Latest news with #NAND
Yahoo
2 days ago
- Business
- Yahoo
Benchmark Gives Buy Rating on Sandisk (SNDK) Stock
On May 27, Benchmark initiated coverage of Sandisk Corporation (NASDAQ:SNDK)'s stock with a 'Buy' rating and a price target of $58, as reported by The Fly. As per the firm, Sandisk Corporation (NASDAQ:SNDK) happens to be a highly cyclical business, and a cyclical upturn has started. The firm believes that this upturn is likely to be extended into 2026. Notably, major hyperscale cloud capex is projected to increase 40% YoY in 2025 to reach $330 billion. Furthermore, AI opportunities and a Windows end-of-life replacement cycle continue to fuel higher PC and mobile-related flash sales. The analyst expects non-GAAP earnings to grow to $5.28 per diluted share in FY 2026. Sandisk Corporation (NASDAQ:SNDK) took actions to reduce supply to match demand and has begun price increases in Q3 2025. The company expects Q4 2025 revenue of between $1.75 billion - $1.85 billion. Sandisk Corporation (NASDAQ:SNDK) estimates that the NAND industry is well-placed for strong long-term growth. This growth is expected to stem from the exponential expansion of data, fueled mainly due to the deployment of AI in cloud and edge applications. Sandisk Corporation (NASDAQ:SNDK) is engaged in developing, manufacturing, and selling data storage devices and solutions using NAND flash technology. While we acknowledge the potential of SNDK to grow, our conviction lies in the belief that some AI stocks hold greater promise for delivering higher returns and have limited downside risk. If you are looking for an AI stock that is more promising than SNDK and that has 100x upside potential, check out our report about this cheapest AI stock. READ NEXT: 13 Cheap AI Stocks to Buy According to Analysts and 11 Unstoppable Growth Stocks to Invest in Now Disclosure: None. Sign in to access your portfolio
Yahoo
3 days ago
- Business
- Yahoo
xMEMS Extends µCooling Fan-on-a-Chip to SSDs — Delivering First In-Drive Active Cooling for AI Data Centers and Laptop PCs
With temperature reduction as much as 30%, µCooling for SSDs is poised to revolutionize thermal management in high-density data centers and consumer computing devices. SANTA CLARA, Calif., May 29, 2025--(BUSINESS WIRE)--xMEMS Labs, Inc., inventor of the world's first monolithic silicon MEMS air pump, today announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs), enabling the first-ever in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs. Traditionally, SSD thermal management has relied on passive heat spreaders and ambient airflow from system fans, which often fall short in managing the intense, sustained workloads common in AI, HPC, and modern computing environments. As SSD speeds push well beyond 7 GB/s, thermal throttling remains a performance barrier. xMEMS µCooling addresses this by delivering hyper-localized active cooling directly to NAND flash and controller ICs from within the SSD itself. "SSDs are the data highways of modern computing — but when they overheat, everything slows down," said Mike Housholder, VP of Marketing at xMEMS Labs. "µCooling is the only active solution small enough to live inside the SSD, delivering thermal relief exactly where it's needed to prevent throttling and maintain peak data rates." In AI data centers, SSDs in E3.S form factors routinely operate at 9.5W TDP or higher, generating thermal hotspots in compact, dense racks. Thermal modeling with µCooling integrated has shown: 3W of heat removal capability; >18% average temperature reduction; and >25% lower thermal resistance. This allows drives to sustain high-speed I/O without performance degradation, extending device reliability and improving throughput in critical AI/ML workloads. In consumer laptop PCs, NVMe M.2 SSDs often reach thermal limits during large file transfers, sustained writes, or gaming workloads – especially in fanless ultrathin devices. Thermal modeling with µCooling integration has shown: Average 30-50% power overhead allowance; >20% temperature reduction; 30% lower thermal resistance; and 30% lower ∆T (temperature rise above ambient). These improvements translate to fewer thermal slowdowns and higher sustained performance in even the most compact devices. According to research firm IDC, the market for SSDs is expected to grow 21.9% CAGR through 2028, driven by increased demand for data centers, edge solutions, AI infrastructure, and consumer devices. "With µCooling, SSD designers can finally implement true active thermal management without enlarging the drive or depending on system airflow," added Housholder. "It's a breakthrough for both hyperscale servers and ultraportable PCs." xMEMS µCooling's solid-state, piezoMEMS design includes no motors or moving bearings, therefore no mechanical wear, enabling maintenance-free reliability and high-volume manufacturability. Its compact footprint, as small as 9.3 x 7.6 x 1.13mm, and scalable architecture make it ideal for use in a wide range of