AI-Powered Healthcare: How ADLINK's Medical Innovations at HIMSS 2025 Are Transforming Patient Care
Celebrating 30 Years of Innovation Excellence with Advanced OEM Solutions for Healthcare
Summary:
Successful Showcase: ADLINK's latest AI-driven medical solutions attracted strong industry interest at HIMSS 2025
Engagement & Collaboration: Engaged with healthcare leaders, medical device manufacturers, and key industry partners
Technology Highlights: Demonstrated advanced medically certified UHD surgical monitors, NVIDIA IGX-powered computing, and high-performance medical box PCs
Long-Term Value: Reinforced commitment to extended lifecycle support, regulatory compliance, and strategic partnerships
LAS VEGAS, March 14, 2025 /PRNewswire/ -- As healthcare companies continue to seek cutting-edge solutions to enhance patient care, ADLINK Technology Inc. showcased its latest AI-powered medical innovations at HIMSS 2025, providing real-world applications that help medical professionals improve diagnostics, streamline workflows, and deliver better outcomes. With a focus on solving critical industry challenges, ADLINK's advanced OEM solutions are accelerating the adoption of AI in healthcare, driving efficiency, and enabling new treatment possibilities.
Addressing Healthcare's Biggest Challenges with AI At HIMSS 2025, ADLINK demonstrated how its AI-driven technology is making a difference in real-world medical environments. From precision imaging in surgery to real-time AI inferencing for diagnostics, ADLINK's solutions are helping healthcare professionals optimize care delivery and improve decision-making. Key innovations on display included:
Medically Certified UHD Surgical Monitors: Delivered exceptional image reproduction and color accuracy for enhanced surgical precision.
Versatile All-in-One Medical Panel PCs: Designed for safety and compliance, meeting stringent EU Medical Device Regulation (MDR) standards.
MLB-IGX Medical Box PC: Leveraging NVIDIA IGX technology, providing ultra-fast, low-latency performance ideal for AI-driven real-time inferencing.
High-Performance Medical Box PCs: Engineered for advanced image processing, real-time data integration, and AI-powered surgical navigation.
Advanced GPU Solutions: Featuring NVIDIA RTX 2000 and RTX 5000 Lovelace Architecture for high-performance medical imaging applications.
Enabling Healthcare Innovation Through AI & Imaging ADLINK's focus at HIMSS 2025 was on demonstrating tangible benefits for healthcare providers and device manufacturers. The company's FPGA-powered image processing and custom DICOM calibration are advancing imaging technology, ensuring precise diagnostics and faster patient assessments. Scalable embedded GPUs provide AI-driven insights, helping clinicians detect anomalies and make more informed decisions.
"Our technology is designed to solve real-world challenges in healthcare," said Jacky Lin, VP of Business Development at ADLINK Technology. "By leveraging AI and advanced imaging, we are enabling medical professionals to improve accuracy, efficiency, and patient outcomes."
Collaborating for a Smarter Future in Healthcare Throughout HIMSS 2025, ADLINK engaged with leading medical device manufacturers and healthcare organizations to discuss the future of AI-driven healthcare solutions. The company's strategic partnerships with Intel, NVIDIA, AMD, and NXP are fostering new developments in AI-powered diagnostics, automation, and patient care. These collaborations ensure that ADLINK's technology aligns with industry needs and regulatory requirements.
Beyond HIMSS 2025: The Future of AI in Healthcare The strong reception at HIMSS 2025 underscores the growing demand for AI-integrated medical technology. ADLINK remains committed to partnering with healthcare innovators to deliver next-generation solutions that optimize workflows, enhance precision, and improve patient care. With an emphasis on long-term reliability and compliance, ADLINK's healthcare-focused solutions will continue to drive transformation in the industry.
For more information about ADLINK's healthcare solutions, visit ADLINK Healthcare.
About ADLINK Technology ADLINK Technology Inc. is a global leader in edge computing. Our mission is to affect positive change in society and industry by connecting people, places and things with AI. The company offerings include robust boards, real-time data acquisition solutions and application enablement for AIoT. ADLINK serves customers in many industries, including healthcare, manufacturing, communications, transportation, defense, and aerospace.
ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance, a partner of NVIDIA, and a contributor to standards initiatives such as Eclipse, OCP, OMG and ROS2 TSC. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on TAIEX (Stock Code: 6166).
