Apple's 'Solarium' UI for iOS 19 is about to bring the biggest design change to iPhones in over a decade
When you buy through links on our articles, Future and its syndication partners may earn a commission.
We're entering the final weeks before WWDC 2025, and if reports are to be believed, it will be a monumental Apple conference.
Earlier this year, Bloomberg's Mark Gurman reported that the Apple's major operating systems, iOS and macOS, would be receiving a dramatic overhaul. Now, he has a new article saying that the interface refresh is coming to all of Apple's operating systems which includes iPadOS, tvOS and watchOS. visionOS, the software that runs the Vision Pro headset, will likely receive a smaller update.
The iOS 19 interface update, allegedly codenamed Solarium, is supposed to be based on translucent visual elements in visionOS. Reportedly, Apple wants to remake all of its operating systems as part of a theme for 2025 of "consistency and unification."
If the iOS 19 overhaul comes to pass, it would be the biggest design update to the iPhone software since iOS 7 in 2013.
What this means for your i-devices in a broad sense is a more translucent background and potentially circular app icons.
Beyond that Vision Pro-inspired look, it also means more unified layouts and standardized menus. For instance, tapping the settings icon should bring up the the same menu on every device you use.
Around the same time that Gurman was initially reporting the iOS overhaul, YouTuber Jon Prosser revealed a potential look at the new look iOS 19 including a floating translucent navigation menu. Though Gurman subtweeted that leak writing on social media, "iOS 19 images floating around aren't representative of what we'll see at WWDC."
As Gurman notes, with rivals focusing on AI, Apple is "focusing on making the traditional OS approach more elegant."
Apple has seemingly fallen on its face when it comes to artificial intelligence. However consumers feel about the recent heavy push into AI by seemingly every tech company from Google and Microsoft to OpenAI and Grok, the concept is here and not going away time soon.
As of this writing, Apple's AI rollout continues, though AI updates for Apple's voice assistant Siri have not been part of iOS 18 — nor are they likely to be before iOS 19 arrives later this year. Apple has officially said that Siri 2.0 has been delayed, possibly into 2026.
Gurman posits that the recent OpenAI acquisition of Jony Ive's company will put pressure on Apple to innovate as well as catch up to the AI improvements from other device makers.
Though its possible in the next couple of years Apple could start to return to innovation/catch up prominence with rumored releases of Apple smart glasses, a foldable iPhone and potentially a Siri-powered smart home device, though that all depends on Siri working properly.
Gurman says that Apple won't focus on Apple Intelligence during WWDC 2025.
Still, we expect a few AI features to be highlight in couple weeks including context awareness and tools meant for developers to let them incorporate AI tools in their apps.
With Apple allegedly opening up Apple Intelligence to third-party AI models and developers, it could help speed up development and make Apple an AI platform offering more than other companies.
We'll learn more about Solarium and the new design of Apple's operating systems during the World Wide Developer Conference which takes place from June 9 - 13 this year. The event kicks off that Monday with a keynote where we're expecting to see the iOS 19 preview.
More than 184 million passwords exposed in massive data breach — Apple, Google, Microsoft and more
These are the 5 rumored iOS 19 changes I'm looking forward to
Apple has gotten in the way of its own AI rollout — here's how it can get Apple Intelligence back on track

Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles
Yahoo
9 minutes ago
- Yahoo
Intel experimenting with direct liquid cooling for up to 1000W CPUs
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel is testing a new way to tackle the growing heat output of its power hungry chips. At its recent Foundry Direct Connect event, the company showcased an experimental package-level water cooling solution designed to more efficiently cool CPUs . Intel has working prototypes for both LGA (Land Grid Array) and BGA (Ball Grid Array) CPUs, with demos using Intel's Core Ultra as well as Xeon server processors. The cooling solution doesn't apply coolant directly to the silicon die. Instead, a specially designed compact cooling block sits atop the package, featuring microchannels made of copper that precisely guide the coolant flow. These channels can be optimized to target specific hotspots on the die, potentially improving heat removal where it matters the most. Intel claims the system can dissipate up to 1,000 watts of heat using standard liquid cooling fluid. That kind of thermal load isn't typical for consumer CPUs, but it could be relevant for high-end AI (Artificial Intelligence) workloads, HPC (High Performance Computing), and workstation applications. Image 1 of 9 Image 2 of 9 Image 3 of 9 Image 4 of 9 Image 5 of 9 Image 6 of 9 Image 7 of 9 Image 8 of 9 Image 9 of 9 The cooling assembly is also said to make use of solder or liquid metal TIM (Thermal Interface Material), which is said to offer better contact than polymer based TIM. Compared to a traditional liquid cooler mounted to a delidded bare die, Intel says this solution can deliver 15–20% better thermal performance. Notably, Intel's approach isn't just a lab experiment. The company has reportedly been working on this technology for years. With rising thermal demands from modern chip designs, Intel is now exploring how to produce this system for real-world deployment. While Intel refines its prototype, the enthusiast community is already experimenting with similar concepts. YouTuber octppus recently modified the heatspreader of an Intel Core i9-14900KS, machining it into a functioning miniature water block. With internal channels carved into the IHS (Integrated Heat Spreader) and sealed under acrylic, the mod somewhat mirrors Intel's concept in DIY fashion. Intel hasn't confirmed when or if this cooling approach will hit mainstream products, but the demonstration is critical for CPU thermal design. As power consumption and package density increase, direct cooling may become a necessity for both professional and enthusiast hardware in the coming future. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
