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Associated Press
01-04-2025
- Business
- Associated Press
Lumentum Showcases Next-Generation InP Chip Solutions Enabling Scalable AI Data Centers at OFC 2025
Lumentum Holdings Inc. (" Lumentum"), a global leader in optical and photonic solutions for the cloud and networking markets, announced today new advancements in foundational indium phosphide (InP) photonic chip technologies designed to deliver higher bandwidth and more power efficient connectivity for next-generation AI-driven data centers. Lumentum's latest InP innovations — enabling future 400 Gbps-per-lane optical links, more efficient 200 Gbps-per-lane optical links, and co-packaged optics — will be showcased in live demonstrations and a technical presentation at the 2025 Optical Fiber Communications Conference and Exhibition (OFC) at Lumentum booth #2119 in San Francisco, California, April 1-3. As AI workloads grow exponentially, optical link speeds in AI back-end networks are doubling approximately every two years — driving a critical need for innovation in leading-edge photonic technologies. At the same time, power availability and cooling requirements are placing increasing constraints on data centers, making energy efficiency more important than ever. Lumentum's InP component technologies directly address both challenges by enabling power-efficient bandwidth scaling in photonic interconnects. 'Building on decades of InP expertise, Lumentum is driving industry technology leadership and volume production readiness for the future 400G per lane generation of optical interconnects, along with more efficient 200G per lane optical interconnects, to enable data center compute capacity scaling,' said Matt Sysak, Lumentum CTO of Cloud and Networking. 'Lumentum InP technology is also enabling new co-packaged optics solutions to significantly reduce power consumption in AI data center networks, supporting larger AI installations and accelerating the transition from copper to photonic interconnects.' Advancing 400 Gbps-per-Lane Laser Technology Lumentum is demonstrating 400 Gbps-per-lane photonic technologies poised to enable the 3.2T generation of optical transceivers at OFC 2025 in live demonstrations and partner announcements, including: 448G EML: Lumentum will demonstrate 448 Gbps data transmission using a 224 GBaud PAM4 externally modulated laser (EML) technology in collaboration with Keysight Technologies and NTT Innovative Devices at booth #1301. Lumentum's high-bandwidth InP EML will enable next generation power-efficient, high-speed optical interconnects for AI and cloud infrastructure. 450G PAM4 DFB-MZI: A live demonstration of Lumentum's 450 Gbps PAM4 distributed feedback (DFB) laser with an integrated Mach-Zehnder (MZI) modulator will highlight another of Lumentum's 400 Gbps-per-lane technologies. Also based on Lumentum's high-speed InP photonic technology platform, the DFB-MZI provides superior chirp control, power efficiency, and reduced signal distortion, which are critical advantages for longer reach applications and complements Lumentum's 400 Gbps-per-lane EML technology. See the demonstration at booth #2119. High-Efficiency 200 Gbps-per-Lane Transmitter Technology Lumentum today delivers best-in-class transmit and receive components designed to meet the demands of next-generation AI data centers. Transitioning from 100 Gbps to 200 Gbps lane speed enables data center bandwidth scaling to support accelerated AI workloads. Lumentum's 200 Gbps-per-lane InP EMLs are available now. To address power challenges in bandwidth scaling, Lumentum engineers presented a technical paper at OFC 2025 detailing results from Lumentum's new 200 Gbps-per-lane differential drive electro-absorption modulated laser (DD EML). These lasers operate at a lower drive voltage, reducing power dissipation while offering excellent signal integrity and cross-talk immunity. Complementing the 200G EMLs is Lumentum's 200G Lens Integrated Photodiode (LIPD) which features high responsivity and wide bandwidth. The 200G LIPD integrates seamlessly with flip-chip bonding techniques. Ultra-High-Power Lasers for Co-Packaged Optics Lumentum's breakthrough ultra-high power (UHP) 1310 nm DFB lasers are engineered for the demanding requirements of co-packaged optics (CPO) to support higher-density optical interconnects with enhanced power efficiency, reliability, and density. The UHP platform's proven high reliability is rooted in Lumentum's long-standing leadership in InP pump lasers for demanding Raman amplification applications. Lumentum was recently selected as an NVIDIA silicon photonics ecosystem partner and Lumentum's ultra-high-power, high-efficiency lasers are integrated into NVIDIA's newly announced Spectrum-X Photonics and Quantum-X Photonics networking switches. InP photonic technology is a critical enabler of AI data center compute capacity growth. Lumentum continues to innovate and be at the