Latest news with #LPDDR
Korea Herald
23-05-2025
- Business
- Korea Herald
TWSC Debuts at COMPUTEX 2025: Empowering AI with Full-Stack Storage Solutions
TAIPEI, May 23, 2025 TWSC made its debut at COMPUTEX 2025, one of the world's leading technology exhibitions, under the theme "Transcending Intelligence, Ascending Full-Stack Solutions." The company showcased a full range of storage products and solutions designed to support next-generation AI and computing applications. As AI adoption accelerates, storage technology is becoming more scenario-driven. TWSC provides tailored "One Solution for One Scenario" services based on its full-chain capabilities in chips, algorithms, and application scenarios, accurately addressing the diverse needs of smart terminals, industrial control, servers, and other fields. Full-Stack Storage Matrix Unleashes Efficiency TWSC highlighted high-throughput, low-latency solutions at the event, including PCIe 5.0 SSDs, DDR5, eMMC, UFS, and LPDDR series. Combining performance and efficiency, these products enable AI inference and edge computing applications. According to TWSC's 2024 annual report, the company reported revenue of RMB 4.773 billion, a 168.74% increase year-over-year. Embedded storage sales reached RMB 843 million, rising by 1730.6%, while high-speed PCIe SSD sales grew 979%, becoming a major growth driver. The company now offers scenario-based solutions across enterprise, embedded, consumer, and industrial applications, building a strong foundation for global growth through advanced storage modules. Full-Stack Self-Developed Capabilities Build Competitive Edge To enhance control over the industrial chain, TWSC has developed an integrated "wafer-to-product" scenario-based service capability, enabling differentiation through media analysis, chip design, firmware optimization, and packaging control. TWSC uses its "5+1+N" global supply chain network to ensure smooth coordination across R&D, production, and delivery. With a robust validation system and adaptive quality control, the company aligns product quality closely with customer needs. From chips to scenarios, and data to value — TWSC's participation highlights the shift of storage technology from basic functions to intelligent services. By integrating industrial resources and expanding application scenarios, the company is building an open and collaborative innovation ecosystem for smart storage. About TWSC: Shenzhen Techwinsemi Technology Co., Ltd. (Stock Code: was established in 2008 and specializes in integrated circuit solutions for storage controllers and modules. The product line covers four major series: SSD, embedded storage, DDR, and portable storage — offering reliable storage solutions for high-value applications such as smart terminals, data centers.
Yahoo
23-05-2025
- Business
- Yahoo
TWSC Debuts at COMPUTEX 2025: Empowering AI with Full-Stack Storage Solutions
TAIPEI, May 23, 2025 /PRNewswire/ -- From May 20 to 23, 2025, TWSC made its debut at COMPUTEX 2025, one of the world's leading technology exhibitions, under the theme "Transcending Intelligence, Ascending Full-Stack Solutions." The company showcased a full range of storage products and solutions designed to support next-generation AI and computing applications. As AI adoption accelerates, storage technology is becoming more scenario-driven. TWSC provides tailored "One Solution for One Scenario" services based on its full-chain capabilities in chips, algorithms, and application scenarios, accurately addressing the diverse needs of smart terminals, industrial control, servers, and other fields. Full-Stack Storage Matrix Unleashes Efficiency TWSC highlighted high-throughput, low-latency solutions at the event, including PCIe 5.0 SSDs, DDR5, eMMC, UFS, and LPDDR series. Combining performance and efficiency, these products enable AI inference and edge computing applications. According to TWSC's 2024 annual report, the company reported revenue of RMB 4.773 billion, a 168.74% increase year-over-year. Embedded storage sales reached RMB 843 million, rising by 1730.6%, while high-speed PCIe SSD sales grew 979%, becoming a major growth driver. The company now offers scenario-based solutions across enterprise, embedded, consumer, and industrial applications, building a strong foundation for global growth through advanced storage modules. Full-Stack Self-Developed Capabilities Build Competitive Edge To enhance control over the industrial chain, TWSC has developed an integrated "wafer-to-product" scenario-based service capability, enabling differentiation through media analysis, chip design, firmware optimization, and packaging control. TWSC uses its "5+1+N" global supply chain network to ensure smooth coordination across R&D, production, and delivery. With a robust validation system and adaptive quality control, the company aligns product quality closely with customer needs. From chips to scenarios, and data to value — TWSC's participation highlights the shift of storage technology from basic functions to intelligent services. By integrating industrial resources and expanding application scenarios, the company is building an open and collaborative innovation ecosystem for smart storage. About TWSC: Shenzhen Techwinsemi Technology Co., Ltd. (Stock Code: was established in 2008 and specializes in integrated circuit solutions for storage controllers and modules. The product line covers four major series: SSD, embedded storage, DDR, and portable storage — offering reliable storage solutions for high-value applications such as smart terminals, data centers. For more information please visit and follow TWSC on Facebook and Linkedin. View original content to download multimedia: SOURCE TWSC Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
