Latest news with #photonics
Yahoo
2 days ago
- Business
- Yahoo
OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
- Contributing to the advancement of photonics-electronics convergence technology and working with partners for early commercialization - TOKYO, August 14, 2025--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology (Note 2). OKI aims to achieve early commercialization through collaboration with partner companies and universities. Rapid advances in artificial intelligence (AI) in recent years has fueled growing demand for data centers, making it a serious social issue to suppress increases in power consumption while expanding data processing capabilities. One solution to such a challenge currently drawing attention is technologies that achieve high-density, high-speed transmission, and low power consumption, applying photonics-electronics convergence technology that combines electronic and optical circuits. In particular, the heterogeneous integration of optical semiconductors onto silicon wafers is expected to improve performance still further by enabling the integration of silicon photonics (Note 3) with optical semiconductors. Nevertheless, heterogeneous integration presents various technical challenges. For example, while silicon photonics use large-diameter 200 mm (8-inch) or 300 mm (12-inch) silicon wafers, optical semiconductor wafers such as InP (indium phosphide) wafers are typically smaller 50 mm (2-inch) to 100 mm (4-inch) compound semiconductor wafers due to the difficulty of achieving epitaxial growth. Additionally, silicon optical waveguides require nanoscale roughness control, which in turn requires heterogeneous integration processes that avoid causing damage. The Tiling CFB technology developed by OKI overcomes this disparity in wafer sizes and allows heterogeneous integration without causing damage. The technology allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials. The InP wafer can be reused as is after transfer to allow material recycling and reuse, helping reduce the environmental burden. Placement accuracy is approximately ±1 μm, with an angular accuracy of ±0.005°. This high accuracy, when combined with OKI's proprietary 3D intersecting waveguide (Note 4) silicon photonics technology, realizes high-efficiency optical coupling between optical semiconductors and silicon waveguides. In a demonstration, a sacrificial layer and InP-based Crystal Films functioning as optical semiconductors were epitaxially grown on a 2-inch InP wafer, then separated into individual elements. A protective structure to prevent chemical attack when etching the sacrificial layer and a support structure for batch transfer were formed on each element. This enabled the InP-based Crystal Films to be successfully batch-transferred to an intermediate transfer substrate without erosion. Batch transfer to an intermediate transfer substrate is carried out to protect the silicon wafer from damage during the subsequent removal process, as removing the protective structure and support structure on the intermediate transfer substrate prevents damage to the silicon wafer during the removal process. The unique design of the intermediate transfer substrate ensures that the InP-based Crystal Films do not peel off, maintain adhesion during the process of removing the protective structure and support structure, and are easily transferred during the transfer process. Furthermore, by repeatedly transferring Crystal Films from the intermediate transfer substrate using a CFB stamp, OKI has established Tiling CFB technology that enables tiling over the entire surface of a 300 mm silicon wafer. The CFB stamp has a structure capable of selectively transferring only the Crystal Films required, and repeated transfer enables efficient tiling. The capacity to repeatedly transfer lower-density arrays of Crystal Films required for the device from a high-density array of Crystal Films arranged on the intermediate transfer substrate allows effective use of materials without waste. Measuring 30 mm × 30 mm, the CFB stamp used in this demonstration completed 52 transfers onto the entire surface of a 300 mm silicon wafer in approximately 10 minutes, sufficient for commercial production. This demonstration proved the feasibility of Tiling CFB technology in the transfer from 2-inch wafers to 300 mm silicon wafers. The technology can also be adapted as necessary to allow use with 3- or 4-inch InP wafers and 200 mm silicon wafers. Since it can also be applied with existing optical semiconductor products, it will help improve performance by permitting transfer to high heat-dissipation substrates and productivity by allowing use of larger wafer sizes. Tiling CFB technology will also contribute to the advancement of photonics-electronics convergence technology and reduced environmental burden. OKI plans to strengthen collaboration with device manufacturers to achieve early commercialization of the technology. [Terminology] Note 1: crystal film bonding (CFB) OKI's proprietary technology commercialized in 2006 in the printer business; allows heterogeneous integration by lifting off Crystal Films such as semiconductors and bonding them directly onto different material substrates or wafers. The absence of adhesives permits electrical, optical, and thermal conduction. Note 2: Photonics-electronics convergence technology Technology combining electronic circuits (electrical signal processing) and optical circuits (optical signal processing) to achieve optimization and sophistication through integration; enables greater data transfer speeds, reduced power consumption, and increased capacity. Note 3: Silicon photonics Photonic integrated circuit technology