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TECHx
30-04-2025
- Business
- TECHx
Intel Foundry Unveils New Process and Packaging Updates
Home » Tech Value Chain » Global Brands » Intel Foundry Unveils New Process and Packaging Updates Intel Foundry hosted its Direct Connect 2025 event, revealing progress across process technology, advanced packaging, and manufacturing. The company also introduced new ecosystem programs and partnerships that support its systems foundry strategy. CEO Lip-Bu Tan opened the event, highlighting Intel Foundry's commitment to building a world-class systems foundry. He emphasized customer trust and the importance of an engineering-first culture. Other keynote speakers included Naga Chandrasekaran, chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services. Throughout the day, Intel executives were joined by leaders from Synopsys, Cadence, Siemens EDA, PDF Solutions, MediaTek, Microsoft, and Qualcomm. They discussed collaborative efforts to help customers bring innovative products to market. Key Announcements Process Technology Intel Foundry shared early access to its new Intel 14A Process Design Kit (PDK). Multiple customers plan to build test chips on Intel 14A, the successor to Intel 18A. Intel 14A will feature PowerDirect, an enhancement over Intel 18A's PowerVia. Intel 18A is in risk production and will enter volume manufacturing this year. Two variants, Intel 18A-P and 18A-PT, are now in development. Intel 18A-P offers broader performance. Intel 18A-PT uses hybrid bonding with sub-5µm pitch. Intel's first 16nm tape-out is in the fab, with work underway on 12nm nodes in partnership with UMC. Advanced Packaging New offerings include EMIB-T, Foveros-R, and Foveros-B. These technologies enhance 3D stacking and high-bandwidth memory support. Intel is partnering with Amkor to expand packaging flexibility for customers. Manufacturing Intel's Arizona Fab 52 has processed its first 18A wafer. Volume production for 18A will begin in Oregon, with Arizona to follow. Intel 14A and 18A production will remain U.S.-based. Ecosystem Development Intel added new programs to its Foundry Accelerator Alliance. The new Intel Foundry Chiplet Alliance focuses on secure chiplet infrastructure. It aims to support government and commercial applications. The event demonstrated Intel Foundry's growing momentum across multiple fronts. With updates on process nodes, packaging technologies, domestic manufacturing, and ecosystem alliances, Intel continues to position itself as a strong player in the global semiconductor space. Intel Foundry plans to scale these capabilities further to support customers seeking trusted, U.S.-based manufacturing with advanced technology.
Zawya
30-04-2025
- Business
- Zawya
Intel Foundry gathers customers and partners, outlines priorities
UAE — Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company will also announce new ecosystem programs and partnerships, and welcome industry leaders to discuss how a systems foundry approach enables collaboration with partners and unlocks innovation for customers. Intel CEO Lip-Bu Tan will open the event by discussing Intel Foundry's progress and priorities as the company drives the next phase of its foundry strategy. Naga Chandrasekaran, Intel Foundry chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services, will also deliver keynotes during the morning session, sharing process and advanced packaging news while highlighting Intel Foundry's globally diverse manufacturing and supply chain. Tan will be joined on stage by ecosystem partners including Synopsys, Cadence, Siemens EDA and PDF Solutions to highlight collaboration in serving foundry customers. O'Buckley will be joined by executives from MediaTek, Microsoft and Qualcomm. 'Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing,' said Tan. 'Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term.' Event Press Kit: Intel Foundry Direct Connect 2025 Today's announcements encompass core process and advanced packaging technology, a milestone in domestic U.S. manufacturing, and ecosystem support required to earn the trust of foundry customers. They include: Process Technology Intel Foundry has engaged with lead customers on the Intel 14A process technology, the successor to Intel 18A. The company has distributed to lead customers an early version of the Intel 14A Process Design Kit (PDK), and multiple customers have expressed their intent to build test chips on the new process node. Intel 14A will feature PowerDirect direct contact power delivery, building on the PowerVia backside power delivery technology in Intel 18A. Intel 18A is now in risk production and expected to reach volume manufacturing this year. Intel Foundry's ecosystem partners have electronic design automation (EDA) enablement, reference flows and intellectual property (IP) ready for production designs today. The new Intel 18A variant, called Intel 18A-P, is designed to deliver enhanced performance to a broader set of foundry customers. Early wafers based on Intel 18A-P are in the fab now. Because Intel 18A-P will be design rule-compatible with Intel 18A, IP and EDA partners have already started updating their offerings for the variant. Intel 18A-PT is another new variant that builds on Intel 18A-P performance and power efficiency advancements. Intel 18A-PT can be connected to top die using Foveros Direct 3D with hybrid bonding interconnect pitch less than 5 micrometers (µm). Intel Foundry's first production 16 nanometer (nm) tape-out is in the fab now, and the company is engaging with lead customers on a 12nm node and derivatives built in collaboration with UMC. Advanced Packaging Intel Foundry offers system-level integration using Intel 14A on Intel 18A-PT, connected via Foveros Direct (3D stacking) and embedded multi-die interconnect bridging (2.5D bridging). New advanced packaging technology offerings include EMIB-T to enable future high bandwidth memory needs and two new additions to the Foveros architecture: Foveros-R and Foveros-B provide additional efficient and flexible options for customers. A new engagement with Amkor Technology increases customer flexibility in choosing the right advanced packaging technology for their needs. Manufacturing Fab 52 in Arizona has successfully 'run the lot,' marking the first wafer processed through the facility, demonstrating progress in domestic manufacturing of leading-edge Intel 18A wafers. Intel 18A volume production will begin in Intel's Oregon fabs as Arizona manufacturing ramps later this year. Intel 18A and Intel 14A research, development and wafer production will all be U.S.-based. Ecosystem New programs have been added within Intel Foundry's Accelerator Alliance – Intel Foundry Chiplet Alliance and Value Chain Alliance – along with a range of announcements from top ecosystem partners. Delivering Trusted Ecosystem Tools and IP Intel Foundry is supported by a comprehensive portfolio of IP, EDA and design services solutions delivered by trusted, proven ecosystem partners to drive advancements beyond traditional node scaling. As the newest program in Intel Foundry's Accelerator Alliance, the new Intel Foundry Chiplet Alliance will initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets. (Quote Sheet: Introducing the Intel Foundry Chiplet Alliance) The Intel Foundry Accelerator Alliance also includes IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance.
