Latest news with #FoundryDirectConnect
Yahoo
01-05-2025
- Yahoo
Intel is trying out on-chip water cooling too and I'm just happy I'm not the one having to place liquids so close to expensive electronics
When you buy through links on our articles, Future and its syndication partners may earn a commission. If there's one thing about the AI boom that doesn't make my eyes roll or make me feel a disquieting sense of impending doom and existential dread, it's the fact that many of the computing improvements for that industry will hopefully (emphasis on 'hopefully') trickle down into the PC gaming sphere. In-package liquid cooling seems to be quite the rage of late, and hopefully it'll be one of those things that makes its way to the PC gaming market. Not even a week after a YouTuber made a DIY version of something similar, Intel has just shown off a water cooler that sits on top of the CPU package (instead of an IHS) and schlepps coolant through to… well, to cool to the chip, of course (via Tom's Hardware). The incredibly thin cooling solution has little copper microchannels that guide the coolant and can focus thermal relief on the spots that really need it. Intel is displaying such experimental in-package cooling solutions at its ongoing Foundry Direct Connect event. The prototypes are designed for both LGA (land grid array) and BGA (ball grid array) surface mount chips, and Intel is showing such coolers for Core Ultra as well as Xeon CPUs. The kind of cooling on offer is apparently good for dealing with up to 1,000 W of heat, which is certainly more Xeon-level than Core Ultra-level, and is what makes me tentatively grateful for at least some of the AI boom. The server industry's certainly getting a lot of cash injected into it, and no doubt innovations such as this will come off the back of that. Then, hopefully, a tiny slice of that will end up in PC gamers' laps. Saying that, though, Intel has apparently been working on this tech for a long time. According to HardwareLuxx, at least some of the research for this dates back to 2005. Image 1 of 3 Image 2 of 3 Image 3 of 3 It's interesting, though, that this is now finally in a state to be shown off to the public at the same time that similar solutions are being shown off elsewhere by third parties. Just a week ago I reported on a cooler from EmCool that's supposed to attach to a delidded CPU and has liquid flowing through micro-pin fins to keep cool. Then there was the DIY version I mentioned earlier which machined channels for liquid cooling to flow through directly into the IHS. One of the key benefits of Intel's cooling tech here seems to be the ability to channel liquid where it's needed most: to hot spots. Given recent thermal imaging seems to show hot spots in some RTX 50-series graphics cards, we should be acutely aware of the benefits of such a tailored cooling system. Intel certainly seems to claim benefit, anyway, reportedly citing a 20% improvement in cooling performance. Noice. I'd certainly take one. Anything so I don't have to delid my own CPU and do the mod myself. Best AIO cooler for CPUs: Keep your chip air cooler for CPUs: Classic, quiet PC fans: Quiet and efficient.
Yahoo
01-05-2025
- Business
- Yahoo
Here are all the partners Intel announced at its 2025 Foundry Direct Connect event but big new customers are notably absent
When you buy through links on our articles, Future and its syndication partners may earn a commission. Last night Intel held its 2025 Foundry Direct Connect presentation where it outlined the next few years for the company in terms of production and fabrication. The company outlined the future roadmap of the 18A and second generation 14A nodes along with their focus on AI computing. As part of this Intel announced its lineup of partners for moving forward on manufacturing further silicon. Sadly, however, there was zero mention of new customers for Intel Foundry, which could either mean it's keeping those deals secret until any negotiations are completed and the ink is dried on the contract, or Intel is really struggling to get companies onboard with its upcoming new processes. A big name would have done a lot to give people confidence in the foundry's future success. Certainly, most of the names Intel dropped in its list of partners probably don't mean much to the average consumer. Most are companies that make the things your stuff is made out of, so it's several rungs removed. So here's all the partners Intel mentioned in the presentation and what they might actually be doing. Synopsys was one of the first partner companies to crop up and are of no surprise. Intel has partnered with Synopsys for years now in developing and co-optimising nodes to work with and be integrated into wider technologies. Synopsys usually works with other customers it brings to Intel too, so it's largely about collaboration and streamlining designs. Cadence is another company that Intel partners with in the hopes of optimising design and processes. Its focus is on compatible designs as well as integration into existing ecosystems. Cadence also works on exploratory data analysis, a bit like that new robot dog scab Intel hired, which has been integrated into Intel's own processes. Another longstanding partner is Siemens EDA. Siemens EDA is responsible for both digital and physical assistance towards the manufacturing process. This includes working with simulations to test the viability of work and co-developing advanced packaging solutions. The company has a focus on combining software and hardware for the best possible solutions which can have huge benefits