that uses silicon as the waveguide layer; allows the integration of optical devices such as modulators, photodetectors, and optical filters and optical waveguides on silicon chips. Note 4: 3D intersecting waveguide OKI's proprietary silicon photonics technology whereby optical semiconductors and silicon optical waveguides intersecting in three-dimensional configuration increase the positional misalignment tolerance by more than tenfold compared to conventional technology, allowing high-efficiency optical coupling even with misalignment of approximately ±3 μm. Currently under development in collaboration with the Nishiyama Laboratory at Institute of Science Tokyo, this technology was presented jointly at the 72nd JSAP Spring Meeting in March 2025 (17p-K305-6, 17p-K305-7). [Related link]• CFB explanatory website: About Oki Electric Industry (OKI)Founded in 1881, OKI is Japan's leading information and telecommunication manufacturer. Headquartered in Tokyo, Japan, OKI provides top-quality products, technologies, and solutions to customers through its Public Solutions, Enterprise Solutions, Component Products, and Electronics Manufacturing Services businesses. Its various business divisions function synergistically to bring to market exciting new products and technologies that meet a wide range of customer needs in various sectors. Visit OKI's global website at Notes:- Oki Electric Industry Co., Ltd. is referred to as "OKI" in this document.- The names of the companies and products mentioned in this document are the trademarks or registered trademarks of the respective companies and organizations. View source version on Contacts Press contact: Oki Electric Industry Co., RelationsE-mail: press@ Customer contact: CFB Business Development Department, Global Marketing CenterContact Form :
Yahoo
2 days ago
- Business
- Yahoo
OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
- Contributing to the advancement of photonics-electronics convergence technology and working with partners for early commercialization - TOKYO, August 14, 2025--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology (Note 2). OKI aims to achieve early commercialization through collaboration with partner companies and universities. Rapid advances in artificial intelligence (AI) in recent years has fueled growing demand for data centers, making it a serious social issue to suppress increases in power consumption while expanding data processing capabilities. One solution to such a challenge currently drawing attention is technologies that achieve high-density, high-speed transmission, and low power consumption, applying photonics-electronics convergence technology that combines electronic and optical circuits. In particular, the heterogeneous integration of optical semiconductors onto silicon wafers is expected to improve performance still further by enabling the integration of silicon photonics (Note 3) with optical semiconductors. Nevertheless, heterogeneous integration presents various technical challenges. For example, while silicon photonics use large-diameter 200 mm (8-inch) or 300 mm (12-inch) silicon wafers, optical semiconductor wafers such as InP (indium phosphide) wafers are typically smaller 50 mm (2-inch) to 100 mm (4-inch) compound semiconductor wafers due to the difficulty of achieving epitaxial growth. Additionally, silicon optical waveguides require nanoscale roughness control, which in turn requires heterogeneous integration processes that avoid causing damage. The Tiling CFB technology developed by OKI overcomes this disparity in wafer sizes and allows heterogeneous integration without causing damage. The technology allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials. The InP wafer can be reused as is after transfer to allow material recycling and reuse, helping reduce the environmental burden. Placement accuracy is approximately ±1 μm, with an angular accuracy of ±0.005°. This high accuracy, when combined with OKI's proprietary 3D intersecting waveguide (Note 4) silicon photonics technology, realizes high-efficiency optical coupling between optical semiconductors and silicon waveguides. In a demonstration, a sacrificial layer and InP-based Crystal Films functioning as optical semiconductors were epitaxially grown on a 2-inch InP wafer, then separated into individual elements. A protective structure to prevent chemical attack when etching the sacrificial layer and a support structure for batch transfer were formed on each element. This enabled the InP-based Crystal Films to be successfully batch-transferred to an intermediate transfer substrate without erosion. Batch transfer to an intermediate transfer substrate is carried out to protect the silicon wafer from damage during the subsequent removal process, as removing the protective structure and support structure on the intermediate transfer substrate prevents damage to the silicon wafer during the removal process. The unique design of the intermediate transfer substrate ensures that the InP-based Crystal Films do not peel off, maintain adhesion during the process of removing the protective structure and support structure, and are easily transferred during the transfer process. Furthermore, by repeatedly transferring Crystal Films from the intermediate transfer substrate using a CFB stamp, OKI has established Tiling CFB technology that enables tiling over the entire surface of a 300 mm silicon wafer. The CFB stamp has a structure capable of selectively transferring only the Crystal Films required, and repeated transfer enables efficient tiling. The capacity to repeatedly transfer lower-density arrays of Crystal Films required for the device from a high-density array of Crystal Films