Intel partners with AI firm ModelBest, chip designer Black Sesame on smart car systems
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The strategic partnerships were announced on Wednesday at the opening of the 10-day
Shanghai Auto Show , where the US
semiconductor giant made its debut to unveil the second-generation, AI-enhanced software-defined vehicle (SDV) system-on-a-chip (SoC), which it said would provide automakers with 'scalable performance, advanced AI capabilities and optimised cost efficiency'.
'Together with our partners, we're solving real industry challenges – from energy efficiency to AI-driven experiences – to make the software-defined vehicle revolution a reality for all,' Intel Fellow and vice-president
Jack Weast , who serves as general manager of Intel Automotive, said at the event.
Intel's collaboration with ModelBest and Black Sesame reflects growing demand in China – the world's largest electric vehicle (EV) market – for more computing power in increasingly sophisticated cockpits, as US semiconductor rivals
Nvidia and
Advanced Micro Devices ramp up their efforts in the auto chip market segment.
That initiative followed Intel's decision last year to move the headquarters of its automotive unit to mainland China and relocate Weast to Beijing.
Intel Automotive general manager Jack Weast, right, and ModelBest chief executive Li Dahai announce the two firms' strategic collaboration during the opening of this year's Shanghai Auto Show on Wednesday. Photo: Intel
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