Latest news with #AlphawaveSemi
National Post
3 days ago
- Business
- National Post
Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
Article content First UCIe Die-to-Die IP Subsystem on TSMC's 2nm Process with CoWoS ® Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects Article content LONDON & TORONTO — Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, announced the successful tape out of one of the industry's first UCIe™ IP subsystem on TSMC's N2 process, supporting 36G die-to-die data rates. The solution is fully integrated with TSMC's Chip-on-Wafer-on-Substrate (CoWoS ®) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation chiplet architectures. Article content This milestone builds on the recent release of the Alphawave Semi AI Platform, proving readiness to support the future of disaggregated SoCs and scale-up infrastructure for hyperscale AI and HPC workloads. With this tape-out, Alphawave Semi becomes one of the industry's first to enable UCIe connectivity on 2nm nanosheet technology, marking a major step forward for the open chiplet ecosystem. Article content 'We're proud to lead the industry into the N2 era with the first UCIe IP on this advanced node,' said Mohit Gupta, Senior VP & GM, Custom Silicon & IP, Alphawave Semi. 'Our 36G subsystem validates a new class of high-density, power-efficient chiplet connectivity and paves the way for 64G UCIe and beyond—critical for AI and high-radix networking applications.' Article content Alphawave Semi's one of the industry's first UCIe IP subsystem on TSMC's 2nm process delivers 36G performance with 11.8 Tbps/mm bandwidth density, ultra-low power and latency, and advanced features like live per-lane health monitoring and comprehensive testability. Compliant with UCIe 2.0 standard and supporting multi protocols, including PCIe ®, CXL™, AXI, CHI and more with Alphawave Semi's highly configurable and efficient Streaming Protocol D2D Controller. Article content Alphawave Semi is advancing key ecosystem collaborations to enable groundbreaking technologies, leveraging D2D-based open chiplet interoperability to drive a broader AI connectivity platform for the industry. Alphawave Semi's UCIe IP on the TSMC N2 process affirms its position as one of the leading enablers of scalable, open chiplet ecosystems. Article content 'Our latest collaboration with Alphawave Semi underscores our shared commitment to driving advancements in high-performance computing through design solutions that fully leverage the performance and energy-efficiency advantages of TSMC's advanced process and packaging technologies,' said Lipen Yuan, Senior Director of Advanced Technology Business Development at TSMC. 'This milestone illustrates how close collaboration with our Open Innovation Platform ® (OIP) partners like Alphawave Semi can enable the quick delivery of advanced interface IP and custom silicon solutions to meet the increasing demands of AI and cloud infrastructure.' Article content Alphawave Semi is already executing on its plans to deliver next-generation UCIe solutions, with 64G UCIe support — empowering AI and HPC customers to lead in a rapidly evolving chiplet-driven landscape. Article content About Alphawave Semi Article content Alphawave Semi is a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure. Faced with the exponential growth of data, Alphawave Semi's technology services a critical need: enabling data to travel faster, more reliably, and with higher performance at lower power. We are a vertically integrated semiconductor company, and our IP, custom silicon, and connectivity products are deployed by global tier-one customers in datacenters, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in 2017 by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to accelerate the critical data infrastructure at the heart of our digital world. To find out more about Alphawave Semi, visit: Article content Article content Article content Article content Article content Contacts Article content Media Contact: Article content Article content Claudia Cano-Manuel Article content Article content Article content
Business Wire
3 days ago
- Automotive
- Business Wire
Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
LONDON & TORONTO--(BUSINESS WIRE)-- Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, announced the successful tape out of one of the industry's first UCIe™ IP subsystem on TSMC's N2 process, supporting 36G die-to-die data rates. The solution is fully integrated with TSMC's Chip-on-Wafer-on-Substrate (CoWoS ®) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation chiplet architectures. This milestone builds on the recent release of the Alphawave Semi AI Platform, proving readiness to support the future of disaggregated SoCs and scale-up infrastructure for hyperscale AI and HPC workloads. With this tape-out, Alphawave Semi becomes one of the industry's first to enable UCIe connectivity on 2nm nanosheet technology, marking a major step forward for the open chiplet ecosystem. 'We're proud to lead the industry into the N2 era with the first UCIe IP on this advanced node,' said Mohit Gupta, Senior VP & GM, Custom Silicon & IP, Alphawave Semi. 'Our 36G subsystem validates a new class of high-density, power-efficient chiplet connectivity and paves the way for 64G UCIe and beyond—critical for AI and high-radix networking applications.' Alphawave Semi's one of the industry's first UCIe IP subsystem on TSMC's 2nm process delivers 36G performance with 11.8 Tbps/mm bandwidth density, ultra-low power and latency, and advanced features like live per-lane health monitoring and comprehensive testability. Compliant with UCIe 2.0 standard and supporting multi protocols, including PCIe ®, CXL™, AXI, CHI and more with Alphawave Semi's highly configurable and efficient Streaming Protocol D2D Controller. Alphawave Semi is advancing key ecosystem collaborations to enable groundbreaking technologies, leveraging D2D-based open chiplet interoperability to drive a broader AI connectivity platform for the industry. Alphawave Semi's UCIe IP on the TSMC N2 process affirms its position as one of the leading enablers of scalable, open chiplet ecosystems. 'Our latest collaboration with Alphawave Semi underscores our shared commitment to driving advancements in high-performance computing through design solutions that fully leverage the performance and energy-efficiency advantages of TSMC's advanced process and packaging technologies,' said Lipen Yuan, Senior Director of Advanced Technology Business Development at TSMC. 'This milestone illustrates how close collaboration with our Open Innovation Platform ® (OIP) partners like Alphawave Semi can enable the quick delivery of advanced interface IP and custom silicon solutions to meet the increasing demands of AI and cloud infrastructure.' Alphawave Semi is already executing on its plans to deliver next-generation UCIe solutions, with 64G UCIe support — empowering AI and HPC customers to lead in a rapidly evolving chiplet-driven landscape. About Alphawave Semi Alphawave Semi is a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure. Faced with the exponential growth of data, Alphawave Semi's technology services a critical need: enabling data to travel faster, more reliably, and with higher performance at lower power. We are a vertically integrated semiconductor company, and our IP, custom silicon, and connectivity products are deployed by global tier-one customers in datacenters, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in 2017 by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to accelerate the critical data infrastructure at the heart of our digital world. To find out more about Alphawave Semi, visit: Alphawave Semi and the Alphawave Semi logo are trademarks of Alphawave IP Group plc. All rights reserved.