Techday NZ
30-04-2025
- Business
- Techday NZ
Intel reveals chip advances, new partnerships & foundry progress
Intel has released details of advancements in its process technology and packaging roadmap, along with updates on ecosystem partnerships and manufacturing progress at the recent Intel Foundry Direct Connect event. Chief Executive Officer Lip-Bu Tan addressed customers and partners, highlighting the company's foundry strategy and commitment to enabling customer innovation. Tan's keynote was followed by presentations from Naga Chandrasekaran, Chief Technology and Operations Officer, and Kevin O'Buckley, General Manager of Foundry Services, who provided updates on Intel's manufacturing and supply chain operations. During the event, Tan was joined by representatives from ecosystem partners such as Synopsys, Cadence, Siemens EDA and PDF Solutions, who discussed the importance of collaboration in supporting foundry customers. O'Buckley also held discussions with executives from MediaTek, Microsoft and Qualcomm. Tan commented: "Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing. Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term." On process technology, Intel Foundry announced engagement with lead customers on the forthcoming Intel 14A process node, which follows Intel 18A. The early version of the Intel 14A Process Design Kit has been distributed, and several customers intend to create test chips using this node. Intel 14A will introduce PowerDirect direct contact power delivery, progressing from PowerVia technology in Intel 18A. Intel 18A itself has reached risk production with the expectation of entering volume manufacturing later in the year. Key partners within the foundry's electronic design automation ecosystem have made available the enablement, reference flows and intellectual property components required for production designs using Intel 18A. Intel introduced Intel 18A-P, a new variant targeting broader foundry use by enhancing performance. Early wafers relying on Intel 18A-P are reportedly being processed now, and this variant maintains design rule compatibility with Intel 18A. Partner intellectual property and design tool offerings are actively being updated to support Intel 18A-P. Intel also highlighted Intel 18A-PT, which advances performance and power efficiency, and can be integrated using Foveros Direct 3D hybrid bonding with an interconnect pitch below 5 micrometres. The foundry provided further detail on customer engagement with its 16 nanometre production tape-out, with development ongoing for a 12nm node and related products created alongside foundry partner UMC. On the packaging front, Intel Foundry is enabling system-level integration by combining Intel 14A on Intel 18A-PT, with connections achieved through Foveros Direct (3D stacking) and embedded multi-die interconnect bridging. The company introduced EMIB-T technology aimed at high bandwidth memory needs, and expanded the Foveros architecture with two new options: Foveros-R and Foveros-B, to provide additional flexibility and efficiency. Intel's collaboration with Amkor Technology is intended to increase the range of advanced packaging choices available to customers. In manufacturing, Intel announced that its Fab 52 in Arizona has successfully processed its first lot of wafers, considered a milestone for domestic Intel 18A wafer manufacturing. Oregon facilities will lead volume production as the Arizona fab increases output. Intel outlined that research, development and wafer production for Intel 18A and Intel 14A will remain within the United States. The foundry detailed updates to its ecosystem strategy, noting the expansion of the Intel Foundry Accelerator Alliance to include the new Intel Foundry Chiplet Alliance and Value Chain Alliance. According to Intel, the Chiplet Alliance will "initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets." The Accelerator Alliance program also encompasses the IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance, intended to provide a comprehensive suite of intellectual property, design automation and design service solutions through ecosystem partnerships. Intel's announcements were made alongside guidance regarding forward-looking statements. The company outlined risks related to industry competition, research and development investment, technology commercialisation, market demand, global supply chain challenges, and macroeconomic factors. The risk statement further referenced supply chain instability, potential product issues, security considerations and shifts in global trade policy as factors that could influence outcomes compared with those anticipated in strategic planning.