when working with AI computing. Similarly to Siemens and Cadence, PDF Solutions is a company that provides analytics and data integration services. Its main job is to help bridge the gap between design and manufacturing for Intel. It's all about getting production to a point where it can be ramped up easily for customers. When it comes to developing 12nm chips, United Microelectronics Corporation is Intel's go to. This partnership allows Intel to focus on other areas of manufacturing and use UMC's established knowledge and skills with 12nm fabrication for those processes. For testing and quality assurance, Teradyne and Adventist are some of Intel's biggest partners. They employ advanced test methodologies and turnkey test services to ensure Intel's productions are meeting all the quality benchmarks and standards. Powertech Technology Inc. help make Intel's chips work with other components on a node basis. They're responsible for Supporting EMIB bumping and packaging, which is essentially how the nodes can connect to each other and other things. It allows Intel to use additional packaging solutions that may integrate better with certain technologies. Amkor Technology has a similar role as a partner but with further emphasis on expanding partnership opportunities thanks to lastly there's ASML, previously known as Advanced Semiconductor Materials Lithography. This company is responsible for allowing Intel to print its nodes in the first place by manufacturing the lithographs required to print these fine nodes on. Its efforts would go directly to helping to reliably print nodes like the 18A using efficient and scalable methods. Most of these partners have been working with Intel for a while, and none come as any particular surprise. Intel's partnerships are mostly about interconnectivity and providing the broadest range of applications for the manufactured chips. Basically trying to make sure everything is compatible as possible in this ever changing techscape. Best CPU for gaming: Top chips from Intel and gaming motherboard: The right graphics card: Your perfect pixel-pusher SSD for gaming: Get into the game first.
Bloomberg
29-04-2025
- Business
- Bloomberg
Intel Says Customers Preparing to Test New Production Technology
Intel Corp., trying to break into an outsourced chipmaking market dominated by Taiwan Semiconductor Manufacturing Co., said prospective clients are preparing to try out its new production process. The company's new 14A technology will follow 18A, which is on schedule to go into production in the second half of this year. 'Multiple customers have expressed their intent to build test chips on the new process node,' Intel said in a statement released ahead of its Foundry Direct Connect event Tuesday.
Yahoo
28-04-2025
- Business
- Yahoo
Intel Shares Rebound After Sharp Sell-Off, Investors Eye Foundry Roadmap
April 28 - Intel's (NASDAQ:INTC) shares rebounded about 3% on Monday morning after last week's sharp sell-off. Warning! GuruFocus has detected 7 Warning Signs with INTC. The bounce came as investors digested CEO Lip-Bu Tan's outline to refocus the company on core engineering, streamline administrative layers and target contract manufacturing growth. Tan's comments, while light on specifics, helped calm nerves following Friday's warning of weaker-than-expected PC-processor demand and margin pressure from new fab ramps. Analysts say markets now await detailed milestones on next-generation AI accelerators and firm orders from foundry clients. Any concrete timelines or partner commitments will be pivotal, Evercore ISI strategists noted. Looking ahead, markets will hinge on these catalysts: 1. Foundry Direct Connect Event (April 29, 2025): Intel will host its inaugural Foundry Direct Connect in San Jose, showcasing its 18A process roadmap, packaging advances and partner tape-outs . Investors will look for commitments from external customers and concrete volume timelines. 2. Panther Lake Tape-Out Confirmation: Management has indicated that tape-outs on the forthcoming Panther Lake AI accelerator should be completed by late 2025. This article first appeared on GuruFocus. Sign in to access your portfolio
Yahoo
28-04-2025
- Business
- Yahoo
Intel Shares Rebound After Sharp Sell-Off, Investors Eye Foundry Roadmap
April 28 - Intel's (NASDAQ:INTC) shares rebounded about 3% on Monday morning after last week's sharp sell-off. Warning! GuruFocus has detected 7 Warning Signs with INTC. The bounce came as investors digested CEO Lip-Bu Tan's outline to refocus the company on core engineering, streamline administrative layers and target contract manufacturing growth. Tan's comments, while light on specifics, helped calm nerves following Friday's warning of weaker-than-expected PC-processor demand and margin pressure from new fab ramps. Analysts say markets now await detailed milestones on next-generation AI accelerators and firm orders from foundry clients. Any concrete timelines or partner commitments will be pivotal, Evercore ISI strategists noted. Looking ahead, markets will hinge on these catalysts: 1. Foundry Direct Connect Event (April 29, 2025): Intel will host its inaugural Foundry Direct Connect in San Jose, showcasing its 18A process roadmap, packaging advances and partner tape-outs . Investors will look for commitments from external customers and concrete volume timelines. 2. Panther Lake Tape-Out Confirmation: Management has indicated that tape-outs on the forthcoming Panther Lake AI accelerator should be completed by late 2025. This article first appeared on GuruFocus. Sign in to access your portfolio