Learn more at adlinktech.com/en/healthcare-technology.
View original content to download multimedia:https://www.prnewswire.com/news-releases/ai-powered-healthcare-how-adlinks-medical-innovations-at-himss-2025-are-transforming-patient-care-302401599.html
SOURCE ADLINK Technology
Hashtags
Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles
Yahoo
2 hours ago
- Yahoo
Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan. TSMC, which produces more than 90% of the world's advanced semiconductor chips that power everything from smartphones and artificial intelligence (AI) applications to weapons, will build two new advanced packaging facilities in Arizona, among others. Here's everything you need to know about advanced packaging technology, which has seen exponential demand growth along with the global AI frenzy, and what that means for the struggle between the US and China for AI dominance. While the two countries have announced a temporary truce that rolled back disruptive three-digit tariffs for 90 days, the relationship remains tense because of ongoing feuding over chip restrictions imposed by the US and other issues. Last month at Computex, an annual trade show in Taipei that has been thrust under the limelight because of the AI boom, the CEO of chipmaker Nvidia, Jensen Huang, told reporters that 'the importance of advanced packaging for AI is very high,' proclaiming that 'no one has pushed advanced packaging harder than me.' Packaging generally refers to one of the manufacturing processes of semiconductor chips, which means sealing a chip inside a protective casing and mounting it to the motherboard that goes into an electronic device. Advanced packaging, specifically, refers to techniques that allow more chips — such as graphic processing units (GPU), central processing units (CPU) or high bandwidth memory (HBM) — to be placed closer together, leading to better overall performance, faster transmission of data and lower energy consumption. Think of these chips as different departments within a company. The closer these departments are to each other, the easier it is, and less time it takes, for people to travel between them and exchange ideas, and the more efficient the operation becomes. 'You're trying to put the chips as close together as possible, and you're also putting in different solutions to make the connection between the chips very easy,' Dan Nystedt, vice president of Asia-based private investment firm TrioOrient, told CNN. In a way, advanced packaging keeps afloat Moore's Law, the idea that the number of transistors on microchips would double every two years, as breakthroughs in the chip fabrication process become increasingly costly and more difficult. While there are many types of advanced packaging technologies, CoWoS, short for Chips-on-Wafer-on-Substrate and invented by TSMC, is arguably the best known that was thrown under the limelight since the debut of OpenAI's ChatGPT, which sparked the AI frenzy. It has even become a household name in Taiwan, prompting Lisa Su, CEO of Advanced Micro Devices (AMD), to say that the island is the 'only place that you can say CoWoS and everybody would understand.' Advanced packaging has become a big deal in the tech world because it ensures AI applications, which require a lot of complex computing, run without delays or glitches. CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. 'You could call it the Nvidia packaging process if you want to. Almost anyone making AI chips is using the CoWoS process,' said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity. In a visit to Taiwan in January, Huang told reporters that the amount of advanced packaging capacity currently available was 'probably four times' what it was less than two years ago. 'The technology of packaging is very important to the future of computing,' he said. 'We now need to have very complicated advanced packaging to put many chips together into one giant chip.' If advanced fabrication is one piece of the puzzle in terms of chip manufacturing, advanced packaging is another. Analysts say having both pieces of that jigsaw in Arizona means the US will have a 'one-stop shop' for chip production and a strengthened position for its AI arsenal, benefitting Apple, Nvidia, AMD, Qualcomm and Broadcom, some of TSMC's top clients. 'It ensures that the US has a complete supply chain from advanced manufacturing to advanced packaging, which would benefit the US' competitiveness in AI chips,' Eric Chen, an analyst with market research firm Digitimes Research, told CNN. Because advanced packaging technologies key to AI are currently only produced in Taiwan, having it in Arizona also reduces potential supply chain risks. 'Instead of having all eggs in one basket, CoWoS would be in Taiwan and also the US, and that makes you feel more safe and secure,' said Nystedt. While CoWoS got its moment recently, the technology has actually existed for at least 15 years. It was the brainchild of a team of engineers led by Chiang Shang-yi, who served two stints at TSMC and retired from the company as its co-chief operating officer. Chiang first proposed developing the technology in 2009 in an attempt to fit more transistors into chips and solve bottlenecks in performance. But when it was developed, few companies took up the technology because of the high cost associated with it. 'I only had one customer … I really became a joke (in the company), and there was so much pressure on me,' he recalled in a 2022 oral history project recorded for the Computer History Museum in Mountain View, California. But the AI boom turned CoWoS around, making it one of the most popular technologies. 'The result was beyond our original expectation,' Chiang said. In the global semiconductor supply chain, companies that specialize in packaging and testing services are referred to as outsourced semiconductor assembly and test (OSAT) firms. In addition to TSMC, South Korea's Samsung and America's Intel, as well as OSAT firms including China's JCET Group, America's Amkor and Taiwan's ASE Group and SPIL are all key players in advanced packaging technologies.