22-05-2025
- Business
- Yahoo
Powering AI with Chiplet Innovation: MSquare's ML100 IO Die Live at COMPUTEX 2025
TAIPEI, May 22, 2025 /PRNewswire/ -- COMPUTEX 2025, Asia's largest and most influential technology event, is currently underway at the Taipei Nangang Exhibition Center, attracting over 50,000 professionals from 34 countries. Making its debut at the show, MSquare Technology is showcasing the ML100 IO Die—the Chiplet solution designed for AI SoC architectures—demonstrating cutting-edge advancements in Chiplet integration and high-speed interconnect solutions. With the theme "AI Next," the event highlights AI & Robotics, Next-Gen Tech, and Future Mobility. As AI models scale exponentially, traditional SoC integration is hitting bandwidth, power, and cost bottlenecks. In response, MSquare introduces a more flexible and energy-efficient Chiplet-based interconnect solution—the ML100 IO Die. The ML100 IO Die is an interconnect Chiplet designed for data centers and high-performance computing, integrating advanced UCIe protocol and HBM3 memory interface technology. By decoupling Soc and HBM through Chiplet partitioning, ML100 optimizes die area, cost, and power consumption while significantly increasing memory bandwidth. It supports 32Gbps UCIe PHY with a peak bandwidth of 1TB/s, significantly outperforming traditional monolithic SoC packaging solutions. It is ideally suited for AI accelerators, inference engines, and high-performance computing chips. In recognition of its innovation, ML100 received the "Best IP of the Year" award from EE Awards Asia 2024. Founded in 2021, MSquare Technology is led by a global team of semiconductor veterans from AMD, Apple, and MediaTek. The company develops high-speed interface IP and Chiplet solutions across diverse protocols—including UCIe, HBM, ONFI, LPDDR, PCIe, and USB—covering process nodes from 5nm to 180nm. Its technologies are deployed across AI, data center, HPC, and advanced consumer applications. MSquare has offices in APAC, US and Australia, forming a global support network to drive faster customer engagement and international deployment. "Chiplet interconnects are the foundation of scalable AI computing," said Rui Tang, Co-founder of MSquare Technology. "By participating in COMPUTEX, we aim to deepen collaboration with ecosystem partners and drive the adoption of next-gen SoC architectures optimized for bandwidth, power, and flexibility." Visit MSquare Technology at COMPUTEX 2025 – Booth N1231, Hall 1, Taipei Nangang Exhibition Center. View original content to download multimedia: SOURCE MSquare Technology Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Korea Herald
22-05-2025
- Business
- Korea Herald
Powering AI with Chiplet Innovation: MSquare's ML100 IO Die Live at COMPUTEX 2025
TAIPEI, May 22, 2025 /PRNewswire/ -- COMPUTEX 2025, Asia's largest and most influential technology event, is currently underway at the Taipei Nangang Exhibition Center, attracting over 50,000 professionals from 34 countries. Making its debut at the show, MSquare Technology is showcasing the ML100 IO Die—the Chiplet solution designed for AI SoC architectures—demonstrating cutting-edge advancements in Chiplet integration and high-speed interconnect solutions. With the theme "AI Next," the event highlights AI & Robotics, Next-Gen Tech, and Future Mobility. As AI models scale exponentially, traditional SoC integration is hitting bandwidth, power, and cost bottlenecks. In response, MSquare introduces a more flexible and energy-efficient Chiplet-based interconnect solution—the ML100 IO Die. The ML100 IO Die is an interconnect Chiplet designed for data centers and high-performance computing, integrating advanced UCIe protocol and HBM3 memory interface technology. By decoupling Soc and HBM through Chiplet partitioning, ML100 optimizes die area, cost, and power consumption while significantly increasing memory bandwidth. It supports 32Gbps UCIe PHY with a peak bandwidth of 1TB/s, significantly outperforming traditional monolithic SoC packaging solutions. It is ideally suited for AI accelerators, inference engines, and high-performance computing chips. In recognition of its innovation, ML100 received the "Best IP of the Year" award from EE Awards Asia 2024. Founded in 2021, MSquare Technology is led by a global team of semiconductor veterans from AMD, Apple, and MediaTek. The company develops high-speed interface IP and Chiplet solutions across diverse protocols—including UCIe, HBM, ONFI, LPDDR, PCIe, and USB—covering process nodes from 5nm to 180nm. Its technologies are deployed across AI, data center, HPC, and advanced consumer applications. MSquare has offices in APAC, US and Australia, forming a global support network to drive faster customer engagement and international deployment. "Chiplet interconnects are the foundation of scalable AI computing," said Rui Tang, Co-founder of MSquare Technology."By participating in COMPUTEX, we aim to deepen collaboration with ecosystem partners and drive the adoption of next-gen SoC architectures optimized for bandwidth, power, and flexibility." Visit MSquare Technology at COMPUTEX 2025 – Booth N1231, Hall 1, Taipei Nangang Exhibition Center.
