Latest news with #CSMantech
Associated Press
14-05-2025
- Business
- Associated Press
Aeluma to Showcase Semiconductor Breakthroughs for AI, Quantum, and Sensing Markets at Leading Industry Conferences
Upcoming Presentations at CS Mantech in May and OIP in June Highlight Aeluma's Scalable Photonic Platforms for High-Performance Computing, Quantum, and Sensing GOLETA, CA / ACCESS Newswire / May 14, 2025 / Aeluma, Inc. (NASDAQ:ALMU), a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication, and quantum computing, announced today it will participate in two key upcoming industry conferences: the 2025 International Conference on Compound Semiconductor Manufacturing Technology (CS Mantech) and the 2025 IEEE Optical Interconnects and Packaging Conference (OIP). At the conferences, Aeluma will present technical advancements in shortwave infrared photodetectors, high-speed optical interconnects, and quantum dot lasers for silicon photonics, core technologies engineered to meet the growing performance and scale requirements of AI infrastructure, quantum, and sensing systems. At CS Mantech, being held May 19-22, 2025 in New Orleans, Louisiana, Aeluma will deliver a talk titled: 'Heterogeneous Integration of Large-Area InGaAs SWIR Photodetectors on 300mm CMOS-Compatible Si Substrates.' This session will spotlight Aeluma's novel approach to wafer-scale manufacturing of high-performance photodetector arrays enabling compact, energy-efficient solutions for mobile and consumer, AR/VR, defense and aerospace, and industrial automation. At the IEEE OIP, being held June 16-18, 2025 in Fort Collins, Colorado, Aeluma will present: For meeting requests at either event, contact: [email protected]. About Aeluma, Inc. Aeluma ( ) develops photonics and optoelectronics for sensing, computing, and communication applications. Aeluma has pioneered a technique to manufacture semiconductor chips using high-performance compound semiconductor materials on large-diameter substrates that are commonly used for mass-market microelectronics. The technology has the potential to enhance performance and scale manufacturing, both of which are critical for emerging applications. Aeluma is developing a streamlined business model from its headquarters in Santa Barbara, California that has a state-of-the-art manufacturing cleanroom. Its transformative semiconductor chip technology may impact a variety of markets including mobile, defense and aerospace, AI, automotive, AR/VR, quantum, and communication. Aeluma differentiates itself with unique semiconductor manufacturing capability, proprietary technology, the ability to perform rapid prototyping, and a broad set of product offerings. Forward-Looking Statements All statements in this press release that are not historical are forward-looking statements, including, among other things, statements relating to the Company's expectations regarding its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on the Company's current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as 'may,' 'will,' 'could,' 'would,' 'should,' 'anticipate,' 'predict,' 'potential,' 'continue,' 'expect,' 'intend,' 'plan,' 'project,' 'believe,' 'estimate,' and other similar or related expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company's control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company's filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available. Company Aeluma, Inc. (805) 351-2707 [email protected] Investor Contact: Bishop IR Mike Bishop (415) 894-9633 [email protected] SOURCE: Aeluma, Inc. press release
Business Wire
06-05-2025
- Business
- Business Wire
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
SANTEE, Calif.--(BUSINESS WIRE)-- StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech, taking place May 19–21 at the Hilton New Orleans Riverside, and in Booth 723 at Space Tech Expo USA, June 2–4 at the Long Beach Convention Center. StratEdge highlights LPA-series semiconductor packages at CS Mantech and Space Tech Expo, enabling high-reliability RF and satellite systems. Share These packages play a crucial role in transmitting signals from commercial and government satellites and other long-range communications equipment. Engineered for compound semiconductor devices such as GaN and GaAs, the LPA-series provides ultra-low electrical loss from DC to beyond 31 GHz while efficiently pulling heat away from the die, ensuring maximum reliability in demanding RF and microwave systems. "Our LPA-series gives designers a proven path to higher reliability and better signal integrity when the margins are extremely thin," said Casey Krawiec, VP of Sales at StratEdge. "Whether you're launching a payload into orbit or building a next-generation ground station, StratEdge packages provide the solid foundation compound semiconductor devices need to reach their full potential." StratEdge designs and manufactures a complete line of high-frequency packages and offers a Class 1000 cleanroom, including automated gold-eutectic die attach, wedge and ball bonding, and hermetic sealing. Engineers attending either show are invited to meet with StratEdge technical staff to discuss solutions for their most challenging power and thermal requirements. To learn more about StratEdge and its expanded production facilities, take a virtual tour at or visit the website at Photo: About StratEdge StratEdge Corporation designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic and lower-cost molded ceramic packages, specializing in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom for 5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. Our facility in Santee, California, near San Diego, is both ITAR registered and ISO 9001:2015 certified.