forefront of InP photonic technology and is collaborating closely with industry leaders to shape long-term technology roadmaps. By advancing next-generation InP photonic solutions, the company is enabling power-efficient bandwidth scaling in optical interconnects. About Lumentum Lumentum (NASDAQ: LITE) is a market-leading designer and manufacturer of innovative optical and photonic products enabling optical networking and laser applications worldwide. Lumentum optical components and subsystems are part of virtually every type of telecom, enterprise, and data center network. Lumentum lasers enable advanced manufacturing techniques and diverse applications, including next-generation 3D sensing capabilities. Lumentum is headquartered in San Jose, California, with R&D, manufacturing, and sales offices worldwide. For more information, visit and follow Lumentum on Bluesky, Facebook, Instagram, LinkedIn, X, and YouTube. Copyright Business Wire 2025. PUB: 04/01/2025 08:31 AM/DISC: 04/01/2025 08:31 AM
Yahoo
01-04-2025
- Business
- Yahoo
Coherent to Showcase Innovative Products, Technologies and Thought Leadership at OFC 2025
SAXONBURG, Pa., March 31, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in photonics, announced today that it will showcase its new products and technologies for next-generation optical communications networks at OFC 2025, Apr 1-3 at the Moscone Center in San Francisco, Booth #1519. Coherent will bring also expert insights thanks to its thought leaders that will present at panels, technical sessions, and other OFC events. RECENT PRODUCT ANNOUNCEMENTS Optical Transceivers Optimized for Optical Circuit SwitchesSuite of 400G, 800G, and 1.6T pluggable optical transceivers optimized for use in data centers that incorporate optical circuit switches (OCSs). These transceivers come in QSFP-DD and OSFP form factors and meet the original IEEE-defined network insertion losses in addition to extra insertion losses introduced by an OCS. 2x400G-FR4 Lite Silicon Photonics TransceiverA silicon photonics-based module optimized for AI-driven data centers and high-speed Ethernet networks, delivering 500-meter reach while significantly reducing power consumption. Pluggable High-Dynamic Range QSFP OTDRA high-performance embedded Optical Time Domain Reflectometer (eOTDR) in a QSFP package. With an industry-leading 30 dB dynamic range, it enables precise, repeatable OTDR traces for spans up to 150 km—all in a compact, pluggable form factor. General Availability of 800G Coherent QSFP-DD TransceiverLeveraging its advanced IC-TROSA optical engine on proprietary Indium Phosphide (InP) chip technology, the module provides transmitter optical output power of–7dBm for OIF 800ZR and 0dBm for ROADM-based line systems. General Availability of 100G ZR QSFP28-DCO High Output Power The industry's first 100G ZR QSFP28-DCO featuring 0dBm optical output power, and built on Coherent vertical integration capability, including InP photonic integrated circuits (PICs) and in-house digital signal processor (DSP), is now generally available. TECHNOLOGY AND PRODUCT DEMONSTRATIONS Industry's first 400G D-EMLBuilt on the success of its 200G D-EML, which was recognized in the 2025 Lightwave+BTR Innovation Reviews, this innovative differential electro-absorption Modulated laser (D-EML) by Coherent addresses critical challenges in optical transceiver designs for 1.6T and future 3.2T connectivity. Its differential design effectively doubles the signal amplitude, significantly lowering overall power consumption while minimizing crosstalk. Silicon Photonics based 1.6T Transceivers tailored to diverse environments Live demonstrations of three different 1.6T-DR8 transceiver modules sharing a common OSFP form factor, with 8x200G optical and electrical interfaces and a silicon photonics architecture. The first demonstration features linear receive optics (LRO) with a digital signal processor (DSP) retiming only in the transmit direction; the second demonstration features ultra-low bit error rates; and the third demonstration incorporates the next generation of 3 nm digital signal processors (DPSs) to reduce power consumption. 1.6T Optical Transceivers Based on 200G VCSEL A 1.6T-SR8 optical transceiver incorporating advanced 200G vertical cavity surface emitting lasers (VCSELs) from Coherent will be demonstrated, featuring 8x200G optical and electrical interfaces within an OSFP form factor. Multi-rail Technology for Efficient Optical TransportAn innovative optical transport solution combining fundamental advances in high-efficiency pump lasers with novel resource pooling concepts to dramatically increase line system capacity while lowering the size and power consumption. TEST AND MEASUREMENT WaveAnalyzer 1500B for High Precision Optical Transceiver Testing A high-resolution optical spectrum analyzer delivering 100 MHz absolute frequency accuracy, high resolution, high speed, and full C+L band coverage in a single instrument. OPTICA EXECUTIVE FORUM Sunday, 30 March - Session 2: Status of Photonic-enable ModulesSpeaker: Julie EngMonday, March 31, 10:35 a.m. – 11:50 a.m. Sunday, 30 March - Session 4: CEO PanelSpeaker: Jim AndersonMonday, March 31, 2:30 p.m. – 3:40 p.m. PANELS MW Panel I - State of the Industry: Now and in 2030Moderator: Vipul BhattPanelist: Sanjai ParthasarathiTuesday, Apr 1, 10:45 a.m.