electronic systems. µCooling samples are available now, with volume production beginning Q1 2026. For more information about xMEMS and our µCooling heat dissipation solution, visit For hi-res imagery, click here. About xMEMS Labs, Inc. Founded in January 2018, xMEMS Labs is the "X" factor in MEMS with the world's most innovative piezoMEMS platform. It invented the world's first solid-state, monolithic MEMS speakers that combine the scalability of semiconductor manufacturing with revolutionary audio performance, enabling new audio experiences in wireless earbuds, wearables, hearing health, and smart glasses. The xMEMS piezoMEMS platform has also been extended to produce the world's first μCooling fan on a chip delivering active thermal management in smartphones, SSDs, smart glasses, and data center systems like optical transceivers. xMEMS has over 245 granted patents worldwide for its technology. For more information, visit View source version on Contacts Media Contact:Marta MajstorovicGriffin360marta@
Business Wire
3 days ago
- Business Wire
xMEMS Extends µCooling Fan-on-a-Chip to SSDs — Delivering First In-Drive Active Cooling for AI Data Centers and Laptop PCs
SANTA CLARA, Calif.--(BUSINESS WIRE)--xMEMS Labs, Inc., inventor of the world's first monolithic silicon MEMS air pump, today announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs), enabling the first-ever in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs. Traditionally, SSD thermal management has relied on passive heat spreaders and ambient airflow from system fans, which often fall short in managing the intense, sustained workloads common in AI, HPC, and modern computing environments. As SSD speeds push well beyond 7 GB/s, thermal throttling remains a performance barrier. xMEMS µCooling addresses this by delivering hyper-localized active cooling directly to NAND flash and controller ICs from within the SSD itself. 'SSDs are the data highways of modern computing — but when they overheat, everything slows down,' said Mike Housholder, VP of Marketing at xMEMS Labs. 'µCooling is the only active solution small enough to live inside the SSD, delivering thermal relief exactly where it's needed to prevent throttling and maintain peak data rates.' In AI data centers, SSDs in E3.S form factors routinely operate at 9.5W TDP or higher, generating thermal hotspots in compact, dense racks. Thermal modeling with µCooling integrated has shown: 3W of heat removal capability; >18% average temperature reduction; and >25% lower thermal resistance. This allows drives to sustain high-speed I/O without performance degradation, extending device reliability and improving throughput in critical AI/ML workloads. In consumer laptop PCs, NVMe M.2 SSDs often reach thermal limits during large file transfers, sustained writes, or gaming workloads – especially in fanless ultrathin devices. Thermal modeling with µCooling integration has shown: Average 30-50% power overhead allowance; >20% temperature reduction; 30% lower thermal resistance; and 30% lower ∆T (temperature rise above ambient). These improvements translate to fewer thermal slowdowns and higher sustained performance in even the most compact devices. According to research firm IDC, the market for SSDs is expected to grow 21.9% CAGR through 2028, driven by increased demand for data centers, edge solutions, AI infrastructure, and consumer devices. 'With µCooling, SSD designers can finally implement true active thermal management without enlarging the drive or depending on system airflow,' added Housholder. 'It's a breakthrough for both hyperscale servers and ultraportable PCs.' xMEMS µCooling's solid-state, piezoMEMS design includes no motors or moving bearings, therefore no mechanical wear, enabling maintenance-free reliability and high-volume manufacturability. Its compact footprint, as small as 9.3 x 7.6 x 1.13mm, and scalable architecture make it ideal for use in a wide range of electronic systems. µCooling samples are available now, with volume production beginning Q1 2026. For more information about xMEMS and our µCooling heat dissipation solution, visit For hi-res imagery, click here. About xMEMS Labs, Inc. Founded in January 2018, xMEMS Labs is the 'X' factor in MEMS with the world's most innovative piezoMEMS platform. It invented the world's first solid-state, monolithic MEMS speakers that combine the scalability of semiconductor manufacturing with revolutionary audio performance, enabling new audio experiences in wireless earbuds, wearables, hearing health, and smart glasses. The xMEMS piezoMEMS platform has also been extended to produce the world's first μCooling fan on a chip delivering active thermal management in smartphones, SSDs, smart glasses, and data center systems like optical transceivers. xMEMS has over 245 granted patents worldwide for its technology. For more information, visit
Yahoo
4 days ago
- Business
- Yahoo
Benchmark Gives Buy Rating on Sandisk (SNDK) Stock
