Apple iPhone 16E Specs vs. iPhone 15 Pro: New Entry-Level or Last Year's Pro
One of the biggest selling points of Apple's $599 iPhone 16E is that it offers excellent bang for the buck. It is Apple's most affordable iPhone, but it still has many of the same features as the $799 iPhone 16, such as the latest A18 chip and Apple Intelligence, which introduces generative emoji, smarter notifications and, eventually, an improved Siri.
Watch this: iPhone 16E Review
07:20
Yet, it might be worth looking at the company's older iPhones, such as the iPhone 15 Pro. It might not be as cheap as the iPhone 16E, but it has much better features, such as a nicer camera and better charging capabilities. Those extra features might be worth the higher price. Plus, you can potentially get it at a lower price than the iPhone 16 if you buy it refurbished.
How do these phones compare? We've outlined a few features for you to find out which one is the best iPhone for you.
The iPhone 16E and the iPhone 15 Pro both have 6.1-inch displays, but the Pro has a few more perks.
Celso Bulgatti/CNET
Display
The iPhone 16E and the iPhone 15 Pro feature the same 6.1-inch size screen at a similar display resolution, but there are still a few differences. The iPhone 16E runs at a 60Hz refresh rate -- similar to all of the non-Pro iPhone models -- and it can reach a 1,200-nit peak brightness. It also has a similar display notch to the iPhone 14, and does not support the Dynamic Island that serves up contextual information on other iPhone 15 and 16 models. It's functional and should work fine whether you are using the phone indoors or outdoors, but the Pro's screen has several additional perks.
The iPhone 15 Pro (right, seen here with the 15 Pro Max), includes the Dynamic Island around its display cutout.
James Martin/CNET
The iPhone 15 Pro's display can run at a variable refresh rate between 10Hz and 120Hz, changing based on what activity you are doing. You can expect to see the smoother 120Hz refresh rate when scrolling through websites, playing games and other applications that benefit from smoother animations. According to Apple, it will hit the lower end of that range to conserve battery life when you aren't using the phone. The display also hits a higher 2,000 nits of peak brightness (outdoors) and includes the Dynamic Island that shows information like the music player or countdowns around the space of the front-facing camera's display cutout.
Both the iPhone 16E (seen here) and the iPhone 15 Pro can play more graphically-intense games such as Resident Evil 4 Remake.
Celso Bulgatti/CNET
Processor
The iPhone 15 Pro has the A17 Pro chip, which is a six-core CPU with two performance and four efficiency cores that makes it great for graphics and gaming. The iPhone 16E, on the other hand, ships with the latest A18 chip, which gives it a touch more power and speed. In practice, the A17 Pro is still a very capable chip that will serve you well for years to come. The A18 chip, however, will likely receive software and new feature updates for a slightly longer period of time. Both processors are capable of running Apple Intelligence and more advanced iPhone games like Resident Evil 4 Remake and Death Stranding.
The iPhone 16 has a Clean Up tool that can remove unwanted elements from photos.
Numi Prasarn/CNET
Apple Intelligence
One of the iPhone 16E's biggest highlights is that it supports Apple Intelligence, which was previously only available in Apple's high-end offerings like the iPhone 15 Pro and the iPhone 16. Apple Intelligence offers plenty of benefits such as smart writing tools, a Clean Up tool that removes unwanted elements from photos and a potentially smarter Siri on a future update. The iPhone 15 Pro, as mentioned, has had this from the start, so the two are fairly equal in this department.
The iPhone 16E has a single 48-megapixel main camera.
Celso Bulgatti/CNET
Camera
The biggest visual difference between the iPhone 16E and the iPhone 15 Pro is that the latter has three cameras instead of one. The iPhone 15 Pro has a 48-megapixel wide lens, a 12-megapixel ultrawide lens and a 12-megapixel telephoto lens with 3x optical zoom. It also has a large 48-megapixel sensor that helps immensely in low light. The iPhone 16E, on the other hand, only has a single 48-megapixel rear camera. It has to rely on sensor-cropping for improved zoomed-in shots. Both have 12-megapixel front-facing cameras.
