Latest news with #LPCAMM2
Korea Herald
4 days ago
- Business
- Korea Herald
SK hynix heads to Silicon Valley to recruit AI talent
SK hynix is heading to Silicon Valley this week to host its annual SK Global Forum aimed at recruiting top-tier tech talent for artificial intelligence development, the company said Thursday. The world's leading memory chip-maker is hosting the three-day forum from Friday in Santa Clara, California, bringing together company executives and US-based engineers, researchers and graduate students to discuss the future of memory technology. 'It is time for us to strengthen our capabilities in computing system architecture as we expand our presence in the AI memory ecosystem,' the company said. 'We established a new session for system architecture in our forum to engage with experts in this field.' SK hynix said its CEO Kwak Noh-jung will be leading the forum, delivering the keynote to outline the company's strategy for navigating the rapidly evolving AI landscape. Other top chiefs, including Kim Joo-sun, the president in charge of AI infrastructure; Ahn Hyun, the chief development officer; and Chief Technology Officer Cha Seon-yong will also join the event to meet with invitees and lead discussions on memory innovation and future product roadmaps, the company said. In a first for the forum, the chipmaker has set up a separate area to showcase its core technologies for AI data centers and on-device AI solutions, including high bandwidth memory, enterprise SSD and LPCAMM2 module, for the participants. 'We have been strengthening our technological competitive edge by recruiting excellent talent through the global forum,' said Shin Sang-kyu, head of Corporate Culture at SK hynix. 'We will continue our 'Renaissance journey' to secure talent to lead the AI era.' The annual event has become a key part of the company's global talent strategy since its launch in 2012.
Business Wire
13-05-2025
- Business
- Business Wire
Rambus Delivers Industry-Leading Client Chipsets for Next-Generation AI PC Memory Modules
SAN JOSE, Calif.--(BUSINESS WIRE)-- Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the availability of complete client chipsets for next-generation AI PC memory modules, featuring two new Power Management ICs (PMICs) for client computing. PMICs are critical to efficiently power memory modules providing breakthrough levels of performance for advanced computing applications. The two new Rambus industry-leading PMICs are the PMIC5200, for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120, which supports DDR5 CSODIMMs and CUDIMMs. These PMICs, alongside the Client Clock Driver (CKD) and Serial Presence Detect Hub (SPD Hub), comprise a complete chipset offering to enable memory modules for AI PC notebooks, desktops and workstations. Further, with the addition of these new PMICs, Rambus now offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules for both servers and clients. 'The proliferation of AI-enabled client systems is driving new memory subsystem requirements that demand modules delivering higher bandwidth and optimized power efficiency,' said Rami Sethi, SVP and general manager of Memory Interface Chips at Rambus. 'Having established a leadership position with the introduction of our DDR5 server PMIC family, we're now extending that leadership with two client PMICs that round out a complete DDR5 and LPDDR5 client memory module chipset, which also includes our Client Clock Driver and SPD Hub. Our memory interface chipsets, for LPCAMM2 and DDR5 CUDIMMs and CSODIMMs, enable our customers to address the broad range of form factor, capacity and bandwidth options required by this next wave of exciting AI PC platforms.' 'Micron's first-to-market leadership in LPCAMM2 technology is advancing computing performance in AI PCs while disrupting the industry with unprecedented modularity and flexibility,' said Ross Dermott, vice president of mobile product line management in Micron's Mobile and Client Business Unit. 'Rambus' latest PMIC solutions are a critical component in our next-generation LPCAMM2 modules — allowing us to push the boundaries of memory performance and strengthen our gen-over-gen LPCAMM2 industry leadership.' 'AI PCs powered by Intel processors ushers in a new era of productivity, creativity and entertainment experience. The latest Intel® Core™ Ultra processors family features cutting-edge AI enhancements, increased efficiency and performance improvements,' said Dimitrios Ziakas, VP of Memory & IO Technologies, Intel Corporation. 'From ultra-thin notebooks to the most powerful workstations, Rambus memory interface chips can support the multitude of form factors both businesses and consumers will employ to harness the power of AI.' 'As the rapid evolution of AI reshapes the PC market, the demands on memory bandwidth and capacity will only accelerate,' said Brandon Hoff, executive analyst at IDC. 