-12:15 I MW Panel IV: Inside Data Centers: Pluggable Optics EvolutionPanelist: Vipul BhattWednesday, April 2, 2:15 p.m. – 3:45 I MW Panel VI: Digital Twin, Telemetry, Monitoring and TestingPanelist: Jack J. XuThursday, April 3, 12:00 p.m. – 1:30 I WORKSHOPS Is Coherent DSP Solved? Are we Running Out of Innovation?Speaker: Matthias BergerSunday, March 30, 1:00 p.m. – 3:30 213-214 (Level 2) Short and Sweet: How Do We Cost-Optimize a 10 Meter Link for Scaling Up Machine Learning Clusters?Speaker: Julie EngSunday, March 30, 4:00 p.m. – 6:30 211-212 (Level 2) Towards 400G/ IM-DD: How to Pick up the Next Factor of 2?Speaker: Anna TatarczakSunday, 30 March, 4:00 p.m. – 6:30 213-214 (Level 2) Symposia and Special Sessions Advanced Packaging and Integrated Optics for Scale-Up AI interconnectsSpeaker: Julie EngWednesday, April 2, 2:00 p.m. to 6:30 201-202 (Level 2) About Coherent Coherent empowers market innovators to define the future through breakthrough technologies, from materials to systems. We deliver innovations that resonate with our customers in diversified applications for the industrial, communications, electronics, and instrumentation markets. Coherent has research and development, manufacturing, sales, service, and distribution facilities worldwide. For more information, please visit us at Media Contact: innovations@
Associated Press
31-03-2025
- Business
- Associated Press
Coherent to Showcase Innovative Products, Technologies and Thought Leadership at OFC 2025
SAXONBURG, Pa., March 31, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in photonics, announced today that it will showcase its new products and technologies for next-generation optical communications networks at OFC 2025, Apr 1-3 at the Moscone Center in San Francisco, Booth #1519. Coherent will bring also expert insights thanks to its thought leaders that will present at panels, technical sessions, and other OFC events. RECENT PRODUCT ANNOUNCEMENTS Optical Transceivers Optimized for Optical Circuit Switches Suite of 400G, 800G, and 1.6T pluggable optical transceivers optimized for use in data centers that incorporate optical circuit switches (OCSs). These transceivers come in QSFP-DD and OSFP form factors and meet the original IEEE-defined network insertion losses in addition to extra insertion losses introduced by an OCS. 2x400G-FR4 Lite Silicon Photonics Transceiver A silicon photonics-based module optimized for AI-driven data centers and high-speed Ethernet networks, delivering 500-meter reach while significantly reducing power consumption. Pluggable High-Dynamic Range QSFP OTDR A high-performance embedded Optical Time Domain Reflectometer (eOTDR) in a QSFP package. With an industry-leading 30 dB dynamic range, it enables precise, repeatable OTDR traces for spans up to 150 km—all in a compact, pluggable form factor. General Availability of 800G Coherent QSFP-DD Transceiver Leveraging its advanced IC-TROSA optical engine on proprietary Indium Phosphide (InP) chip technology, the module provides transmitter optical output power of–7dBm for OIF 800ZR and 0dBm for ROADM-based line systems. General Availability of 100G ZR QSFP28-DCO High Output Power The industry's first 100G ZR QSFP28-DCO featuring 0dBm optical output power, and built on Coherent vertical integration capability, including InP photonic integrated circuits (PICs) and in-house digital signal processor (DSP), is now generally available. TECHNOLOGY AND PRODUCT DEMONSTRATIONS Industry's first 400G D-EML Built on the success of its 200G D-EML, which was recognized in the 2025 Lightwave+BTR Innovation Reviews, this innovative differential electro-absorption Modulated laser (D-EML) by Coherent addresses critical challenges in optical transceiver designs for 1.6T and future 3.2T connectivity. Its differential design effectively doubles the signal amplitude, significantly lowering overall power consumption while minimizing crosstalk. Silicon Photonics based 1.6T Transceivers tailored to diverse environments Live demonstrations of three different 1.6T-DR8 transceiver modules sharing a common OSFP form factor, with 8x200G optical and electrical interfaces and a silicon photonics architecture. The first demonstration features linear receive optics (LRO) with a digital signal processor (DSP) retiming only in the transmit direction; the second demonstration features ultra-low bit error rates; and the third demonstration incorporates the next generation of 3 nm digital signal processors (DPSs) to reduce power consumption. 