals. The IP69K camera features a removable, anti-reflective coated, and scratch-resistant lens cover for use in harsh environments. D3 Embedded can also develop custom cameras based on other sensors upon customer request. Explore D3 Embedded's A-PHY camera offerings here: The MIPI A-PHY standard delivers outstanding Electromagnetic Compatibility (EMC) performance, ensuring reliable data transmission even in electrically noisy industrial environments. In addition, chipsets based on A-PHY technology enable high-speed data transmission over long cables - up to 30 meters and beyond - without degrading signal quality. These chips also support multi-gig connectivity over both Unshielded Twisted Pair (UTP) and micro-coaxial cabling, giving system designers the flexibility to balance cost, weight, and mechanical requirements according to their specific application needs. Finally, chipsets based on A-PHY offer built-in advanced diagnostics for link monitoring and preventive maintenance, ensuring 24/7 system operation. These advantages make A-PHY-based chipsets ideal for a wide range of applications, including robotics/AMR, industrial vehicles, industrial automation, and medical imaging, where long-reach, high-performance, and cost-effective connectivity is essential. About Valens Semiconductor Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit About D3 Embedded D3 Embedded is a U.S.-based company that develops end-to-end solutions integrating sensors, connectivity, embedded processing and AI to deliver advanced perception for performance-critical applications. Using its proven DesignCore® product platforms and stage-gate development process, D3 Embedded helps its customers minimize the cost, schedule, and technical risks of product development for performance-critical applications. D3 Embedded is an Elite member of the NVIDIA Partner Network, an Intel Gold Partner, and a premium member of Texas Instruments' third-party network. The company holds expertise in autonomous machines and robotics, electrification, sensing, imaging and optics, edge computing and detection algorithms. To support its products and services, the company offers ODM customization of hardware and software, validation testing and in-house manufacturing services. Learn more at Forward-Looking Statements This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements include, but are not limited to, statements regarding our anticipated future results, including financial results, our five-year plan, currency exchange rates, and contract wins, and future economic and market conditions. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of Valens Semiconductor's ("Valens") management and are not predictions of actual performance. These forward-looking statements are provided for illustrative purposes only and are not intended to serve as and must not be relied on by any investor as a guarantee, an assurance, a prediction or a definitive statement of fact or probability. Actual events and circumstances are difficult or impossible to predict and will differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers; any difficulty selling Valens' products if customers do not design its products into their product offerings; Valens' dependence on winning selection processes; even if Valens succeeds in winning selection processes for its products, Valens may not generate timely or sufficient net sales or margins from those wins; sustained yield problems or other delays or quality events in the manufacturing process of products; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; global political and economic uncertainty, including with respect to China-Taiwan relations; political, economic, governmental and tax consequences associated with our incorporation and location in Israel; and those factors discussed in Valens' Form 20-F filed with the SEC on February 26, 2025 under the heading "Risk Factors," and other documents of Valens filed, or to be filed, with the SEC. If any of these risks materialize or our assumptions prove incorrect, actual results could differ materially from the results implied by these forward-looking statements. There may be additional risks that Valens does not presently know or that Valens currently believes are immaterial that could also cause actual results to differ from those contained in the forward-looking statements. In addition, forward-looking statements reflect Valens' expectations, plans or forecasts of future events and views as of the date of this press release. Valens anticipates that subsequent events and developments may cause Valens' assessments to change. However, while Valens may elect to update these forward-looking statements at some point in the future, Valens specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing Valens' assessment as of any date subsequent to the date of this press release. Accordingly, undue reliance should not be placed upon the forward-looking statements. Press Contacts Yoni DayanHead of CommunicationsValens Semiconductor Hadley McKinnonSenior Account ExecutiveFusion Investor Contacts Michal Ben AriInvestor Relations ManagerValens Semiconductor Photo: View original content to download multimedia: SOURCE Valens Semiconductor Sign in to access your portfolio
