Silicon carbide chips created to work in extreme heat, radiation
HIROSHIMA—Researchers said they have developed a durable silicon carbide-based semiconductor that enables electronic devices to function in extreme conditions, such as at crippled nuclear power plants and outer space.
The new chip was produced by Hiroshima University and Phenitec Semiconductor Corp.
Silicon carbide (SiC), comprising silicon and carbon, has higher thermal and electronic properties than traditional silicon used in chips.
SiC semiconductors can operate in temperatures of 500 degrees and after absorbing radiation exceeding 1,000 kilograys.
Normal silicon chips are designed to withstand temperatures of 150 degrees and radiation absorption of up to 1 kilogray.
Shinichiro Kuroki, professor of electronic systems at the university's Research Institute for Semiconductor Engineering who led the project, underlined the importance of developing such high-performance semiconductors.
'As one of the most urgent tasks, we need to develop chips that can carry out the decommissioning work at the Fukushima No. 1 nuclear power plant,' Kuroki said at a recent news conference. 'The new chips are expected to play an important role in other industrial applications, as well.'
The university and Phenitec Semiconductor, which is based in Okayama Prefecture, joined forces in May 2024 to design and make a prototype of the SiC chips.
The tie-up reflects a growing urgency to transfer the technology to a private-sector company for mass production for a wide range of products.
The front-end, or wafer, process was completed in April, with Phenitec handing the prototype wafer to the university.
The project has received funding from the central government as a program aimed at advancing scientific research and development at key universities in local regions.
SiC-based semiconductors are also expected to reduce the need for cooling systems in integrated-circuit components in electric vehicles and to be used for space exploration probes, including on Venus.
Hiroyuki Ishii, president of Phenitec, hailed the completion of the prototype at the news conference.
'There are several stages toward the production of integrated circuits and we have made a big step forward,' he said. 'We hope to bring the new chips to commercial applications.'
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