arranged on the intermediate transfer substrate allows effective use of materials without waste. Measuring 30 mm × 30 mm, the CFB stamp used in this demonstration completed 52 transfers onto the entire surface of a 300 mm silicon wafer in approximately 10 minutes, sufficient for commercial production. This demonstration proved the feasibility of Tiling CFB technology in the transfer from 2-inch wafers to 300 mm silicon wafers. The technology can also be adapted as necessary to allow use with 3- or 4-inch InP wafers and 200 mm silicon wafers. Since it can also be applied with existing optical semiconductor products, it will help improve performance by permitting transfer to high heat-dissipation substrates and productivity by allowing use of larger wafer sizes. Tiling CFB technology will also contribute to the advancement of photonics-electronics convergence technology and reduced environmental burden. OKI plans to strengthen collaboration with device manufacturers to achieve early commercialization of the technology. [Terminology] Note 1: crystal film bonding (CFB) OKI's proprietary technology commercialized in 2006 in the printer business; allows heterogeneous integration by lifting off Crystal Films such as semiconductors and bonding them directly onto different material substrates or wafers. The absence of adhesives permits electrical, optical, and thermal conduction. Note 2: Photonics-electronics convergence technology Technology combining electronic circuits (electrical signal processing) and optical circuits (optical signal processing) to achieve optimization and sophistication through integration; enables greater data transfer speeds, reduced power consumption, and increased capacity. Note 3: Silicon photonics Photonic integrated circuit technology that uses silicon as the waveguide layer; allows the integration of optical devices such as modulators, photodetectors, and optical filters and optical waveguides on silicon chips. Note 4: 3D intersecting waveguide OKI's proprietary silicon photonics technology whereby optical semiconductors and silicon optical waveguides intersecting in three-dimensional configuration increase the positional misalignment tolerance by more than tenfold compared to conventional technology, allowing high-efficiency optical coupling even with misalignment of approximately ±3 μm. Currently under development in collaboration with the Nishiyama Laboratory at Institute of Science Tokyo, this technology was presented jointly at the 72nd JSAP Spring Meeting in March 2025 (17p-K305-6, 17p-K305-7). [Related link]• CFB explanatory website: About Oki Electric Industry (OKI)Founded in 1881, OKI is Japan's leading information and telecommunication manufacturer. Headquartered in Tokyo, Japan, OKI provides top-quality products, technologies, and solutions to customers through its Public Solutions, Enterprise Solutions, Component Products, and Electronics Manufacturing Services businesses. Its various business divisions function synergistically to bring to market exciting new products and technologies that meet a wide range of customer needs in various sectors. Visit OKI's global website at Notes:- Oki Electric Industry Co., Ltd. is referred to as "OKI" in this document.- The names of the companies and products mentioned in this document are the trademarks or registered trademarks of the respective companies and organizations. View source version on Contacts Press contact: Oki Electric Industry Co., RelationsE-mail: press@ Customer contact: CFB Business Development Department, Global Marketing CenterContact Form :
Yahoo
3 days ago
- Business
- Yahoo
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
SAXONBURG, Pa., Aug. 13, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR) ('Coherent,' 'We,' or the 'Company'), a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent's EPS. Coherent's Aerospace and Defense designs and manufactures optical and laser systems for defense applications. The business includes approximately 550 employees and 10 geographic sites. 'We are pleased to have reached this agreement with Advent. As part of our strategic portfolio optimization process, this transaction furthers our strategy to concentrate efforts on core growth markets and products,' said Jim Anderson, CEO of Coherent. 'Coherent's Aerospace and Defense business is an exceptional business with a distinguished heritage in pioneering optical and laser technology for the world's most demanding applications,' said Shonnel Malani, Managing Partner at Advent. 'This acquisition is complementary to our existing investments in the sector and underscores our commitment to investing in mission-critical national security technologies. We are excited to partner with the talented management team, and we plan to invest significantly in R&D to further solidify the business's leadership in advanced laser and optical solutions.' Closing Conditions The transaction is expected to close in the third quarter of calendar year 2025, subject to customary closing conditions. Following close, the Aerospace and Defense business will operate under a new name, which will be announced at a later date. Until that time, the Aerospace and Defense business will continue to operate under the Coherent brand. About Coherent Coherent is the global photonics leader. We harness photons to drive innovation. Industry leaders in the datacenter & communications and industrial markets rely on Coherent's world-leading technology to fuel their own innovation and growth. Founded in 1971 and operating in more than 20 countries, Coherent brings the industry's broadest, deepest technology stack; unmatched supply chain resilience; and global scale to help its customers solve