Latest news with #MikeHousholder
Yahoo
29-05-2025
- Business
- Yahoo
xMEMS Extends µCooling Fan-on-a-Chip to SSDs — Delivering First In-Drive Active Cooling for AI Data Centers and Laptop PCs
With temperature reduction as much as 30%, µCooling for SSDs is poised to revolutionize thermal management in high-density data centers and consumer computing devices. SANTA CLARA, Calif., May 29, 2025--(BUSINESS WIRE)--xMEMS Labs, Inc., inventor of the world's first monolithic silicon MEMS air pump, today announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs), enabling the first-ever in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs. Traditionally, SSD thermal management has relied on passive heat spreaders and ambient airflow from system fans, which often fall short in managing the intense, sustained workloads common in AI, HPC, and modern computing environments. As SSD speeds push well beyond 7 GB/s, thermal throttling remains a performance barrier. xMEMS µCooling addresses this by delivering hyper-localized active cooling directly to NAND flash and controller ICs from within the SSD itself. "SSDs are the data highways of modern computing — but when they overheat, everything slows down," said Mike Housholder, VP of Marketing at xMEMS Labs. "µCooling is the only active solution small enough to live inside the SSD, delivering thermal relief exactly where it's needed to prevent throttling and maintain peak data rates." In AI data centers, SSDs in E3.S form factors routinely operate at 9.5W TDP or higher, generating thermal hotspots in compact, dense racks. Thermal modeling with µCooling integrated has shown: 3W of heat removal capability; >18% average temperature reduction; and >25% lower thermal resistance. This allows drives to sustain high-speed I/O without performance degradation, extending device reliability and improving throughput in critical AI/ML workloads. In consumer laptop PCs, NVMe M.2 SSDs often reach thermal limits during large file transfers, sustained writes, or gaming workloads – especially in fanless ultrathin devices. Thermal modeling with µCooling integration has shown: Average 30-50% power overhead allowance; >20% temperature reduction; 30% lower thermal resistance; and 30% lower ∆T (temperature rise above ambient). These improvements translate to fewer thermal slowdowns and higher sustained performance in even the most compact devices. According to research firm IDC, the market for SSDs is expected to grow 21.9% CAGR through 2028, driven by increased demand for data centers, edge solutions, AI infrastructure, and consumer devices. "With µCooling, SSD designers can finally implement true active thermal management without enlarging the drive or depending on system airflow," added Housholder. "It's a breakthrough for both hyperscale servers and ultraportable PCs." xMEMS µCooling's solid-state, piezoMEMS design includes no motors or moving bearings, therefore no mechanical wear, enabling maintenance-free reliability and high-volume manufacturability. Its compact footprint, as small as 9.3 x 7.6 x 1.13mm, and scalable architecture make it ideal for use in a wide range of electronic systems. µCooling samples are available now, with volume production beginning Q1 2026. For more information about xMEMS and our µCooling heat dissipation solution, visit For hi-res imagery, click here. About xMEMS Labs, Inc. Founded in January 2018, xMEMS Labs is the "X" factor in MEMS with the world's most innovative piezoMEMS platform. It invented the world's first solid-state, monolithic MEMS speakers that combine the scalability of semiconductor manufacturing with revolutionary audio performance, enabling new audio experiences in wireless earbuds, wearables, hearing health, and smart glasses. The xMEMS piezoMEMS platform has also been extended to produce the world's first μCooling fan on a chip delivering active thermal management in smartphones, SSDs, smart glasses, and data center systems like optical transceivers. xMEMS has over 245 granted patents worldwide for its technology. For more information, visit View source version on Contacts Media Contact:Marta MajstorovicGriffin360marta@
Business Wire
29-05-2025
- Business Wire
xMEMS Extends µCooling Fan-on-a-Chip to SSDs — Delivering First In-Drive Active Cooling for AI Data Centers and Laptop PCs
SANTA CLARA, Calif.--(BUSINESS WIRE)--xMEMS Labs, Inc., inventor of the world's first monolithic silicon MEMS air pump, today announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs), enabling the first-ever in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs. Traditionally, SSD thermal management has relied on passive heat spreaders and ambient airflow from system fans, which often fall short in managing the intense, sustained workloads common in AI, HPC, and modern computing environments. As SSD speeds push well beyond 7 GB/s, thermal throttling remains a performance barrier. xMEMS µCooling addresses this by delivering hyper-localized active cooling directly to NAND flash and controller ICs from within the SSD itself. 'SSDs are the data highways of modern computing — but when they overheat, everything slows down,' said Mike Housholder, VP of Marketing at xMEMS Labs. 'µCooling is the only active solution small enough to live inside the SSD, delivering thermal relief exactly where it's needed to prevent throttling and maintain peak data rates.' In AI data centers, SSDs in E3.S form factors routinely operate at 9.5W TDP or higher, generating thermal hotspots in compact, dense racks. Thermal modeling with µCooling integrated has shown: 3W of heat removal capability; >18% average temperature reduction; and >25% lower thermal resistance. This allows drives to sustain high-speed I/O without performance degradation, extending device reliability and improving throughput in critical AI/ML workloads. In consumer laptop PCs, NVMe M.2 SSDs often reach thermal limits during large file transfers, sustained writes, or gaming workloads – especially in fanless ultrathin devices. Thermal modeling with µCooling integration has shown: Average 30-50% power overhead allowance; >20% temperature reduction; 30% lower thermal resistance; and 30% lower ∆T (temperature rise above ambient). These improvements translate to fewer thermal slowdowns and higher sustained performance in even the most compact devices. According to research firm IDC, the market for SSDs is expected to grow 21.9% CAGR through 2028, driven by increased demand for data centers, edge solutions, AI infrastructure, and consumer devices. 