Yahoo
3 hours ago
- Yahoo
Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan. TSMC, which produces more than 90% of the world's advanced semiconductor chips that power everything from smartphones and artificial intelligence (AI) applications to weapons, will build two new advanced packaging facilities in Arizona, among others. Here's everything you need to know about advanced packaging technology, which has seen exponential demand growth along with the global AI frenzy, and what that means for the struggle between the US and China for AI dominance. While the two countries have announced a temporary truce that rolled back disruptive three-digit tariffs for 90 days, the relationship remains tense because of ongoing feuding over chip restrictions imposed by the US and other issues. Last month at Computex, an annual trade show in Taipei that has been thrust under the limelight because of the AI boom, the CEO of chipmaker Nvidia, Jensen Huang, told reporters that 'the importance of advanced packaging for AI is very high,' proclaiming that 'no one has pushed advanced packaging harder than me.' Packaging generally refers to one of the manufacturing processes of semiconductor chips, which means sealing a chip inside a protective casing and mounting it to the motherboard that goes into an electronic device. Advanced packaging, specifically, refers to techniques that allow more chips — such as graphic processing units (GPU), central processing units (CPU) or high bandwidth memory (HBM) — to be placed closer together, leading to better overall performance, faster transmission of data and lower energy consumption. Think of these chips as different departments within a company. The closer these departments are to each other, the easier it is, and less time it takes, for people to travel between them and exchange ideas, and the more efficient the operation becomes. 'You're trying to put the chips as close together as possible, and you're also putting in different solutions to make the connection between the chips very easy,' Dan Nystedt, vice president of Asia-based private investment firm TrioOrient, told CNN. In a way, advanced packaging keeps afloat Moore's Law, the idea that the number of transistors on microchips would double every two years, as breakthroughs in the chip fabrication process become increasingly costly and more difficult. While there are many types of advanced packaging technologies, CoWoS, short for Chips-on-Wafer-on-Substrate and invented by TSMC, is arguably the best known that was thrown under the limelight since the debut of OpenAI's ChatGPT, which sparked the AI frenzy. It has even become a household name in Taiwan, prompting Lisa Su, CEO of Advanced Micro Devices (AMD), to say that the island is the 'only place that you can say CoWoS and everybody would understand.' Advanced packaging has become a big deal in the tech world because it ensures AI applications, which require a lot of complex computing, run without delays or glitches. CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. 'You could call it the Nvidia packaging process if you want to. Almost anyone making AI chips is using the CoWoS process,' said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity. In a visit to Taiwan in January, Huang told reporters that the amount of advanced packaging capacity currently available was 'probably four times' what it was less than two years ago. 'The technology of packaging is very important to the future of computing,' he said. 'We now need to have very complicated advanced packaging to put many chips together into one giant chip.' If advanced fabrication is one piece of the puzzle in terms of chip manufacturing, advanced packaging is another. Analysts say having both pieces of that jigsaw in Arizona means the US will have a 'one-stop shop' for chip production and a strengthened position for its AI arsenal, benefitting Apple, Nvidia, AMD, Qualcomm and Broadcom, some of TSMC's top clients. 'It ensures that the US has a complete supply chain from advanced manufacturing to advanced packaging, which would benefit the US' competitiveness in AI chips,' Eric Chen, an analyst with market research firm Digitimes Research, told CNN. Because advanced packaging technologies key to AI are currently only produced in Taiwan, having it in Arizona also reduces potential supply chain risks. 'Instead of having all eggs in one basket, CoWoS would be in Taiwan and also the US, and that makes you feel more safe and secure,' said Nystedt. While CoWoS got its moment recently, the technology has actually existed for at least 15 years. It was the brainchild of a team of engineers led by Chiang Shang-yi, who served two stints at TSMC and retired from the company as its co-chief operating officer. Chiang first proposed developing the technology in 2009 in an attempt to fit more transistors into chips and solve bottlenecks in performance. But when it was developed, few companies took up the technology because of the high cost associated with it. 