their toughest technology challenges. Visit our website at About Advent Advent is a leading global private equity investor committed to working in partnership with management teams, entrepreneurs, and founders to help transform businesses. With 16 offices across five continents, we oversee more than USD $94 billion in assets under management* and have made over 430 investments across 44 countries. Since our founding in 1984, we have developed specialist market expertise across our five core sectors: business & financial services, consumer, healthcare, industrial, and technology. This approach is bolstered by our deep sub-sector knowledge, which informs every aspect of our investment strategy, from sourcing opportunities to working in partnership with management to execute value creation plans. We bring hands-on operational expertise to enhance and accelerate businesses. As one of the largest privately-owned partnerships, our 660+ colleagues leverage the full ecosystem of Advent's global resources who bring hands-on operational expertise to help enhance and accelerate businesses. This includes our Portfolio Support Group, insights provided by industry expert Operating Partners and Operations Advisors, as well as bespoke tools to support and guide our portfolio companies as they seek to achieve their strategic goals. Advent has a strong track record of investing in the national security sector, including past and current investments in Cobham (2020), Ultra Electronics (2022) and Maxar Technologies (2023). The firm will leverage its global network, operating expertise, and long-term investment horizon to support the company's strategic initiatives. To learn more, visit our website or connect with us on LinkedIn. *Assets under management (AUM) as of March 31, 2025. AUM includes assets attributable to Advent advisory clients as well as employee and third-party co-investment vehicles. Forward-Looking StatementsThis press release contains statements, estimates, and projections that constitute 'forward-looking statements' as defined under U.S. federal securities laws. The words "expect," "anticipate," "estimate" and similar words and expressions are intended to identify such forward-looking statements. In addition, any statements that refer to expectations or other characterizations of future events or circumstances, including statements about the timing of closing of the sale of our Aerospace and Defense business, the use of proceeds therefrom, the impact of the sale on our financial results, and our expectations with respect to optimizing our strategic portfolio and focusing on core growth markets, are forward-looking statements, which are made pursuant to the safe harbor provisions of the U.S. Private Securities Litigation Reform Act of 1995. The forward-looking statements contained herein are not guarantees of future performance and are subject to certain risks and uncertainties that could cause the Company's actual results to differ materially from its historical experience and our present expectations or projections. The Company believes that all forward-looking statements made by it herein have a reasonable basis, but there can be no assurance that management's expectations, beliefs, or projections as expressed in the forward-looking statements will actually occur or prove to be correct. In addition to general industry and global economic conditions, factors that could cause actual results to differ materially from those discussed in the forward-looking statements herein include but are not limited to: (i) the failure of any one or more of the assumptions stated herein to prove to be correct; (ii) the terms of the Company's indebtedness and ability to service such debt, (iii) risks relating to future integration and/or restructuring actions; (iv) fluctuations in purchasing patterns of customers and end users; (v) the ability of the Company to retain and hire key employees; (vi) changes in demand in the Company's end markets along with the Company's ability to respond to such market changes; (vii) the timely release of new products and acceptance of such new products by the market; (viii) the introduction of new products by competitors and other competitive responses; (ix) the Company's ability to assimilate other recently acquired businesses, and realize synergies, cost savings, and opportunities for growth in connection therewith, together with the risks, costs, and uncertainties associated with such acquisitions; (x) the risks to realizing the benefits of investments in research and development and commercialization of innovations; (xi) the risks that the Company's stock price will not trade in line with industrial technology leaders; (xii) the impact of trade protection measures, such as import tariffs by the United States or retaliatory actions taken by other countries; and/or (xiii) the risks relating to forward-looking statements and other 'Risk Factors' identified from time to time in our filings with the SEC, including our Annual Report on Form 10-K for the fiscal year ended June 30, 2024, and our subsequently filed Quarterly Reports on Form 10-Q, which filings are available from the SEC. You should not place undue reliance on forward-looking statements, which speak only as of the date they are made. The Company disclaims any obligation to update information contained in these forward-looking statements, whether as a result of new information, future events or developments, or otherwise. Media Contacts For Coherent:Amy WilsonManager, Corporate For Advent:Peter FollandSenior Communications Manager, Adventpfolland@ # # #
Yahoo
09-07-2025
- Business
- Yahoo
QUBT Stock Surges 3427% in a Year: Correction in Store or More Upside?