The iPhone 15 Pro and Pro Max have three cameras on the back.
James Martin/CNET
Charging
Another downside to the iPhone 16E is that it lacks support for MagSafe wireless charging, and is only compatible with Qi charging capped at 7.5W. The iPhone 15 Pro, on the other hand, supports 15W MagSafe charging. Not only can it wireless charge at twice the speed, it also supports a whole range of magnetic accessories that the iPhone 16E won't be able to use unless it has a third-party MagSafe-compatible case.
Both phones use USB-C for wired charging, with Apple citing that both can recharge their battery to 50% in 30 minutes when connected to a 20W adapter. In CNET's review testing for the iPhone 16E and iPhone 15 Pro, both phones tested slightly better than this. The iPhone 16E recharged from 0% to 59% in 30 minutes, and the 15 Pro recharged from 0% to 62% after being updated to iOS 17.0.3.
Both the iPhone 16E and the 15 Pro charge over USB-C.
Celso Bulgatti/CNET
Pricing (and a note on buying refurbished)
Obviously, the iPhone 16E offers the lower price as it retails for just $599. Apple, however, is now officially selling a refurbished version of the 15 Pro for just $759, which is cheaper than the $799 iPhone 16. Sure, that's more expensive than the 16E, but the Pro's extra features might be worth a higher price for you. Additionally, while buying phones in a secondary market has its issues (the phone might not always be in great shape), Apple's official refurbished program has an excellent reputation that is akin to buying the product new.
Check out the following chart to see how the iPhone 16E and the iPhone 15 Pro stack up in other aspects.
Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles
CNN
24 minutes ago
- CNN
Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan. TSMC, which produces more than 90% of the world's advanced semiconductor chips that power everything from smartphones and artificial intelligence (AI) applications to weapons, will build two new advanced packaging facilities in Arizona, among others. Here's everything you need to know about advanced packaging technology, which has seen exponential demand growth along with the global AI frenzy, and what that means for the struggle between the US and China for AI dominance. While the two countries have announced a temporary truce that rolled back disruptive three-digit tariffs for 90 days, the relationship remains tense because of ongoing feuding over chip restrictions imposed by the US and other issues. Last month at Computex, an annual trade show in Taipei that has been thrust under the limelight because of the AI boom, the CEO of chipmaker Nvidia, Jensen Huang, told reporters that 'the importance of advanced packaging for AI is very high,' proclaiming that 'no one has pushed advanced packaging harder than me.' Packaging generally refers to one of the manufacturing processes of semiconductor chips, which means sealing a chip inside a protective casing and mounting it to the motherboard that goes into an electronic device. Advanced packaging, specifically, refers to techniques that allow more chips — such as graphic processing units (GPU), central processing units (CPU) or high bandwidth memory (HBM) — to be placed closer together, leading to better overall performance, faster transmission of data and lower energy consumption. Think of these chips as different departments within a company. The closer these departments are to each other, the easier it is, and less time it takes, for people to travel between them and exchange ideas, and the more efficient the operation becomes. 'You're trying to put the chips as close together as possible, and you're also putting in different solutions to make the connection between the chips very easy,' Dan Nystedt, vice president of Asia-based private investment firm TrioOrient, told CNN. In a way, advanced packaging keeps afloat Moore's Law, the idea that the number of transistors on microchips would double every two years, as breakthroughs in the chip fabrication process become increasingly costly and more difficult. While there are many types of advanced packaging technologies, CoWoS, short for Chips-on-Wafer-on-Substrate and invented by TSMC, is arguably the best known that was thrown under the limelight since the debut of OpenAI's ChatGPT, which sparked the AI frenzy. It has even become a household name in Taiwan, prompting Lisa Su, CEO of Advanced Micro Devices (AMD), to say that the island is the 'only place that you can say CoWoS and everybody would understand.' Advanced packaging has become a big deal in the tech world because it ensures AI applications, which require a lot of complex computing, run without delays or glitches. CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. 'You could call it the Nvidia packaging process if you want to. Almost anyone making AI chips is using the CoWoS process,' said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity. In a visit to Taiwan in January, Huang told reporters that the amount of advanced packaging capacity currently available was 'probably four times' what it was less than two years ago. 