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Soitec and PSMC collaborate on ultra-thin TLT technology for nm-scale 3D stacking
Soitec and PSMC collaborate on ultra-thin TLT technology for nm-scale 3D stacking

Yahoo

time3 days ago

  • Business
  • Yahoo

Soitec and PSMC collaborate on ultra-thin TLT technology for nm-scale 3D stacking

Soitec and PSMC collaborate on ultra-thin TLT technology for nm-scale 3D stacking Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC). Under the collaboration, Soitec will supply PSMC 300mm substrates incorporating a release layer, Transistor Layer Transfer (TLT) ready, to support a new demonstration of advanced 3D chip stacking at the wafer level. This marks the first public announcement of Soitec's TLT technology. The technology is an enabler for next-generation semiconductor designs that allow for more powerful, compact and energy-efficient chips – with potential applications ranging from smartphones, tablets and AI devices to autonomous driving systems. Soitec's Chief Technology Officer and Senior EVP Innovation, Christophe Maleville said: 'At Soitec we are proud to pioneer semiconductor materials that unlock new possibilities in chip design and performance. Our collaboration with PSMC reflects a shared commitment to pushing the boundaries of 3D integration and supporting the global shift toward more efficient and compact computing architectures. Together we are laying the groundwork for the next generation of semiconductor innovation.' PSMC Chief Technology Officer SZ Chang said: 'With our longstanding presence in memory and logic foundry, PSMC consistently drives advancements in 3D stacking. In the two-year collaboration, PSMC has demonstrated an innovative wafer-stack integrated process by leveraging Soitec's advanced substrate technology. The innovation significantly broadens the 3D technology from chip-level stacking - optimizing power performance in computing architecture, to transistor-level stacking – extending Moore's law, with a remarkable reduction in stacking wafer thickness from micrometer to nanometer level. This achievement, by pushing the boundaries of 3D stacking, reaffirms our position at the forefront of the semiconductor industry.' To meet growing industry demand for faster and more energy-efficient chips, Soitec has developed a new substrate stack enabling high-speed transfer of ultra-thin transistor layers onto different types of wafers—a key requirement in heterogeneous integration, where diverse chip components are combined in a single package. The stacking process enables multiple transistor layers to be built vertically to support 3D transistor architectures including vertical field-effect transistors (FETs) with backside power delivery networks (PDNs). This TLT substrate leverages Smart Cut™ technology together with infrared (IR) laser release processing. The proprietary Soitec technology enables the formation of an ultra-thin semiconductor layer, ranging from 5nm to 1µm in thickness, on top of the TLT substrate. Once devices are fabricated on the TLT wafer, the IR laser process facilitates the lift-off of the ultra-thin layer from the substrate to the target wafer, without introducing thermal stress or damaging the devices. The Soitec-PSMC collaboration builds on existing France-Taiwan cooperation initiatives in AI and other semiconductor-related domains. ***** About Soitec Soitec (Euronext - Tech Leaders), a world leader in innovative semiconductor materials, has been developing cutting-edge products delivering both technological performance and energy efficiency for over 30 years. From its global headquarters in France, Soitec is expanding internationally with its unique solutions, and generated sales of 0.9 billion Euros in fiscal year 2024-2025. Soitec occupies a key position in the semiconductor value chain, serving three main strategic markets: Mobile Communications, Automotive and Industrial, and Edge and Cloud AI. The company relies on the talent and diversity of its 2,300 employees, representing 50 different nationalities, working at its sites in Europe, the United States and Asia. Soitec has registered over 4,000 patents. Soitec, SmartSiC™ and Smart Cut™ are registered trademarks of Soitec. For more information: and follow us on LinkedIn and X: @Soitec_Official Media Relations: media@ Investor Relations: investors@ ***** About Powerchip Semiconductor Manufacturing Corporation (PSMC) Powerchip Semiconductor Manufacturing Corporation (PSMC) is the world's seventh-largest pure-play foundry, with four 12-inch and two 8-inch fabs in Taiwan, capable of producing over 2.1 million 12-inch equivalent wafers annually. Since its establishment in 1994, the company transitioned successfully from DRAM manufacturing to advanced foundry services for memory and logic chips. Ranked seventh in global semiconductor ESG evaluations, PSMC demonstrates strong governance and environmental commitment. In May 2024, PSMC's new 12-inch fab in Taiwan's Tongluo Science Park began operations with a planned capacity of 1.2 million wafers annually, using advanced 28nm and wafer stacking technologies. For more information, visit Attachment 20250603_PR Soitec-PSMC TLT CollaborationError in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data

India's moment: Navigating a world torn by U.S.-China rivalry
India's moment: Navigating a world torn by U.S.-China rivalry