'High-performance LPDDR5 and DDR5 memory modules, enabled by advanced memory interface chipsets, will be key to unlocking the tremendous possibilities of AI.' As data rates continue to rise to support the needs of AI and other advanced workloads, signal integrity (SI) and power integrity (PI) management become increasingly vital. With 35 years of high-performance memory experience, Rambus is renowned for its SI/PI expertise. This expertise helps enable DDR5 and LPDDR5 memory interface chips to deliver superior signal integrity and power efficiency at higher performance for server and client DIMMs. To deliver the highest levels of performance and reliability, Rambus offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules, including: LPCAMM2 Chipset: PMIC5200, SPD Hub DDR5 CSODIMM and CUDIMM Chipset: Client Clock Driver (CKD), PMIC5120, SPD Hub DDR5 RDIMM 4800 – 8000 Chipsets: Registering Clock Driver (RCD), PMIC, Serial Presence Detect Hub (SPD Hub), Temperature Sensor ICs (TS) DDR5 MRDIMM 12800 Chipset: Multiplexing Registering Clock Driver (MRCD), Multiplexing Data Buffer (MDB), PMIC, SPD Hub, TS Join Us at COMPUTEX: Rambus will be at COMPUTEX 2025 in Taipei sharing the latest information on the LPDDR5 and DDR5 Client DIMM chipsets. Reach out to schedule a meeting with our memory interface chip experts here. More Information: Learn more about the Rambus DDR5 and LPDDR5 Client DIMM Chipsets here. About Rambus Inc. Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With 35 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world's data needs and drive ever-greater end-user experiences. For more information, visit Source: Rambus Inc. Forward-looking statements Information set forth in this press release, including statements as to Rambus' outlook and financial estimates and statements as to the expected timing and effects of Rambus products, constitute forward-looking statements within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These statements are based on various assumptions and the current expectations of the management of Rambus and may not be accurate because of risks and uncertainties surrounding these assumptions and expectations. Factors listed below, as well as other factors, may cause actual results to differ significantly from these forward-looking statements. There is no guarantee that any of the events anticipated by these forward-looking statements will occur, or what effect they will have on the operations or financial condition of Rambus. Forward-looking statements included herein are made as of the date hereof, and Rambus undertakes no obligation to publicly update or revise any forward-looking statement unless required to do so by federal securities laws. Major risks, uncertainties and assumptions include, but are not limited to: any statements regarding anticipated operational and financial results; any statements of expectation or belief; other factors described under 'Risk Factors' in Rambus' Annual Report on Form 10-K and Quarterly Reports on Form 10-Q; and any statements of assumptions underlying any of the foregoing. It is not possible to predict or identify all such factors. Consequently, while the list of factors presented here is considered representative, no such list should be considered to be a complete statement of all potential risks and uncertainties.
Korea Herald
24-04-2025
- Business
- Korea Herald
SK hynix Announces 1Q25 Financial Results
SEOUL, South Korea, April 24, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", announced today that it recorded 17.6391 trillion won in revenues, 7.4405 trillion won in operating profit (with an operating margin of 42%), and 8.1082 trillion won in net profit (with a net margin of 46%) in the first quarter this year. Both revenues and operating profit are the 2nd highest records following last quarter when the company achieved its best quarterly results. Operating margin improved by 1%p compared to the previous quarter to 42%, resulting in 8th consecutive quarterly growth. SK hynix explained that memory market ramped up faster than expected due to competition to develop AI systems and inventory accumulation demand. The company responded to the demand with an expansion in sales of high value-added products such as 12-layer HBM3E and DDR5. The company believes the strong financial results despite a low seasonality reflect its outstanding competitiveness compared to the past. The company plans to focus on enhancing the business fundamentals to achieve distinguished financial outcome, even in times of market correction. Based on the financial result, cash and cash equivalents increased by 0.2 trillion won to 14.3 trillion won at the end of the first quarter, compared to the end of 2024, leading to an improvement in the debt and net debt ratio to 29% and 11%, respectively. SK hynix will continue to strengthen collaboration with supply chain partners to meet customer needs despite demand fluctuation amid global uncertainties. Due to the characteristics of the HBM market that supply volume is mutually agreed a year in advance, the company maintains its earlier projection that HBM demand will approximately double compared to the last year. As a result, sales of 12-layer HBM3E are expected to favorably increase to account for over 50% of total HBM3E revenues in the second quarter. In addition, the company started to supply LPCAMM2 [1], high performance memory module for AI PC, to customers in the first quarter and plans to supply SOCAMM [2], a low-power DRAM module for AI servers, when demand ramps up. For NAND, the company plans to actively respond to demand for high-capacity eSSD, while maintaining profitability-first operation with cautious approach for investment. "In compliance with the 'Capex Discipline', SK hynix will focus on products with demand feasibility and profitability to enhance investment efficiency," said Kim Woohyun, Chief Financial Officer. "As an AI memory leader, we will strengthen collaboration with partners and carry out technological innovation in efforts to continue profit growth with industry-leading competitiveness." 