1.6T Optical Transceivers Based on 200G VCSEL A 1.6T-SR8 optical transceiver incorporating advanced 200G vertical cavity surface emitting lasers (VCSELs) from Coherent will be demonstrated, featuring 8x200G optical and electrical interfaces within an OSFP form factor. Multi-rail Technology for Efficient Optical Transport An innovative optical transport solution combining fundamental advances in high-efficiency pump lasers with novel resource pooling concepts to dramatically increase line system capacity while lowering the size and power consumption. TEST AND MEASUREMENT OPTICA EXECUTIVE FORUM Sunday, 30 March - Session 2: Status of Photonic-enable Modules Speaker: Julie Eng Monday, March 31, 10:35 a.m. – 11:50 a.m. Sunday, 30 March - Session 4: CEO Panel Speaker: Jim Anderson Monday, March 31, 2:30 p.m. – 3:40 p.m. PANELS MW Panel I - State of the Industry: Now and in 2030 Moderator: Vipul Bhatt Panelist: Sanjai Parthasarathi Tuesday, Apr 1, 10:45 a.m.-12:15 p.m. Theater I MW Panel IV: Inside Data Centers: Pluggable Optics Evolution Panelist: Vipul Bhatt Wednesday, April 2, 2:15 p.m. – 3:45 p.m. Theater I MW Panel VI: Digital Twin, Telemetry, Monitoring and Testing Panelist: Jack J. Xu Thursday, April 3, 12:00 p.m. – 1:30 p.m. Theater I WORKSHOPS Is Coherent DSP Solved? Are we Running Out of Innovation? Speaker: Matthias Berger Sunday, March 30, 1:00 p.m. – 3:30 p.m. Rooms 213-214 (Level 2) Short and Sweet: How Do We Cost-Optimize a 10 Meter Link for Scaling Up Machine Learning Clusters? Speaker: Julie Eng Sunday, March 30, 4:00 p.m. – 6:30 p.m. Rooms 211-212 (Level 2) Towards 400G/ IM-DD: How to Pick up the Next Factor of 2? Speaker: Anna Tatarczak Sunday, 30 March, 4:00 p.m. – 6:30 p.m. Rooms 213-214 (Level 2) Symposia and Special Sessions Advanced Packaging and Integrated Optics for Scale-Up AI interconnects Speaker: Julie Eng Wednesday, April 2, 2:00 p.m. to 6:30 p.m. Rooms 201-202 (Level 2) About Coherent Coherent empowers market innovators to define the future through breakthrough technologies, from materials to systems. We deliver innovations that resonate with our customers in diversified applications for the industrial, communications, electronics, and instrumentation markets. Coherent has research and development, manufacturing, sales, service, and distribution facilities worldwide. For more information, please visit us at Media Contact:
Associated Press
12-03-2025
- Business
- Associated Press
University Wafer, Inc. Expands Leadership in Compound Semiconductor Substrates, Serving Global Research Demands
BOSTON, MA, UNITED STATES, March 12, 2025 / / -- University Wafer, Inc., a leading supplier of semiconductor substrates and services, proudly announces the expansion of its extensive range and expertise in compound semiconductor substrates. Amid growing global challenges in sourcing critical materials like gallium and indium due to geopolitical tensions, export restrictions, and fluctuating market availability, University Wafer, Inc. has proactively secured robust supply chains, ensuring uninterrupted availability for customers worldwide. With decades of industry experience and unmatched technical expertise, University Wafer continues to support cutting-edge research and development across diverse fields, including optoelectronics, telecommunications, power electronics, and photonics. Compound semiconductors, formed by combining elements from different groups of the periodic table, exhibit unique electrical, optical, and thermal characteristics distinct from traditional silicon substrates. These materials offer significantly higher electron mobility, direct bandgap properties, and superior thermal stability, making them ideal for advanced technological applications. University Wafer specializes in providing an extensive range of compound semiconductor substrates, including Gallium Arsenide (GaAs), Indium Phosphide (InP), Gallium Nitride (GaN), Silicon Carbide (SiC), Cadmium Telluride (CdTe), Zinc Selenide (ZnSe), and more. Recognizing the difficulties faced by many organizations in securing gallium and indium, University Wafer leverages established global partnerships and diversified sourcing strategies to ensure a stable supply. The company's expert team offers tailored guidance and technical assistance to help customers select substrates tailored to their specific project requirements. 'We are committed to empowering our clients' innovation by providing not only a vast selection of substrates but also reliable access to materials like gallium and indium, which have become increasingly challenging to source,' says Christian Baker, Founder/CEO University Wafer . 