Yahoo
9 minutes ago
- Yahoo
Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with Dr. Rahul Manepalli, an Intel Fellow and VP of Substrate Packaging Development, for more details on three of the new packaging technologies: EMIB-T for boosting both the size of chip packages and power delivery capabilities to support new technologies like HBM4/4e, a new disagregated heat spreader design, and a new thermal bonding technique that improves reliability, yields, and enables scaling to finer chip-to-chip connections. Intel also participated in 17 other new papers presented at the event. Intel Foundry aims to produce chips for both Intel's own internal use and for external companies, utilizing leading-edge process node technology. However, modern processors are increasingly deployed with complex, heterogeneous designs that integrate multiple types of computing and memory components into a single chip package, thereby amplifying performance, cost, and power efficiency gains. These chip designs rely upon increasingly complex advanced packaging techniques that serve as the bedrock of heterogeneous designs, so continued evolution is critical as Intel keeps pace with competitors like TSMC. Image 1 of 4 Image 2 of 4 Image 3 of 4 Image 4 of 4 Intel's new EMIB-T, originally disclosed at its Intel Direct Connect event last month, incorporates through-silicon vias (TSVs) into its already widely used EMIB technology —a silicon bridge embedded in a package substrate that provides communication and power plumbing between chiplets/dies. This next evolution of EMIB enhances critical package power delivery efficiency metrics and speeds die-to-die communication. EMIB-T can be used to more effectively power compute and memory components — whereas standard EMIB connections struggled with high voltage droop due to a cantilevered power delivery path, EMIB-T utilizes TSVs to provide power delivery from the bottom of the chip package via TSV bridge dies, thus enabling a direct, low-resistance path for power delivery that's critical for HBM4/4e integration. Naturally, the use of TSVs also boosts die-to-die communication bandwidth, enabling the integration of high-speed HBM4/4e memory packages and the use of the UCIe-A interconnect to increase data transfer rates to 32 Gb/s or higher. Routing power and signals through the same interface introduces 'noise' in the signal path, but Intel integrated high-powered MIM capacitors into the bridge to help ensure consistent communication signaling. EMIB-T also enables much larger chip package sizes, reaching 120x180mm, and supports more than 38 bridges and more than 12 recticle-sized die in a single large chip package. Additionally, the first generation of EMIB enabled a 55-micron bump pitch, a critical interconnect density metric, while the second-generation EMIB scaled down to a 45-micron pitch. Intel's paper demonstrates an EMIB-T design with a 45-micron pitch, but notes that the new technology supports "well below" 45-micron pitches, saying it will go to 35-micron pitches soon and has 25-micron pitches in development. Intel hasn't shared the picojoules-per-bit (pJ/bit) power efficiency metrics. EMIB-T is also compatible with either organic or glass substrates, with the latter being a key strategic direction for Intel's future chip packaging endeavors. The AI revolution is pushing chip package sizes to new frontiers, and with that comes increased power consumption that introduces vexing cooling challenges. Intel also disclosed a new disaggregated heat spreader technique that breaks the heat spreader into a flat plate and a stiffener to improve coupling between the heat spreader and the thermal interface material (TIM) that resides between the heat spreader and the underlying die. Among other benefits, this technique helps reduce voids in solder TIM coupling by 25%. Intel's illustration shows a heatspreader with integrated micro-channels that carry liquid directly through the IHS to cool the processor, much like we saw on display at its Direct Connect event. While the paper focused on the effects of breaking the heatspreader into multiple pieces, the inclusion of this tech, which can cool processor packages with a TDP up to 1000W, highlights that Intel is approaching the chip cooling problem from multiple angles. Intel has utilized thermal compression bonding techniques in both its server and consumer products; however, it has now developed a new thermal compression bonding process specifically for large package substrates that helps overcome die and substrate warpage during the bonding process. This new technique minimizes the thermal delta between the package substrate and the die during the bonding process, thereby improving yield and reliability metrics and enabling much larger chip packages than are currently possible in high volume manufacturing. It also enables finer pitches for EMIB connections, helping to squeeze out more density from EMIB-T technology. Image 1 of 6 Image 2 of 6 Image 3 of 6 Image 4 of 6 Image 5 of 6 Image 6 of 6 Having a well-rounded and competitive suite of packaging technologies is crucial for Intel Foundry as it aims to provide its customers with the most comprehensive range of chip production options possible. Advanced chip packaging techniques enable customers to integrate different types of chips, such as CPUs, GPUs, and memory, from multiple vendors into a single package, thereby reducing the risk of transitioning entirely to Intel's process nodes for all componentry. In fact, Intel also offers packaging services for chips that don't use any Intel-fabbed components at all, helping to build relationships with potential new customers for its chip-fabbing services. Chip packaging has also emerged as one of the leading services for Intel's external customers, which currently include industry heavyweights such as AWS and Cisco, among others, as well as the US government's RAMP-C and SHIP projects. These packaging contracts serve as the fastest on-ramp for Intel Foundry revenue generation, as producing chips with leading-edge process nodes requires significantly longer lead times.