1Q25 Financial Results (K-IFRS) * Financial information of the earnings is based on K-IFRS * Please note that the financial results discussed herein are preliminary and speak only as of April 24, 2025. Readers should not assume that this information remains operative at a later time. About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at
Yahoo
23-04-2025
- Business
- Yahoo
SK hynix Announces 1Q25 Financial Results
Revenues at 17.6391 trillion won, operating profit at 7.4405 trillion won, net profit at 8.1082 trillion won Both revenues, operating profit achieve 2nd highest quarterly records and operating margin improves for 8th consecutive quarters Company will strive to continue profit-centered growth based on AI memory leadership SEOUL, South Korea, April 23, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", announced today that it recorded 17.6391 trillion won in revenues, 7.4405 trillion won in operating profit (with an operating margin of 42%), and 8.1082 trillion won in net profit (with a net margin of 46%) in the first quarter this year. Both revenues and operating profit are the 2nd highest records following last quarter when the company achieved its best quarterly results. Operating margin improved by 1%p compared to the previous quarter to 42%, resulting in 8th consecutive quarterly growth. SK hynix explained that memory market ramped up faster than expected due to competition to develop AI systems and inventory accumulation demand. The company responded to the demand with an expansion in sales of high value-added products such as 12-layer HBM3E and DDR5. The company believes the strong financial results despite a low seasonality reflect its outstanding competitiveness compared to the past. The company plans to focus on enhancing the business fundamentals to achieve distinguished financial outcome, even in times of market correction. Based on the financial result, cash and cash equivalents increased by 0.2 trillion won to 14.3 trillion won at the end of the first quarter, compared to the end of 2024, leading to an improvement in the debt and net debt ratio to 29% and 11%, respectively. SK hynix will continue to strengthen collaboration with supply chain partners to meet customer needs despite demand fluctuation amid global uncertainties. Due to the characteristics of the HBM market that supply volume is mutually agreed a year in advance, the company maintains its earlier projection that HBM demand will approximately double compared to the last year. As a result, sales of 12-layer HBM3E are expected to favorably increase to account for over 50% of total HBM3E revenues in the second quarter. In addition, the company started to supply LPCAMM2[1], high performance memory module for AI PC, to customers in the first quarter and plans to supply SOCAMM[2], a low-power DRAM module for AI servers, when demand ramps up. [1] Low-Power Compression Attached Memory Module (LPCAMM2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM2 [2] Small Outline Compression Attached Memory Module (SOCAMM): A low-power DRAM-based memory module for AI server For NAND, the company plans to actively respond to demand for high-capacity eSSD, while maintaining profitability-first operation with cautious approach for investment. "In compliance with the 'Capex Discipline', SK hynix will focus on products with demand feasibility and profitability to enhance investment efficiency," said Kim Woohyun, Chief Financial Officer. "As an AI memory leader, we will strengthen collaboration with partners and carry out technological innovation in efforts to continue profit growth with industry-leading competitiveness." 1Q25 Financial Results (K-IFRS) *Unit: Billion KRW1Q25 QoQ YoY4Q24 Change 1Q24 Change Revenues 17,639.1 19,767.0 -11 % 12,429.6 42 % Operating Profit 7,440.5 8,082.8 -8 % 2,886.0 158 % Operating Margin 42 % 41 % 1%p 23 % 19%p Net Income 8,108.2 8,006.5 1 % 1,917.0 323 % * Financial information of the earnings is based on K-IFRS* Please note that the financial results discussed herein are preliminary and speak only as of April 24, 2025. Readers should not assume that this information remains operative at a later time. About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at Media ContactSK hynix Public Relations Technical LeaderKanga Kong, Minseok Jang, Sooyeon Lee E-Mail: global_newsroom@ View original content: SOURCE SK hynix Inc. Sign in to access your portfolio