'Our robust supply chain strategies and longstanding global relationships enable us to consistently meet customer needs despite external market disruptions.' University Wafer's GaAs substrates are integral to the rapidly growing field of RF and microwave electronics, crucial for telecommunications, radar, and satellite communication technologies. Their low defect densities and excellent electron mobility support efficient, high-frequency operations, making them critical for 5G technology deployment and beyond. Similarly, University Wafer offers high-quality GaN substrates, which are revolutionizing power electronics and LED technology, delivering high efficiency, reliability, and performance in power management applications, including electric vehicles, renewable energy, and LED lighting. In the realm of III-V substrates, Indium Phosphide (InP) provided by University Wafer is essential for fiber-optic communications and high-speed electronics. With bandwidth demand continuously rising, InP substrates empower industries to achieve faster, more efficient data transmission, vital for next-generation internet infrastructure and 5G technology. Complementing their III-V product line, University Wafer's inventory of II-VI compound substrates, such as Cadmium Telluride (CdTe), Zinc Selenide (ZnSe), and Mercury Cadmium Telluride (HgCdTe), addresses specialized optical and sensing applications. CdTe substrates are notably utilized in advanced solar cells, providing superior efficiency and lower manufacturing costs compared to traditional silicon-based photovoltaics. Zinc Selenide (ZnSe) and Zinc Sulfide (ZnS) substrates from University Wafer are crucial in infrared optics and laser systems, supporting industries such as defense, aerospace, and industrial laser applications. Meanwhile, HgCdTe substrates continue to dominate infrared imaging and night vision technologies, supporting defense and aerospace missions globally. The rise of Silicon Carbide (SiC) as a superior substrate for high-power and high-temperature electronic devices has made it a cornerstone offering from University Wafer. SiC substrates deliver enhanced performance, reliability, and thermal conductivity, key in power electronic devices like electric vehicle charging infrastructure, power inverters, and renewable energy systems. Beyond offering diverse substrates, University Wafer sets itself apart through comprehensive expertise, assisting clients with technical guidance on selecting substrates best suited to their unique applications. By leveraging decades of experience and extensive technical knowledge, the company supports clients throughout the process, from substrate selection to post-sales technical advice. 'Our deep industry expertise allows us to provide informed recommendations and technical support to our clients,' says Mr. Baker. 'We ensure researchers, developers, and manufacturers have the right substrates, enabling innovation and accelerating the development cycle.' University Wafer's efficient quoting and streamlined procurement process ensures rapid delivery worldwide, meeting tight deadlines critical to R&D projects and industrial production schedules. With thousands of standard and custom substrates in stock, the company is prepared to fulfill even niche or highly specialized requests. UniversityWafer, Inc. prides itself on being responsive, knowledgeable, and reliable partners to our global customer base. Our reputation is built on our ability to deliver hard-to-find substrates quickly, maintaining our customers' competitive edge in the fast-paced technology market. In addition to standard offerings, University Wafer provides customized substrates tailored to precise specifications, including variations in doping levels, crystal orientation, thickness, and surface treatments. Their deep expertise in semiconductor materials positions them as a trusted advisor and partner in complex semiconductor projects. As technological advancements continue, compound semiconductor substrates from University Wafer play an increasingly critical role across emerging sectors, such as quantum computing, biomedical sensors, and next-generation optoelectronics. Their commitment to excellence, customer-focused service, and technical depth ensures sustained leadership in the semiconductor industry. UniversityWafer, Inc.'s mission has always been clear: support innovation by providing high-quality, reliable semiconductor substrates and unmatched expertise. As technology evolves and sourcing becomes more complex, we continuously expand and refine our inventory and capabilities, ensuring University Wafer remains a pivotal resource for groundbreaking semiconductor research and manufacturing worldwide. For further information, to request a quote, or to discuss specific semiconductor substrate requirements, please visit University Wafer, Inc. online at About University Wafer, Inc. University Wafer, Inc. is a leading supplier of semiconductor wafers and substrates globally, serving academia, industry, and research institutions. Renowned for its extensive product selection, technical expertise, and superior customer support, the company continues to facilitate cutting-edge innovations across various semiconductor applications. Contact: UniversityWafer, Inc. +1 617-268-2595 X LinkedIn YouTube Legal Disclaimer:
