Latest news with #IntelFoundryDirectConnect
Yahoo
07-05-2025
- Business
- Yahoo
Intel reaffirms commitment to division behind its New Albany plant
COLUMBUS, Ohio (WCMH) — Ohio was far from a highlight in Intel's 2025 Foundry conference, but the project was included in Intel's commitments to a strong Foundry. Despite buyout rumors, Intel leadership reaffirmed their commitment to Intel Foundry last week at Intel Foundry Direct Connect. The second annual conference brought together more than 1,000 customers and partners of Intel Foundry, the division responsible for the $28 billion Ohio One plant, the largest private investment in state history, under construction in New Albany. It was the first Foundry-specific event under new CEO Lip-Bu Tan, who has spoken little about Intel Foundry during his tenure thus far. 'I'm committed to make the Intel Foundry successful,' Tan said at Direct Connect. May 2025 primary election results for central Ohio Tan mentioned Ohio's plant as a continued building project, and spoke encouragingly of new factory space. Tan also said advanced packaging may eventually be possible in Ohio and is already underway elsewhere in the U.S. However, Ohio largely took a back seat in the keynote speeches, with Intel leaders selecting other factories to showcase. Intel Foundry shared new updates on products and developments that are set to take off this year. These announcements have little to do with Ohio's plant as is, but if the products are well received, increased manufacturing demands could be encouraging for Ohio's development. Intel leaders also thanked President Donald Trump, saying the U.S. government is a key customer. Tan said he was pleased Trump shares the goal of semiconductor manufacturing in the U.S. However, none of the keynote speakers mentioned the CHIPS Act, the $7.8 billion federal commitment to Intel Foundry that still largely needs to be paid out. The bipartisan CHIPS Act was propelled forward by former President Joe Biden, and Trump has called for its repeal several times. Intel has received $2.2 billion of its promised funding, with the last payment coming in January in the last days of Biden's White House. See previous coverage of the CHIPS Act in the video player above. School Choice Ohio celebrates 20 years, addresses voucher concerns The company announced its new Intel Foundry Chiplet Alliance, which will emphasize collaboration to improve Intel's Foundry division. Under the alliance, different technology companies will collaborate to improve designs using shared innovations. Including Intel, there are at least 15 confirmed alliance members, 11 of which are American companies, although none are headquartered in Ohio. The alliance also includes two companies headquartered in Taiwan, and one each in England and France.
Zawya
30-04-2025
- Business
- Zawya
Intel Foundry gathers customers and partners, outlines priorities
UAE — Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company will also announce new ecosystem programs and partnerships, and welcome industry leaders to discuss how a systems foundry approach enables collaboration with partners and unlocks innovation for customers. Intel CEO Lip-Bu Tan will open the event by discussing Intel Foundry's progress and priorities as the company drives the next phase of its foundry strategy. Naga Chandrasekaran, Intel Foundry chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services, will also deliver keynotes during the morning session, sharing process and advanced packaging news while highlighting Intel Foundry's globally diverse manufacturing and supply chain. Tan will be joined on stage by ecosystem partners including Synopsys, Cadence, Siemens EDA and PDF Solutions to highlight collaboration in serving foundry customers. O'Buckley will be joined by executives from MediaTek, Microsoft and Qualcomm. 'Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing,' said Tan. 'Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term.' Event Press Kit: Intel Foundry Direct Connect 2025 Today's announcements encompass core process and advanced packaging technology, a milestone in domestic U.S. manufacturing, and ecosystem support required to earn the trust of foundry customers. They include: Process Technology Intel Foundry has engaged with lead customers on the Intel 14A process technology, the successor to Intel 18A. The company has distributed to lead customers an early version of the Intel 14A Process Design Kit (PDK), and multiple customers have expressed their intent to build test chips on the new process node. Intel 14A will feature PowerDirect direct contact power delivery, building on the PowerVia backside power delivery technology in Intel 18A. Intel 18A is now in risk production and expected to reach volume manufacturing this year. Intel Foundry's ecosystem partners have electronic design automation (EDA) enablement, reference flows and intellectual property (IP) ready for production designs today. The new Intel 18A variant, called Intel 18A-P, is designed to deliver enhanced performance to a broader set of foundry customers. Early wafers based on Intel 18A-P are in the fab now. Because Intel 18A-P will be design rule-compatible with Intel 18A, IP and EDA partners have already started updating their offerings for the variant. Intel 18A-PT is another new variant that builds on Intel 18A-P performance and power efficiency advancements. Intel 18A-PT can be connected to top die using Foveros Direct 3D with hybrid bonding interconnect pitch less than 5 micrometers (µm). Intel Foundry's first production 16 nanometer (nm) tape-out is in the fab now, and the company is engaging with lead customers on a 12nm node and derivatives built in collaboration with UMC. Advanced Packaging Intel Foundry offers system-level integration using Intel 14A on Intel 18A-PT, connected via Foveros Direct (3D stacking) and embedded multi-die interconnect bridging (2.5D bridging). New advanced packaging technology offerings include EMIB-T to enable future high bandwidth memory needs and two new additions to the Foveros architecture: Foveros-R and Foveros-B provide additional efficient and flexible options for customers. A new engagement with Amkor Technology increases customer flexibility in choosing the right advanced packaging technology for their needs. Manufacturing Fab 52 in Arizona has successfully 'run the lot,' marking the first wafer processed through the facility, demonstrating progress in domestic manufacturing of leading-edge Intel 18A wafers. Intel 18A volume production will begin in Intel's Oregon fabs as Arizona manufacturing ramps later this year. Intel 18A and Intel 14A research, development and wafer production will all be U.S.-based. Ecosystem New programs have been added within Intel Foundry's Accelerator Alliance – Intel Foundry Chiplet Alliance and Value Chain Alliance – along with a range of announcements from top ecosystem partners. Delivering Trusted Ecosystem Tools and IP Intel Foundry is supported by a comprehensive portfolio of IP, EDA and design services solutions delivered by trusted, proven ecosystem partners to drive advancements beyond traditional node scaling. As the newest program in Intel Foundry's Accelerator Alliance, the new Intel Foundry Chiplet Alliance will initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets. (Quote Sheet: Introducing the Intel Foundry Chiplet Alliance) The Intel Foundry Accelerator Alliance also includes IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance.
Techday NZ
30-04-2025
- Business
- Techday NZ
Intel reveals chip advances, new partnerships & foundry progress
Intel has released details of advancements in its process technology and packaging roadmap, along with updates on ecosystem partnerships and manufacturing progress at the recent Intel Foundry Direct Connect event. Chief Executive Officer Lip-Bu Tan addressed customers and partners, highlighting the company's foundry strategy and commitment to enabling customer innovation. Tan's keynote was followed by presentations from Naga Chandrasekaran, Chief Technology and Operations Officer, and Kevin O'Buckley, General Manager of Foundry Services, who provided updates on Intel's manufacturing and supply chain operations. During the event, Tan was joined by representatives from ecosystem partners such as Synopsys, Cadence, Siemens EDA and PDF Solutions, who discussed the importance of collaboration in supporting foundry customers. O'Buckley also held discussions with executives from MediaTek, Microsoft and Qualcomm. Tan commented: "Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing. Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term." On process technology, Intel Foundry announced engagement with lead customers on the forthcoming Intel 14A process node, which follows Intel 18A. The early version of the Intel 14A Process Design Kit has been distributed, and several customers intend to create test chips using this node. Intel 14A will introduce PowerDirect direct contact power delivery, progressing from PowerVia technology in Intel 18A. Intel 18A itself has reached risk production with the expectation of entering volume manufacturing later in the year. Key partners within the foundry's electronic design automation ecosystem have made available the enablement, reference flows and intellectual property components required for production designs using Intel 18A. Intel introduced Intel 18A-P, a new variant targeting broader foundry use by enhancing performance. Early wafers relying on Intel 18A-P are reportedly being processed now, and this variant maintains design rule compatibility with Intel 18A. Partner intellectual property and design tool offerings are actively being updated to support Intel 18A-P. Intel also highlighted Intel 18A-PT, which advances performance and power efficiency, and can be integrated using Foveros Direct 3D hybrid bonding with an interconnect pitch below 5 micrometres. The foundry provided further detail on customer engagement with its 16 nanometre production tape-out, with development ongoing for a 12nm node and related products created alongside foundry partner UMC. On the packaging front, Intel Foundry is enabling system-level integration by combining Intel 14A on Intel 18A-PT, with connections achieved through Foveros Direct (3D stacking) and embedded multi-die interconnect bridging. The company introduced EMIB-T technology aimed at high bandwidth memory needs, and expanded the Foveros architecture with two new options: Foveros-R and Foveros-B, to provide additional flexibility and efficiency. Intel's collaboration with Amkor Technology is intended to increase the range of advanced packaging choices available to customers. In manufacturing, Intel announced that its Fab 52 in Arizona has successfully processed its first lot of wafers, considered a milestone for domestic Intel 18A wafer manufacturing. Oregon facilities will lead volume production as the Arizona fab increases output. Intel outlined that research, development and wafer production for Intel 18A and Intel 14A will remain within the United States. The foundry detailed updates to its ecosystem strategy, noting the expansion of the Intel Foundry Accelerator Alliance to include the new Intel Foundry Chiplet Alliance and Value Chain Alliance. According to Intel, the Chiplet Alliance will "initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets." The Accelerator Alliance program also encompasses the IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance, intended to provide a comprehensive suite of intellectual property, design automation and design service solutions through ecosystem partnerships. Intel's announcements were made alongside guidance regarding forward-looking statements. The company outlined risks related to industry competition, research and development investment, technology commercialisation, market demand, global supply chain challenges, and macroeconomic factors. The risk statement further referenced supply chain instability, potential product issues, security considerations and shifts in global trade policy as factors that could influence outcomes compared with those anticipated in strategic planning.
Business Wire
29-04-2025
- Business
- Business Wire
Intel Foundry Gathers Customers and Partners, Outlines Priorities
SAN JOSE, Calif.--(BUSINESS WIRE)--Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company will also announce new ecosystem programs and partnerships, and welcome industry leaders to discuss how a systems foundry approach enables collaboration with partners and unlocks innovation for customers. Intel CEO Lip-Bu Tan will open the event by discussing Intel Foundry's progress and priorities as the company drives the next phase of its foundry strategy. Naga Chandrasekaran, Intel Foundry chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services, will also deliver keynotes during the morning session, sharing process and advanced packaging news while highlighting Intel Foundry's globally diverse manufacturing and supply chain. Tan will be joined on stage by ecosystem partners including Synopsys, Cadence, Siemens EDA and PDF Solutions to highlight collaboration in serving foundry customers. O'Buckley will be joined by executives from MediaTek, Microsoft and Qualcomm. 'Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing,' said Tan. 'Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term.' Event Press Kit: Intel Foundry Direct Connect 2025 Today's announcements encompass core process and advanced packaging technology, a milestone in domestic U.S. manufacturing, and ecosystem support required to earn the trust of foundry customers. They include: Process Technology Intel Foundry has engaged with lead customers on the Intel 14A process technology, the successor to Intel 18A. The company has distributed to lead customers an early version of the Intel 14A Process Design Kit (PDK), and multiple customers have expressed their intent to build test chips on the new process node. Intel 14A will feature PowerDirect direct contact power delivery, building on the PowerVia backside power delivery technology in Intel 18A. Intel 18A is now in risk production and expected to reach volume manufacturing this year. Intel Foundry's ecosystem partners have electronic design automation (EDA) enablement, reference flows and intellectual property (IP) ready for production designs today. The new Intel 18A variant, called Intel 18A-P, is designed to deliver enhanced performance to a broader set