'With µCooling, SSD designers can finally implement true active thermal management without enlarging the drive or depending on system airflow,' added Housholder. 'It's a breakthrough for both hyperscale servers and ultraportable PCs.' xMEMS µCooling's solid-state, piezoMEMS design includes no motors or moving bearings, therefore no mechanical wear, enabling maintenance-free reliability and high-volume manufacturability. Its compact footprint, as small as 9.3 x 7.6 x 1.13mm, and scalable architecture make it ideal for use in a wide range of electronic systems. µCooling samples are available now, with volume production beginning Q1 2026. For more information about xMEMS and our µCooling heat dissipation solution, visit For hi-res imagery, click here. About xMEMS Labs, Inc. Founded in January 2018, xMEMS Labs is the 'X' factor in MEMS with the world's most innovative piezoMEMS platform. It invented the world's first solid-state, monolithic MEMS speakers that combine the scalability of semiconductor manufacturing with revolutionary audio performance, enabling new audio experiences in wireless earbuds, wearables, hearing health, and smart glasses. The xMEMS piezoMEMS platform has also been extended to produce the world's first μCooling fan on a chip delivering active thermal management in smartphones, SSDs, smart glasses, and data center systems like optical transceivers. xMEMS has over 245 granted patents worldwide for its technology. For more information, visit
Business Wire
13-05-2025
- Business
- Business Wire
xMEMS Unveils Sycamore-W – The World's Thinnest Speaker Engineered for Smart Watches and Fitness Bands
SANTA CLARA, Calif.--(BUSINESS WIRE)--xMEMS Labs, the leader in piezoMEMS audio innovation and creators of the world's first all-silicon micro speakers, today announced Sycamore-W, a new addition to the company's Sycamore near-field MEMS speaker family, engineered for smart watches, fitness bands, and other wrist-worn wearables. Following the successful debut of the original Sycamore µSpeaker in late 2024, Sycamore-W extends xMEMS' commitment to µFidelity™ audio in space-constrained mobile form factors. Measuring just 1 millimeter thin in a 20 x 4mm form factor, Sycamore-W reduces speaker package volume by 70%, enabling dramatically slimmer, sleeker form factors while delivering high-quality, full-range sound. 'Sycamore-W redefines audio for smart watches, combining compact design with robust performance to meet the demands of next-generation wearables,' said Mike Housholder, xMEMS VP of Marketing and Business Development. 'As the wrist becomes a key interface for ears-free, hands-free AI interactions, Sycamore-W empowers manufacturers to deliver premium audio in smaller, lighter, more durable devices.' Optimized for Wrist-Worn Devices Sycamore-W is engineered specifically for the unique demands of wrist-based wearables. Its 4mm wide x 1mm thin profile minimizes incursion into the watch cavity, enabling designers with the space to integrate more biometric sensors and larger batteries. Compared to legacy coil speakers that are typically 3 to 4mm thick and weigh up to 3 grams, Sycamore-W's 150mg weight dramatically reduces strain and enhances comfort, both of which are key considerations for wearable devices. Silicon Durability and Rugged Design This new solution maintains the same solid-state durability xMEMS speakers are known for, with component-level IP58-rated protection and robust 10,000 g mechanical shock resistance. These qualities make it ideal for active lifestyle wearables and outdoor-oriented smartwatches and fitness bands. Sycamore-W measures 20 x 4 x 1.28mm. Samples are available now to early access customers, with volume production slated for Q2 2026. The original Sycamore µSpeaker will continue to serve broader applications, including smart glasses, open-fit earbuds, and laptops, while additional Sycamore family variants tailored to other specific applications will be announced later this year. For more information about Sycamore and xMEMS visit and for hi-res imagery click here. About xMEMS Labs, Inc. Founded in January 2018, xMEMS Labs is the 'X' factor in MEMS with the world's most innovative piezoMEMS platform. It invented the world's first solid-state, True MEMS µFidelity speakers for TWS, near-field OWS, and other personal audio devices, and evolved its substantial IP to produce the world's first μCooling fan on a chip for smartphones and other thin, performance-oriented devices. xMEMS has over 245 granted patents worldwide for its technology. For more information, visit
Engadget
13-05-2025
- Business
- Engadget
xMEMS launches a tiny speaker for smartwatches
xMEMS has launched the Sycamore-W, which it claims is the "world's thinnest speaker designed specifically for wrist-worn wearables." The Sycamore-W is only 1 mm thin and weighs only 150 mg, making it approximately 70 percent smaller than the speakers typically used for smart watches. xMEMS took the micro-electromechanical systems (MEMS) technology used in cell phones' microphones and developed drivers based on it for use in earphones instead. Last year, it launched the Sycamore speakers, based on the same platform as its original product, for open-fit earbuds, smart glasses and smart watches. While the original Sycamore could already be used in smartwatches, the Sycamore-W was engineered specifically for wrist-based wearables. Since it's very thin, companies can fit larger batteries or more biometric sensors into their products. The speakers are also water, dust and shock-resistant. "Sycamore-W redefines audio for smart watches, combining compact design with robust performance to meet the demands of next-generation wearables," said Mike Housholder, xMEMS VP of Marketing and Business Development. "As the wrist becomes a key interface for ears-free, hands-free AI interactions, Sycamore-W empowers manufacturers to deliver premium audio in smaller, lighter, more durable devices." The company is planning to start volume production for the Sycamore-W in the second quarter of 2026, so we won't be seeing products that use the component until sometime next year. xMEMS will continue producing the original Sycamore speakers for smart glasses, open-fit earbuds and laptops, but it will announce more models for more specific applications in the coming months.