'The technology of packaging is very important to the future of computing,' he said. 'We now need to have very complicated advanced packaging to put many chips together into one giant chip.' If advanced fabrication is one piece of the puzzle in terms of chip manufacturing, advanced packaging is another. Analysts say having both pieces of that jigsaw in Arizona means the US will have a 'one-stop shop' for chip production and a strengthened position for its AI arsenal, benefitting Apple, Nvidia, AMD, Qualcomm and Broadcom, some of TSMC's top clients. 'It ensures that the US has a complete supply chain from advanced manufacturing to advanced packaging, which would benefit the US' competitiveness in AI chips,' Eric Chen, an analyst with market research firm Digitimes Research, told CNN. Because advanced packaging technologies key to AI are currently only produced in Taiwan, having it in Arizona also reduces potential supply chain risks. 'Instead of having all eggs in one basket, CoWoS would be in Taiwan and also the US, and that makes you feel more safe and secure,' said Nystedt. While CoWoS got its moment recently, the technology has actually existed for at least 15 years. It was the brainchild of a team of engineers led by Chiang Shang-yi, who served two stints at TSMC and retired from the company as its co-chief operating officer. Chiang first proposed developing the technology in 2009 in an attempt to fit more transistors into chips and solve bottlenecks in performance. But when it was developed, few companies took up the technology because of the high cost associated with it. 'I only had one customer … I really became a joke (in the company), and there was so much pressure on me,' he recalled in a 2022 oral history project recorded for the Computer History Museum in Mountain View, California. But the AI boom turned CoWoS around, making it one of the most popular technologies. 'The result was beyond our original expectation,' Chiang said. In the global semiconductor supply chain, companies that specialize in packaging and testing services are referred to as outsourced semiconductor assembly and test (OSAT) firms. In addition to TSMC, South Korea's Samsung and America's Intel, as well as OSAT firms including China's JCET Group, America's Amkor and Taiwan's ASE Group and SPIL are all key players in advanced packaging technologies.
CNN
29 minutes ago
- CNN
Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan. TSMC, which produces more than 90% of the world's advanced semiconductor chips that power everything from smartphones and artificial intelligence (AI) applications to weapons, will build two new advanced packaging facilities in Arizona, among others. Here's everything you need to know about advanced packaging technology, which has seen exponential demand growth along with the global AI frenzy, and what that means for the struggle between the US and China for AI dominance. While the two countries have announced a temporary truce that rolled back disruptive three-digit tariffs for 90 days, the relationship remains tense because of ongoing feuding over chip restrictions imposed by the US and other issues. Last month at Computex, an annual trade show in Taipei that has been thrust under the limelight because of the AI boom, the CEO of chipmaker Nvidia, Jensen Huang, told reporters that 'the importance of advanced packaging for AI is very high,' proclaiming that 'no one has pushed advanced packaging harder than me.' Packaging generally refers to one of the manufacturing processes of semiconductor chips, which means sealing a chip inside a protective casing and mounting it to the motherboard that goes into an electronic device. Advanced packaging, specifically, refers to techniques that allow more chips — such as graphic processing units (GPU), central processing units (CPU) or high bandwidth memory (HBM) — to be placed closer together, leading to better overall performance, faster transmission of data and lower energy consumption. Think of these chips as different departments within a company. The closer these departments are to each other, the easier it is, and less time it takes, for people to travel between them and exchange ideas, and the more efficient the operation becomes. 'You're trying to put the chips as close together as possible, and you're also putting in different solutions to make the connection between the chips very easy,' Dan Nystedt, vice president of Asia-based private investment firm TrioOrient, told CNN. In a way, advanced packaging keeps afloat Moore's Law, the idea that the number of transistors on microchips would double every two years, as breakthroughs in the chip fabrication process become increasingly costly and more difficult. While there are many types of advanced packaging technologies, CoWoS, short for Chips-on-Wafer-on-Substrate and invented by TSMC, is arguably the best known that was thrown under the limelight since the debut of OpenAI's ChatGPT, which sparked the AI frenzy. It has even become a household name in Taiwan, prompting Lisa Su, CEO of Advanced Micro Devices (AMD), to say that the island is the 'only place that you can say CoWoS and everybody would understand.' Advanced packaging has become a big deal in the tech world because it ensures AI applications, which require a lot of complex computing, run without delays or glitches. CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. 