of foundry customers. Early wafers based on Intel 18A-P are in the fab now. Because Intel 18A-P will be design rule-compatible with Intel 18A, IP and EDA partners have already started updating their offerings for the variant. Intel 18A-PT is another new variant that builds on Intel 18A-P performance and power efficiency advancements. Intel 18A-PT can be connected to top die using Foveros Direct 3D with hybrid bonding interconnect pitch less than 5 micrometers (µm). Intel Foundry's first production 16 nanometer (nm) tape-out is in the fab now, and the company is engaging with lead customers on a 12nm node and derivatives built in collaboration with UMC. Learn more about Intel Foundry process technology. Advanced Packaging Intel Foundry offers system-level integration using Intel 14A on Intel 18A-PT, connected via Foveros Direct (3D stacking) and embedded multi-die interconnect bridging (2.5D bridging). New advanced packaging technology offerings include EMIB-T to enable future high bandwidth memory needs and two new additions to the Foveros architecture: Foveros-R and Foveros-B provide additional efficient and flexible options for customers. A new engagement with Amkor Technology increases customer flexibility in choosing the right advanced packaging technology for their needs. Learn more about Intel Foundry advanced packaging and test technology. Manufacturing Fab 52 in Arizona has successfully 'run the lot,' marking the first wafer processed through the facility, demonstrating progress in domestic manufacturing of leading-edge Intel 18A wafers. Intel 18A volume production will begin in Intel's Oregon fabs as Arizona manufacturing ramps later this year. Intel 18A and Intel 14A research, development and wafer production will all be U.S.-based. Learn more about Intel Foundry manufacturing capabilities. Ecosystem New programs have been added within Intel Foundry's Accelerator Alliance – Intel Foundry Chiplet Alliance and Value Chain Alliance – along with a range of announcements from top ecosystem partners. Learn more about Intel Foundry ecosystem alliances. Delivering Trusted Ecosystem Tools and IP Intel Foundry is supported by a comprehensive portfolio of IP, EDA and design services solutions delivered by trusted, proven ecosystem partners to drive advancements beyond traditional node scaling. As the newest program in Intel Foundry's Accelerator Alliance, the new Intel Foundry Chiplet Alliance will initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets. The Intel Foundry Accelerator Alliance also includes IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance. Forward-Looking Statements This release contains forward-looking statements that involve a number of risks and uncertainties, including with respect to our business plans and strategy and anticipated benefits therefrom, our fabrication process technology roadmap, our advanced packaging roadmap, our manufacturing facilities, and our ecosystem alliances, tools and IP. Such statements involve many risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including those associated with: the high level of competition and rapid technological change in our industry; the significant long-term and inherently risky investments we are making in R&D and manufacturing facilities that may not realize a favorable return; the complexities and uncertainties in developing and implementing new semiconductor products and manufacturing process technologies; our ability to time and scale our capital investments appropriately and successfully secure favorable alternative financing arrangements and government grants; implementing new business strategies and investing in new businesses and technologies; changes in demand for our products; macroeconomic conditions and geopolitical tensions and conflicts, including geopolitical and trade tensions between the U.S. and China, the impacts of Russia's war on Ukraine, tensions and conflict affecting Israel and the Middle East, and rising tensions between mainland China and Taiwan; the evolving market for products with AI capabilities; our complex global supply chain, including from disruptions, delays, trade tensions and conflicts, or shortages; recently elevated geopolitical tensions, volatility and uncertainty with respect to international trade policies, including tariffs and export controls, impacting our business, the markets in which we compete and the world economy; product defects, errata and other product issues, particularly as we develop next-generation products and implement next-generation manufacturing process technologies; potential security vulnerabilities in our products; increasing and evolving cybersecurity threats and privacy risks; IP risks including related litigation and regulatory proceedings; the need to attract, retain and motivate key talent; strategic transactions