Quantum Computing Inc. QUBT shares are skyrocketing in 2025 as the company shifts from deep-tech R&D to a commercially focused quantum-photonics player. Key drivers include the launch of its entangled photon source for quantum communication, the operational rollout of its TFLN chip foundry, and rising adoption of its Dirac-3 optimization machine across sectors like aerospace and healthcare. With strengthened financials, strategic partnerships and the very recent inclusion in the Russell 2000 and 3000 Indexes, QUBT is fast emerging as a serious contender in the quantum tech arena. Let's delve deeper. Image Source: Zacks Investment Research Despite facing a challenging industry-wide investment climate driven by tariffs, Quantum Computing delivered a staggering 3427% rally over the past 12 months, outperforming the industry, its benchmark, and the company's main competitors. During this period, the broader Internet Software industry grew 35.5% and the S&P 500 index rose 13.8%. In a year, the company's archrivals like D-Wave Quantum QBTS and IonQ IONQ have risen 1251.6% and 489.3%, respectively. However, despite this magnificent rally, QUBT stock still trades 27.8% below its 52-week high, suggesting there could be further upside potential as the company continues to expand into high-value markets like quantum-secure communications and advanced optimization. Commercial-Scale Quantum Photonics and Deployable Optimization Machines: A central pillar of Quantum Computing's growth strategy in 2025 is the commercialization of quantum-ready photonics through its U.S.-based Quantum Photonic Chip Foundry in Tempe, AZ. Now fully built and operational, the facility enables in-house production of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs), a critical capability in a field historically led by global suppliers. Early traction is evident, with five initial purchase orders, including one from a top Canadian research institute, and revenues already underway, with broader scaling expected in 2026. This positions Quantum Computing to serve high-growth markets in data communications, telecom, AI and quantum tech. Complementing the foundry, QUBT's Dirac-3 optimization machine offers a field-ready, room-temperature quantum system with low power needs (<100W) and compact size. It's already in use by institutions like NASA and Memorial Sloan Kettering for advanced sensing and molecular modeling. These real-world deployments demonstrate Quantum Computing's lead in SWaP-C-optimized quantum solutions, spanning government, academic and industrial applications. Strengthened Financial Foundation: Between the fourth quarter of 2024 and the first quarter of 2025, Quantum Computing significantly strengthened its financial position, raising $92.1 million in the fourth quarter and an additional $93.6 million in the first quarter, bringing cash and cash equivalents to $166.4 million as of March 2025. The company also saw a reduction in liabilities, primarily from non-cash mark-to-market adjustments related to warrants and reported a net income of $17 million in the first quarter, signaling improved financial stability. Index Inclusion: In May 2025, Quantum Computing was confirmed for inclusion in both the Russell 3000 and Russell 2000 Indexes, marking a significant milestone in its public market trajectory. This inclusion broadens the company's visibility among institutional investors. As a result, QUBT stands to benefit from increased liquidity, a more diversified shareholder base and potential inflows of capital, which can provide long-term support for its stock as it scales commercialization of its quantum and photonic technologies. The Zacks Consensus Estimate for Quantum Computing's 2025 earnings implies a 90.4% improvement year over year. Image Source: Zacks Investment Research Based on short-term price targets, Quantum Computing is currently trading 12.45% above its average Zacks price target. Image Source: Zacks Investment Research While QUBT has demonstrated impressive momentum in 2025, its Zacks Rank #3 (Hold) suggests a neutral stance in the near term. The stock's current price indicates limited short-term upside and potential overvaluation risks, especially following its 3427% rally over the past year. Meanwhile, competitors like IonQ are accelerating toward a fault-tolerant, cloud-integrated quantum system. On the other hand, D-Wave Quantum is rapidly commercializing its annealing-based platforms for enterprise use. Both IONQ and QBTS have made strategic acquisitions and technical breakthroughs that position them strongly in the evolving quantum stack. Given this competitive landscape and the stock's stretched valuation, investors may want to wait for a pullback or clearer earnings visibility before expanding their position in Quantum Computing. You can see the complete list of today's Zacks #1 Rank (Strong Buy) stocks here. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report Quantum Computing Inc. (QUBT) : Free Stock Analysis Report IonQ, Inc. (IONQ) : Free Stock Analysis Report D-Wave Quantum Inc. (QBTS) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research
Associated Press
09-07-2025
- Business
- Associated Press
Celebrate Excellence: 2026 SPIE Prism Awards Open for Outstanding Photonics Products
BELLINGHAM, Wash.--(BUSINESS WIRE)--Jul 9, 2025-- Applications are now open for the 2026 SPIE Prism Awards. The awards, presented by SPIE, the international society for optics and photonics, recognize the most innovative products on the market, across the growing range of optics and photonics applications. The annual industry event will celebrate its 18th anniversary on 21 January, during a gala evening at SPIE Photonics West. This press release features multimedia. View the full release here: SPIE is now welcoming submissions for its 2026 Prism Awards. In 2026, award category areas will include biophotonics instruments, cameras and imaging systems, lasers, optical materials and components, quantum tech, sensors, test and measurement, and XR tech. And now in its third year, SPIE will showcase the SPIE Catalyst Award, recognizing for-profit companies with programs that expand workplace access and opportunity, strengthen community engagement and education, and drive environmental progress. 'Each year at SPIE Photonics West, the SPIE Prism Awards honor the most innovative and transformative optics and photonics technologies on the market,' said SPIE CEO Kent Rochford. 'Bringing these products to market is already an accomplishment, one that we are always excited to celebrate. Now, I welcome companies with a new light-based product to showcase their team's efforts: submit an application for consideration to the SPIE Prism Awards. I look forward to recognizing the finalists' accomplishments.' Last year's Prism Award winners — across categories that included Biomedical, Lasers, Software, and Quantum Tech — were Norlase, NIL Technology, Scantinel Photonics GmbH, Omega Optical, Leonardo DRS (Daylight Solutions), FlulDect GmbH, HyperSpectral Corporation, Quartus Engineering, and Schott AG. Winners from previous years have included newly emerging companies or startups such as Double Helix Optics, PhotoniCare, Luminar, Blackmore, and WaveOptics, as well as more established industry giants like General Electric, IPG Photonics, Edmund Optics, and Leica. The deadline for applications is 3 September. For more information, qualification requirements, and to submit your product for the Prism Awards, please visit our dedicated website pages. About SPIE SPIE, the international society for optics and photonics, brings engineers, scientists, students, and business professionals together to advance light-based science and technology. The Society, founded in 1955, connects and engages with our global constituency through industry-leading conferences and exhibitions; publications of conference proceedings, books, and journals in the SPIE Digital Library; and career-building opportunities. Over the past five years, we have invested more than $25 million in the international optics community through our advocacy and support, including scholarships, educational resources, travel grants, endowed gifts, and public-policy development. View source version on CONTACT: Daneet Steffens Public Relations Manager [email protected] +1 360 685 5478 @ KEYWORD: WASHINGTON EUROPE UNITED STATES NORTH AMERICA ASIA PACIFIC INDUSTRY KEYWORD: TECHNOLOGY MOBILE/WIRELESS ENGINEERING CARRIERS AND SERVICES OTHER TECHNOLOGY NANOTECHNOLOGY MANUFACTURING AUDIO/VIDEO HARDWARE SOURCE: SPIE Copyright Business Wire 2025. PUB: 07/09/2025 12:07 PM/DISC: 07/09/2025 12:07 PM