Yahoo

time30-04-2025

  • Business
  • Yahoo

India's moment: Navigating a world torn by U.S.-China rivalry

If you've been watching the headlines, you've seen the trade war between the U.S. and China ramp up again: tariffs flying, supply chains splintering, and tech giants caught in the crossfire. It feels like déjà vu all over again, but something important has shifted this time. India, often the quiet bystander in global power struggles, suddenly finds itself thrust center stage with an opportunity that is historic and unprecedented. Vice President JD Vance's recent four-day visit to India underscores that India's power isn't just about assembly lines or call centers anymore. India today stands ready to rewrite its legacy—from an outsourcing outpost to global innovation hub. Apple's rapid pivot to India illustrates this dramatically: Just two years ago, less than 5% of the world's iPhones were made here. Today, it's nearly 14%, with plans to double again soon and a pledge to shift all U.S.-bound iPhone production to India by the end of next year. The semiconductor landscape echoes this trend, with major moves such as Taiwan's PSMC partnering with Tata Electronics to build an $11 billion semiconductor fab in India. In a matter of months, global technology manufacturing has undergone a seismic shift that usually unfolds over years, if not decades, all catalyzed by heightened U.S.-China tensions. Yet hardware is only half the story. The real excitement is India's burgeoning AI and software scene, with India's SaaS startups rapidly carving their niche globally—without any of the political blowback that comes from fast-growing Chinese platforms like DeepSeek and TikTok. Big Tech has noticed, too. Giants like Nvidia, Microsoft, and Meta are significantly ramping up their investments in India to tackle massive, real-world challenges—health care, agriculture, financial inclusion—using AI solutions designed for India's billion-plus population. They're partnering closely with homegrown AI stars like Sarvam, which the Indian government has just selected to build India's sovereign LLM. India is uniquely positioned to lead the charge in AI development beyond American borders. Indians are among the highest-adoption AI users, with access to some of the largest bastions of training data ever created—from a century of Bollywood to years of call-center customer interaction data across voice and emails. A new generation of AI-first innovators will deliver critical propulsion to drive down the cost of access and democratize the value of AI globally. It's simply not possible to profitably train models on American economics for nations where income is just a fraction of Western GDP per capita. While DeepSeek has captured the imagination, we will start to see several new flavors of AI tailored to sovereign needs at realistic cost, with Sarvam in India at the vanguard. The financial community is recognizing this shift. Gross FDI inflows rose to $55.6 billion during April-November FY25, marking a 17.9% increase from $47.2 billion recorded in the same period of FY24. But India's greatest strength might just be its diplomatic agility. Credit goes to External Affairs Minister S. Jaishankar, whose masterful balancing act with the U.S., China, and Russia underscores India's unique geopolitical standing. His approach has allowed India to navigate complex diplomatic channels, transforming geopolitical tensions into tangible economic gains. Yet, here in India, recognizing opportunity isn't enough—we must actively seize it. India's technology sector needs strategic direction now more than ever. First, we must embrace U.S.-style go-to-market muscle: Scaling globally demands not just great technology, but outstanding sales and marketing acumen. Second, we must double down on research-based engineering to build genuine, long-term innovation at scale, rather than settling for quick hacks or short-term solutions. Finally, we must foster a culture of bold, transformative thinking, encouraging our entrepreneurs and innovators to break new ground without being overshadowed by Silicon Valley's tech dominance. Along the way, we'll have to deftly navigate the geopolitics of two mega-powers. It's a high-wire act, but India is uniquely suited to pull it off—bridging divides while preserving our strategic autonomy. We've talked about India's potential for decades. This moment, catalyzed by circumstances beyond our control, is India's clarion call. Our destiny is within reach. It's time we answer—not with hesitation, but with the confidence and ambition this historic moment demands. The opinions expressed in commentary pieces are solely the views of their authors and do not necessarily reflect the opinions and beliefs of Fortune. This story was originally featured on

India has strong potential to replicate its manufacturing success and become a semiconductor hub: Jefferies
India has strong potential to replicate its manufacturing success and become a semiconductor hub: Jefferies

Zawya

time17-03-2025

  • Business
  • Zawya

India has strong potential to replicate its manufacturing success and become a semiconductor hub: Jefferies