'You could call it the Nvidia packaging process if you want to. Almost anyone making AI chips is using the CoWoS process,' said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity. In a visit to Taiwan in January, Huang told reporters that the amount of advanced packaging capacity currently available was 'probably four times' what it was less than two years ago. 'The technology of packaging is very important to the future of computing,' he said. 'We now need to have very complicated advanced packaging to put many chips together into one giant chip.' If advanced fabrication is one piece of the puzzle in terms of chip manufacturing, advanced packaging is another. Analysts say having both pieces of that jigsaw in Arizona means the US will have a 'one-stop shop' for chip production and a strengthened position for its AI arsenal, benefitting Apple, Nvidia, AMD, Qualcomm and Broadcom, some of TSMC's top clients. 'It ensures that the US has a complete supply chain from advanced manufacturing to advanced packaging, which would benefit the US' competitiveness in AI chips,' Eric Chen, an analyst with market research firm Digitimes Research, told CNN. Because advanced packaging technologies key to AI are currently only produced in Taiwan, having it in Arizona also reduces potential supply chain risks. 'Instead of having all eggs in one basket, CoWoS would be in Taiwan and also the US, and that makes you feel more safe and secure,' said Nystedt. While CoWoS got its moment recently, the technology has actually existed for at least 15 years. It was the brainchild of a team of engineers led by Chiang Shang-yi, who served two stints at TSMC and retired from the company as its co-chief operating officer. Chiang first proposed developing the technology in 2009 in an attempt to fit more transistors into chips and solve bottlenecks in performance. But when it was developed, few companies took up the technology because of the high cost associated with it. 'I only had one customer … I really became a joke (in the company), and there was so much pressure on me,' he recalled in a 2022 oral history project recorded for the Computer History Museum in Mountain View, California. But the AI boom turned CoWoS around, making it one of the most popular technologies. 'The result was beyond our original expectation,' Chiang said. In the global semiconductor supply chain, companies that specialize in packaging and testing services are referred to as outsourced semiconductor assembly and test (OSAT) firms. In addition to TSMC, South Korea's Samsung and America's Intel, as well as OSAT firms including China's JCET Group, America's Amkor and Taiwan's ASE Group and SPIL are all key players in advanced packaging technologies.
New York Times
39 minutes ago
- New York Times
Bill Atkinson, Who Made Computers Easier to Use, Is Dead at 74
Bill Atkinson, the Apple Computer designer who created the software that enabled the transformative visual approach pioneered by the company's Lisa and Macintosh computers, making the machines accessible to millions of users without specialized skills, died on Thursday night at his home in Portola Valley, Calif., in the San Francisco Bay Area. He was 74. In a Facebook post, his family said the cause was pancreatic cancer. It was Mr. Atkinson who programmed QuickDraw, a foundational software layer used for both the Lisa and Macintosh computers; composed of a library of small programs, it made it possible to display shapes, text and images on the screen efficiently. The QuickDraw programs were embedded in the computers' hardware, providing a distinctive graphical user interface that presented a simulated 'desktop,' displaying icons of folders, files and application programs. Mr. Atkinson is credited with inventing many of the key aspects of graphical computing, such as 'pull down' menus and the 'double-click' gesture, which allows users to open files, folders and applications by clicking a mouse button twice in succession. Before the Macintosh was introduced in January 1984, most personal computers were text-oriented; graphics were not yet an integrated function of the machines. And computer mice pointing devices were not widely available; software programs were instead controlled by typing arcane commands. The QuickDraw library had originally been designed for Apple's Lisa computer, which was introduced in January 1983. Intended for business users, the Lisa predated many of the Macintosh's easy-to-use features, but priced at $10,000 (almost $33,000 in today's money), it was a commercial failure. Want all of The Times? Subscribe.
