Vertiv Launches CoolLoop Trim Cooler for AI and HPC Cooling
Vertiv Launches CoolLoop Trim Cooler for AI and HPC Cooling
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Vertiv (NYSE: VRT), a global critical digital infrastructure and continuity solutions brand, has introduced the Vertiv™ CoolLoop Trim Cooler, expanding its thermal management portfolio. This new solution is designed to support both air and liquid cooling applications for Artificial Intelligence (AI) and High-Performance Computing (HPC) environments. The Vertiv CoolLoop Trim Cooler is tailored for hybrid or liquid-cooled data centers and AI factories, adapting to various climate conditions worldwide.
The innovative system is optimized for high-density, liquid-cooled environments, offering significant operational efficiency. It promises up to a 70% reduction in annual cooling energy consumption through free cooling and mechanical operation, along with 40% space savings compared to traditional systems. With a focus on AI factory needs, the Vertiv CoolLoop Trim Cooler can handle fluctuating supply water temperatures up to 40°C and supports cold plate functionality at 45°C.
Ease of installation is a key feature of the Vertiv CoolLoop Trim Cooler. It connects seamlessly with Vertiv™ CoolChip CDU coolant distribution units for direct-to-chip cooling, and it can also integrate directly with immersion cooling systems. This straightforward setup reduces operational complexity, offering time and cost savings for customers across a variety of high-density cooling environments.
'AI is transforming the cooling profiles of modern data centers, requiring innovative solutions to manage the thermal challenges posed by 100kW+ racks,' said Sam Bainborough, Vice President of Thermal Business EMEA at Vertiv. 'The introduction of the Vertiv CoolLoop Trim Cooler and our ongoing expansion of high-density thermal management solutions ensure we can meet the growing cooling demands driven by AI technologies.'
The Vertiv™ CoolLoop Trim Cooler uses low-GWP refrigerant and offers scalable cooling capacity of up to 3 MW in the air-cooled configuration. Designed with free cooling coils for high ambient temperatures, the system operates in free cooling mode across a wider range of seasons, resulting in lower electrical consumption and reduced CO2e emissions. Additionally, it complies with the 2027 EU F-GAS regulations, preventing costly redesigns or infrastructure updates to meet the upcoming regulatory requirements.
With this latest innovation, Vertiv continues to lead the way in providing cutting-edge, energy-efficient cooling solutions for the evolving needs of AI and HPC-driven data centers.
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