New Delhi: Favourable government policies, growing demand, low-cost production capabilities, and strategic linkages with the Western nations have led India to develop itself as a semiconductor hub, according to a recent report by Jefferies. As per the report, fiscal incentives from the government, low manufacturing costs, a talented design workforce, and rising demand are advantageous factors, helping the sector. "We believe India has strong potential to replicate its manufacturing success in autos to semis, led by policy support, rising demand, low cost and strategic goodwill with the West" said the report The report added that the countries aspirations to become a major player in the semiconductor manufacturing is gaining significant momentum, with over USD 18 billion in investments already underway. These investments are spread across five key projects, including Tata Electronics' USD 11 billion chip fab with Taiwan's PSMC, set to begin operations in 2026. As per the Jefferies interaction with the government, it added that the Indian government aims to quadruple electronics production to USD 500 billion by 2030. The report adds that the Indian electronics sector is already witnessing rapid growth, driven by increasing incomes, digital adoption, and a rising demand for electronic products. In Financial Year (FY) 2024, India's electronics imports reached USD 60 billion, making up 25 per cent of the country's trade deficit, second only to oil. This has prompted the Indian government to take a bold stance on domestic electronics manufacturing, focusing on boosting production and reducing the import dependency. The government's significant policy push includes a USD 10 billion incentive program launched in 2021, aimed at covering around 50 per cent of the project costs for chip and display fabs, as well as testing facilities. Certain states are offering additional incentives of up to 20 per cent, bringing the total fiscal support for these projects to an impressive 70 per cent. The results are already visible: five semiconductor-related projects, involving a total investment of USD 18 billion, are under construction. These projects are expected to create around 80,000 direct and indirect jobs, contributing to the growth of India's semiconductor ecosystem, the report added. The report adds that India's efforts are focused on expanding the entire semiconductor supply chain, from chemicals and gases to components and equipment. During an interaction with the credit rating agency, the Minister of Railways and Electronics and IT, Ashwini Vaishnaw, highlighted the government's strong focus on building this complete ecosystem, leveraging India's design capabilities and attracting global players to the market. The report adds that while India's semiconductor industry is still in the early stages, it is strategically leveraging proven technologies rather than aiming to compete with the world's most advanced nodes. This approach mirrors the success India has seen in the automotive industry. The report stated that in the 1980s, India faced significant challenges in starting auto manufacturing, but with the right policies and a growing domestic market, the country is now the fourth-largest producer of vehicles and an exporter of automobiles. The same blueprint could apply to the semiconductor sector. However, the report also mentions the challenges that are hindering the development in the sector such as underdeveloped supply chain, limited manufacturing expertise, and global competition. © Muscat Media Group Provided by SyndiGate Media Inc. (

India has strong potential to replicate its manufacturing success and become a semiconductor hub: Jefferies
India has strong potential to replicate its manufacturing success and become a semiconductor hub: Jefferies

Times of Oman

time16-03-2025

  • Business
  • Times of Oman

India has strong potential to replicate its manufacturing success and become a semiconductor hub: Jefferies

New Delhi: Favourable government policies, growing demand, low-cost production capabilities, and strategic linkages with the Western nations have led India to develop itself as a semiconductor hub, according to a recent report by Jefferies. As per the report, fiscal incentives from the government, low manufacturing costs, a talented design workforce, and rising demand are advantageous factors, helping the sector. "We believe India has strong potential to replicate its manufacturing success in autos to semis, led by policy support, rising demand, low cost and strategic goodwill with the West" said the report The report added that the countries aspirations to become a major player in the semiconductor manufacturing is gaining significant momentum, with over USD 18 billion in investments already underway. These investments are spread across five key projects, including Tata Electronics' USD 11 billion chip fab with Taiwan's PSMC, set to begin operations in 2026. As per the Jefferies interaction with the government, it added that the Indian government aims to quadruple electronics production to USD 500 billion by 2030. The report adds that the Indian electronics sector is already witnessing rapid growth, driven by increasing incomes, digital adoption, and a rising demand for electronic products. In Financial Year (FY) 2024, India's electronics imports reached USD 60 billion, making up 25 per cent of the country's trade deficit, second only to oil. This has prompted the Indian government to take a bold stance on domestic electronics manufacturing, focusing on boosting production and reducing the import dependency. The government's significant policy push includes a USD 10 billion incentive program launched in 2021, aimed at covering around 50 per cent of the project costs for chip and display fabs, as well as testing facilities. Certain states are offering additional incentives of up to 20 per cent, bringing the total fiscal support for these projects to an impressive 70 per cent. The results are already visible: five semiconductor-related projects, involving a total investment of USD 18 billion, are under construction. These projects are expected to create around 80,000 direct and indirect jobs, contributing to the growth of India's semiconductor ecosystem, the report added. The report adds that India's efforts are focused on expanding the entire semiconductor supply chain, from chemicals and gases to components and equipment. During an interaction with the credit rating agency, the Minister of Railways and Electronics and IT, Ashwini Vaishnaw, highlighted the government's strong focus on building this complete ecosystem, leveraging India's design capabilities and attracting global players to the market. The report adds that while India's semiconductor industry is still in the early stages, it is strategically leveraging proven technologies rather than aiming to compete with the world's most advanced nodes. This approach mirrors the success India has seen in the automotive industry. The report stated that in the 1980s, India faced significant challenges in starting auto manufacturing, but with the right policies and a growing domestic market, the country is now the fourth-largest producer of vehicles and an exporter of automobiles. The same blueprint could apply to the semiconductor sector. However, the report also mentions the challenges that are hindering the development in the sector such as underdeveloped supply chain, limited manufacturing expertise, and global competition.