Yahoo
25-03-2025
- Business
- Yahoo
Alphawave Semi Reveals Suite of Optoelectronics Silicon Products Addressing Hyperscaler Datacenter and AI Interconnect Market
Introduces Cu-Wave™, O-Wave™ and Co-Wave™ portfolio of 800G and 1.6T PAM4 and Coherent-lite DSP solutions LONDON & TORONTO, March 25, 2025--(BUSINESS WIRE)--Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, has revealed its portfolio of optoelectronics products addressing the high-speed interconnect semiconductor market, which is forecast to exceed US$4-billion by 2028. The portfolio consists of DSPs for PAM4 and emerging Coherent-lite modulation. These are capable of transmitting AI driven high-speed digital compute data across hyperscale data center campuses. Alphawave Semi's portfolio of optoelectronics products leverage cutting-edge PAM4 SerDes with its differentiated WidEye™ DSP architecture and EyeQ™ advanced diagnostics technology to meet the needs of the leading hyperscalers and their buildout of accelerated AI compute infrastructure; with 800G and 1.6T interconnect solutions for meters of reach electrically and up to 20km optically based on PAM4 and emerging Coherent-lite solutions. This full portfolio of connectivity products is sampling now: Cu-Wave™ PAM4 DSP for Active Electrical Cables (AEC) O-Wave™ PAM4 DSP for Optical Retimer and Gearbox Transceivers Co-Wave™ Coherent-lite DSP for Optical Transceivers Company and analyst quotes Babak Samimi, Alphawave Semi SVP & GM of the Connectivity Products Group: "The industry is evolving with the rise of purpose-built data center campuses, which have been architected in response to the disruptions catalysed by mass adoption of AI versus traditional compute infrastructure. To meet the challenge, we focused our innovations into PAM4 and pioneered an investment into Coherent-lite DSPs with the aim of becoming a trusted supplier of silicon products into the growing high-speed optoelectronics semiconductor market. "Our Team has been working diligently to enable Alphawave Semi's pivot to develop our own connectivity silicon products by leveraging our industry-leading high-speed SerDes, high-precision analog, as well as our expertise in SoC and firmware, signal integrity management, and advanced diagnostics powered by our unique WidEye™ and EyeQ™ technologies to help support this data center evolution. "We have had the honour of working with a leading North American hyperscaler and number of key ecosystem partners that have developed solutions with our newly revealed connectivity products; and we look forward to deploying these solutions to the market over the next 12 months." Vladimir Kozlov, CEO LightCounting "With a strong heritage in high-speed SerDes in leading-edge process nodes, this market entry should be highly disruptive and will be beneficial to hyperscalers. With the trend towards more distributed processing taking place over data center campuses, the PAM4 and Coherent-lite DSP market is set for continued growth and we forecast it will reach over $4 billion dollars by 2028. Being in a select pool of companies that are currently able to provide both PAM4 and Coherent-lite products, Alphawave is well positioned." Alphawave Semi CEO, Tony Pialis: "The addition of the Connectivity Products Group is a significant achievement as it allows us to work with any leading hyperscaler in the way they need. If they need IP subsystems or chiplets for a bespoke system, we can provide it. If they want us to custom develop a silicon product, we can do that. And now, if they want to purchase a standard connectivity product powered by our leading-edge technologies, we can offer that too. This group is an important strategic asset, and I'm delighted to mark this launch to further Alphawave Semi's mission as the next semiconductor leader in AI connectivity and compute." Meet with us at OFC 2025 Come meet our product experts to explore and discuss Alphawave Semi's PAM4 and Coherent-lite DSPs, and see our technologies in action at OFC. The event will be held at the Moscone Center in San Francisco, CA, from March 30 to April 3. Visit us at booth #5645. For more information on Alphawave Semi's Connectivity Products Group visit and for information on the DSPs visit Click on this link to download the accompanying image. About Alphawave Semi Alphawave Semi is a global leader in high-speed connectivity and compute silicon for data centers, AI, networking, 5G, autonomous vehicles and storage. Our technology enables data centers and the world's technology infrastructure to manage the exponential growth of data and prevent networking bottlenecks, with increasing volumes of data traveling faster, more reliably, and with higher performance at lower power. We are a leader in the shift to chiplet-based System-on-Chip (SoC) architectures and our intellectual property (IP), custom silicon, connectivity products and chiplets are deployed by global tier-one customers across multiple sectors. Founded in 2017 by an expert technical team with a proven track record, our mission is to accelerate the critical data infrastructure at the epicenter of the digital world. To find out more about Alphawave Semi, visit: Alphawave Semi and the Alphawave Semi logo are trademarks of Alphawave IP Group plc. All rights reserved. View source version on Contacts Media Contact Claudia Cano-ManuelGrand Bridges Marketing Limitedpress@ 7562 182327 Sign in to access your portfolio