Yahoo
10 minutes ago
- Yahoo
'Cosmic miracle!' James Webb Space Telescope discovers the earliest galaxy ever seen
When you buy through links on our articles, Future and its syndication partners may earn a commission. The James Webb Space Telescope (JWST) excels at a lot of things, but there are two things it does better than any other scientific instrument in human history: spotting early galaxies and breaking its own records!Now, the $10 billion NASA space telescope has done both things again, detecting a galaxy that existed just 280 million years after the Big Bang, a feat that the team behind this research has dubbed a "cosmic miracle."Currently, as the earliest and most distant galaxy ever detected, this "the mother of all early galaxies," this new JWST discovery has been fittingly designated "MoM z14." "First and foremost, at the moment, this is the most distant object known to humanity. That title changes every so often, but I find it is always cause for pause and reflection," team member and Yale University professor of Astronomy and Physics Pieter van Dokkum told "MoM z14 existed when the universe was about 280 million years old - we're getting quite close to the Big Bang. "Just to put that in context, sharks have been around on Earth for a longer timespan!" Since it began sending data back to Earth in the summer of 2022, the JWST has excelled in detecting galaxies at so-called "high redshifts." Redshift refers to the phenomenon of the wavelength of light from distant and thus early sources being stretched and shifted toward the "red end" of the electromagnetic spectrum as it traverses expanding space. The earlier and thus further away an object is, the greater the redshift. Prior to the discovery of MoM z14, the galaxy holding the title of earliest and distant was JADES-GS-z14-0, which existed just 300 million years after the Big Bang, or around 13.5 billion years ago. This previous record galaxy has a redshift of z =14.32, while MoM z14 has a redshift of z = 14.44. There is a wider context to the observation of MoM z14 than the fact that it has broken the record for earliest known galaxy by 20 million years, though, as van Dokkum explained. "The broader story here is that JWST was not expected to find any galaxies this early in the history of the universe, at least not at this stage of the mission," van Dokkum said. "There are, very roughly, over 100 more relatively bright galaxies in the very early universe than were expected based on pre-JWST observations."Also, in addition to detecting this new, earliest, and most distant galaxy, the team was able to determine some of its characteristics using the JWST. The researchers were able to determine that MoM z14 is around 50 times smaller than the Milky Way. The team also measured emission lines from the galaxy, indicating the presence of elements like nitrogen and carbon. "The emission lines are unusual; it indicates that the galaxy is very young, with a rapidly increasing rate of forming new stars," van Dokkum said. "There are also indications that there is not much neutral hydrogen gas surrounding the galaxy, which would be surprising: the very early universe is expected to be filled with neutral hydrogen. "That needs even better spectra and more galaxies, to investigate more fully." The presence of carbon and nitrogen in MoM z14 indicates that there are earlier galaxies to be discovered than this 13.52 billion-year-old example. That is because the very earliest galaxies in the universe and their stars were filled with the simplest elements in the cosmos, hydrogen and helium. Later galaxies would be populated by these heavier elements, which astronomers somewhat confusingly call "metal," as their stars forged them and then dispersed them in supernova explosions. "MoM z14 is not one of the very first objects that formed in the universe, as the stars in those galaxies are composed of hydrogen and helium only - we would not see carbon or nitrogen," van Dokkum said. "It could be part of the first wave of formation of 'normal' galaxies, that is, the first galaxies that have elements like nitrogen and carbon - but we've thought that before!" Related Stories: — Is our universe trapped inside a black hole? This James Webb Space Telescope discovery might blow your mind —James Webb Space Telescope finds our Milky Way galaxy's supermassive black hole blowing bubbles (image, video) — James Webb Space Telescope sees early galaxies defying 'cosmic rulebook' of star formation As for finding even earlier galaxies than MoM z14 and perhaps even detecting that first generation, van Dokkum is confident that the JWST is up to the task. He explained: "The JWST continues to push the boundary beyond where we thought it was, and at this point I would not be surprised if we find galaxies at z =15 or z =16!" For now, van Dokkum and the rest of this team, led by Rohan Naidu of MIT's Kavli Institute for Astrophysics and Space Research, can celebrate breaking new ground in our understanding of the early cosmos."In a program like this, the whole team is always hoping for a 'miracle,' that is, that some of the candidate extremely early galaxies actually pan out and are not 'mirages,' objects whose colors look like extremely early objects," van Dokkum concluded. "While we were hoping for some very early objects, I don't think any of us expected to break the redshift record!" A pre-peer-reviewed version of the team's research is published on the paper repository site arXiv.