On May 27, Benchmark initiated coverage of Sandisk Corporation (NASDAQ:SNDK)'s stock with a 'Buy' rating and a price target of $58, as reported by The Fly. As per the firm, Sandisk Corporation (NASDAQ:SNDK) happens to be a highly cyclical business, and a cyclical upturn has started. The firm believes that this upturn is likely to be extended into 2026. Notably, major hyperscale cloud capex is projected to increase 40% YoY in 2025 to reach $330 billion. Furthermore, AI opportunities and a Windows end-of-life replacement cycle continue to fuel higher PC and mobile-related flash sales. The analyst expects non-GAAP earnings to grow to $5.28 per diluted share in FY 2026. Sandisk Corporation (NASDAQ:SNDK) took actions to reduce supply to match demand and has begun price increases in Q3 2025. The company expects Q4 2025 revenue of between $1.75 billion - $1.85 billion. Sandisk Corporation (NASDAQ:SNDK) estimates that the NAND industry is well-placed for strong long-term growth. This growth is expected to stem from the exponential expansion of data, fueled mainly due to the deployment of AI in cloud and edge applications. Sandisk Corporation (NASDAQ:SNDK) is engaged in developing, manufacturing, and selling data storage devices and solutions using NAND flash technology. While we acknowledge the potential of SNDK to grow, our conviction lies in the belief that some AI stocks hold greater promise for delivering higher returns and have limited downside risk. If you are looking for an AI stock that is more promising than SNDK and that has 100x upside potential, check out our report about this cheapest AI stock. READ NEXT: 13 Cheap AI Stocks to Buy According to Analysts and 11 Unstoppable Growth Stocks to Invest in Now Disclosure: None.
Techday NZ
4 days ago
- Business
- Techday NZ
Pure Storage & SK hynix partner on energy-efficient QLC flash
Pure Storage has announced a collaboration with SK hynix to deliver QLC flash storage products designed for hyperscale data centres. The collaboration seeks to address the increasing demands placed on data centres by workloads that require both high storage density and greater energy efficiency. Many hyperscale data centres face challenges with existing storage technology, particularly hard disk drives (HDDs), which have shown limitations in handling high-capacity, data-intensive workloads typical in the current AI-driven landscape. According to Pure Storage, future DirectFlash Module products will incorporate SK hynix's QLC NAND flash memory and are intended to support environments where both performance and capacity are critical. The integration is designed to offer sustained high performance, lower latency, energy savings, and high reliability for exascale workloads. The companies highlight several key benefits of this partnership, including the ability to deliver lower energy consumption, which could assist customers in managing power constraints and reducing operating costs. This is expected to translate into a reduced overall carbon footprint for organisations running large data operations. The joint solution also emphasises scalability and a competitive total cost of ownership (TCO). By providing highly rack-dense systems, the QLC flash storage aims to improve storage scalability and efficiency, offering advantages over traditional HDD setups in large-scale deployments. Bill Cerreta, GM, Hyperscale, Pure Storage, commented on the new collaboration: "This collaboration with SK hynix is an exciting step in our mission to deliver superior all-flash storage technology to hyperscalers. By combining SK hynix's advanced QLC products with Pure Storage's host-based flash management architecture, we can deliver an optimized solution for the hyperscale production environment and AI infrastructure. Pure Storage can further elevate performance, scalability, reliability, and energy efficiency, addressing the unique demands facing today's data-centric industries." Sam Lee, EVP, Head of Global Sales and Marketing, SK hynix, said: "Hyperscalers are constantly searching for data storage technology that doesn't limit their potential innovation, but propels it to unforeseen levels. SK hynix's NAND technology, combined with Pure Storage's robust platform, presents a formidable option for data center operators focused on maximizing performance, efficiency, and scalability. Together, we are empowering hyperscale environments to tackle burgeoning data volumes with cutting-edge, sustainable storage solutions." Data bottlenecks and energy costs are ongoing concerns for data centre operators, particularly as AI-driven workloads grow. Both partner companies are aiming to help customers confront these issues by offering a platform that unites advances in flash memory and storage management. The companies point out that wide adoption of QLC flash could ultimately move large-scale environments beyond traditional disk-based storage, by providing mechanisms to support evolving data centre needs with greater energy efficiency and improved scalability.