'I only had one customer … I really became a joke (in the company), and there was so much pressure on me,' he recalled in a 2022 oral history project recorded for the Computer History Museum in Mountain View, California. But the AI boom turned CoWoS around, making it one of the most popular technologies. 'The result was beyond our original expectation,' Chiang said. In the global semiconductor supply chain, companies that specialize in packaging and testing services are referred to as outsourced semiconductor assembly and test (OSAT) firms. In addition to TSMC, South Korea's Samsung and America's Intel, as well as OSAT firms including China's JCET Group, America's Amkor and Taiwan's ASE Group and SPIL are all key players in advanced packaging technologies. Error while retrieving data Sign in to access your portfolio Error while retrieving data Error while retrieving data Error while retrieving data Error while retrieving data
Yahoo
5 hours ago
- Yahoo
Why Smart People Make Dumb Money Decisions, According to Humphrey Yang
According to the TIAA Institute-GFLEC Personal Finance Index, about half of American adults lack financial literacy, and even more fall short when it comes to decisions regarding risk. According to financial YouTuber Humphrey Yang, being smart can put you at a greater risk of making poor choices. Read More: Find Out: In a recent YouTube video, Yang covered three biases that often trap smart people into making money decisions that leave them poor. But even if you consider yourself intelligent and financially literate, that doesn't guarantee you'll do the best things with your money. Here are the signs to watch out for if you're making dumb money decisions, and tips to avoid falling for them. Authority bias is when you believe what a person — like a CEO, celebrity or financial advisor — says because of their high influence or position. This can get you in trouble since their advice might be completely wrong or not based on the reality of your situation. Yang gave the example of quantum computing stock prices. In December 2024, a Google Willow announcement led many investors to buy these stocks, which boosted their prices. But in January 2025, Nvidia's CEO said the tech had many years to go, and stock prices fell a lot. 'The truth is that many people probably didn't do any due diligence when it came to these stocks, and they probably bought them on a speculative future after the Willow announcement, and then they sold them on a whim after a negative comment,' Yang said. To protect yourself from this bias, don't rely solely on what a single person says to do with your money. Yang said you should also forget whatever is special about that person to improve your objectivity, see what other people say differently about the topic, and trust your instincts. Discover More: If you often look only for information that aligns with your beliefs about money and brush off anything that says differently, you've fallen for confirmation bias. Besides leading to bad money moves, this bias can make you an easier person to scam, according to the Ohio Attorney General. Yang explained, 'It's especially dangerous for those that are super logical because if you're a super methodical thinker, you can actually build a logical sounding argument to defend your pre-existing opinion.' He gave an example of how this can play out with tech stocks. If you favor those stocks, you might watch for positive news reports, listen to influencers who are fans of tech, and focus on friends who profited big. You might not consider any bad earnings projections or the investors who went broke. According to Yang, asking 'why' several times helps avoid bad decisions due to confirmation bias. This lets you dig into your motivation and reasoning for making the money move. He also suggested writing down the decisions you make so you can later look back on why you did certain things and what you expected. 'This is arguably the most dangerous cognitive bias for smart people, and that's basically when people overestimate their knowledge, abilities and their predictions,' said Yang. Overconfidence bias can cause you to not consider risks since you mistakenly think you have an advantage with money over other people, and that could even be due to expertise in an unrelated area. Yang explained that this mistake played a role in various financial crises over the last few decades. Being overconfident might also lead you to not diversify your money enough and risk major losses. Yang gave examples of copying Warren Buffett's portfolio with limited investment choices or investing substantially in your own employer's stock due to familiarity. To avoid letting overconfidence damage your finances, consider that some successes might have come from pure luck rather than a wise choice you made. Yang said you should also regularly compare your predictions to reality and stick to simple investing strategies, like using index funds instead of betting on the next big individual stock. More From GOBankingRates 3 Luxury SUVs That Will Have Massive Price Drops in Summer 2025 These Cars May Seem Expensive, but They Rarely Need Repairs Clever Ways To Save Money That Actually Work in 2025 This article originally appeared on Why Smart People Make Dumb Money Decisions, According to Humphrey Yang