and investments; sales-related risks, including customer concentration and the use of distributors and other third parties; our significantly reduced return of capital in recent years; our debt obligations and our ability to access sources of capital; complex and evolving laws and regulations across many jurisdictions; fluctuations in currency exchange rates; changes in our effective tax rate; catastrophic events; environmental, health, safety and product regulations; our initiatives and new legal requirements with respect to corporate responsibility matters; and other risks and uncertainties described in this release, our 2024 Form 10-K, our Q1 2025 Form 10-Q, and our other filings with the SEC. Given these risks and uncertainties, readers are cautioned not to place undue reliance on such forward-looking statements. Readers are urged to carefully review and consider the various disclosures made in this release and in other documents we file from time to time with the SEC that disclose risks and uncertainties that may affect our business. Unless specifically indicated otherwise, the forward-looking statements in this release do not reflect the potential impact of any divestitures, mergers, acquisitions, or other business combinations that have not been completed as of the date of this filing. In addition, the forward-looking statements in this release are based on management's expectations as of the date of this release, unless an earlier date is specified, including expectations based on third-party information and projections that management believes to be reputable. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law. About Intel Foundry Intel Foundry is a full-service systems foundry dedicated to delivering leading-edge silicon process and advanced packaging technology. We provide an unparalleled blend of industry-leading technology with a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. For further information, visit About Intel Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore's Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers' greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel's innovations, go to and © Intel Corporation. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.
Globe and Mail
08-04-2025
- Business
- Globe and Mail
Intel's New CEO Is Talking the Talk and Winning Over Analysts. Should You Buy INTC Stock Now?
Intel (INTC) is among the largest semiconductors companies globally, but it has underperformed the broader markets by a wide margin over the past two decades. Valued at a market cap of $85.4 billion, Intel stock is down nearly 40% over the past 10 years. It also trades over 72% below all-time highs as it has lost market share to peers Nvidia (NVDA) and Advanced Micro Devices (AMD). Given its beaten-down valuation, let's see if you should invest in INTC stock right now. Intel's New CEO Outlines Long-Term Vision During Intel's Vision 2025 conference last week, newly appointed CEO Lip-Bu Tan laid out his vision for rebuilding the chipmaker's engineering-led culture. Tan's presentation acknowledged Intel's significant shortcomings: loss of engineering talent, lack of innovation, and deterioration of customer trust. The CEO repeatedly stressed cultural transformation, proposing a 'day-1 startup culture' focused on innovation. He plans to solicit customer feedback, recruit top engineering talent, and potentially spin off non-core businesses. The event showcased Intel's three-pronged strategy to gain traction in the artificial intelligence segment and strengthen data center capabilities. On the foundry front, executives announced that Intel's advanced 18A manufacturing process has entered the 'risk production' phase. This refers to the process of scaling up production from hundreds to thousands of units. Intel also emphasized its partnerships with customers like Zoox, EdgeRunner AI, and Softec, demonstrating how Intel technology enables autonomous vehicles, military applications, and healthcare solutions. Stifel Maintains a 'Hold' Rating on Intel Stock Analysts at Stifel maintained a 'Hold' rating on Intel with a $21 price target. Notably, analysts from Stifel and Truist Securities expressed encouragement following Tan's address. According to a report from Seeking Alpha, Truist called it 'the most constructive message we've heard from Intel in... as long as we've covered the company,' noting the refreshing focus on culture rather than products or manufacturing nodes. More details on Intel's crucial Foundry strategy are expected at the Intel Foundry Direct Connect event in late April. Out of the 36 analysts covering INTC stock, one recommends 'Strong Buy,' 31 recommend 'Hold,' and four recommend 'Strong Sell.' The average target price for Intel stock is $24.62, indicating an upside potential of over 20% from current levels.