Tata Electronics, Himax Technologies and Powerchip Semiconductor Manufacturing Corporation Form Alliance to Revolutionize India's Display and Ultralow Power AI Sensing Product and Technology Ecosystem
Tata Electronics, Himax Technologies and Powerchip Semiconductor Manufacturing Corporation Form Alliance to Revolutionize India's Display and Ultralow Power AI Sensing Product and Technology Ecosystem

Yahoo

time05-03-2025

  • Business
  • Yahoo

Tata Electronics, Himax Technologies and Powerchip Semiconductor Manufacturing Corporation Form Alliance to Revolutionize India's Display and Ultralow Power AI Sensing Product and Technology Ecosystem

TAINAN and HSINCHU, Taiwan and MUMBAI, India, March 05, 2025 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. ('Himax' or 'Company') (Nasdaq: HIMX), an industry leader in fabless display driver ICs and other semiconductor products, today announced a Memorandum of Understanding (MoU) with Tata Electronics, a pioneering leader in India's electronics manufacturing sector, and Powerchip Semiconductor Manufacturing Corporation (PSMC), a leading Taiwanese Foundry and Technology Transfer Partner of Tata Electronics, to revolutionize India's display and ultralow power AI sensing product and technology ecosystem. This MoU marks a significant step forward for Tata Electronics, Himax, and PSMC in expanding their market outreach and jointly exploring the growing market of display semiconductors and ultralow power AI sensing in India as well as globally. Tata Electronics, Himax, and PSMC aim to leverage their respective strengths to deliver comprehensive, end-to-end display semiconductor solutions for their mutual customers, from chip design to chip manufacturing and packaging, as well as electronics manufacturing services (EMS) to deliver system-level solutions, to both the Indian and global markets. The parties will collaborate closely to develop solutions focusing on "Made in India" requirements. The partnership also encompasses designing and manufacturing next-generation solutions to meet global demand while enhancing supply chain resilience. Building on the landmark 2024 agreement between Tata Electronics and PSMC to establish advanced semiconductor manufacturing capabilities in India, today's announcement paves the way for innovative display solutions tailored to the domestic market. Dr Randhir Thakur, CEO and MD of Tata Electronics, said, 'This MoU with Himax and PSMC will enable the development of differentiated solutions for display-related semiconductor products for our mutual customers. By combining Tata Electronics' capabilities with Himax's unparalleled expertise in display semiconductors and WiseEye™ ultralow power AI sensing and PSMC's proven manufacturing solutions, we are creating a powerful ecosystem that addresses both domestic and global needs for the display semiconductor market. Together, we will drive innovation and develop next-generation technologies to meet the growing demands of display and ultralow power AI sensing technologies across key industries while contributing to a resilient semiconductor supply chain.' Mr. Jordan Wu, Co-Founder and CEO of Himax Technologies, Inc., said, 'We are delighted to join forces with Tata Electronics and PSMC to drive innovation in India's rapidly expanding display semiconductor market. India is emerging as a key hub for electronics development and manufacturing, presenting immense opportunities for growth and technological advancement. Through this collaboration, we aim to bring Himax's industry-leading expertise in display semiconductors and WiseEye™ ultralow power AI sensing to support India's 'Made in India' initiative while enhancing global supply chain resilience. This partnership underscores our commitment to delivering cutting-edge display solutions that cater to the evolving needs of both Indian and international markets.' Mr. Martin Chu, President of PSMC, said, 'PSMC's portfolio of semiconductor fabrication technologies is well-suited to meet the growing 'Made in India' requirements. We look forward to this partnership with Tata Electronics and Himax, as it provides a unique opportunity to expand our collective footprint and gain significant share in both the domestic and global display semiconductors and ultralow power AI sensing markets.' About Tata Electronics Private LimitedTata Electronics Pvt. Ltd. is a prominent global player in the electronics manufacturing industry, with fast-emerging capabilities in Electronics Manufacturing Services, Semiconductor Assembly & Test, Semiconductor Foundry, and Design Services. Established in 2020 as a greenfield venture of the Tata Group, the company aims to serve global customers through integrated offerings across a trusted electronics and semiconductor value chain. With a rapidly growing workforce, the company currently employs over 65,000 people and has significant operations in Gujarat, Assam, Tamil Nadu, and Karnataka, India. Tata Electronics is committed to creating a socio-economic footprint by employing many women in its workforce and actively supporting local communities through initiatives in environment, education, healthcare, sports and livelihood. About Powerchip Semiconductor Manufacturing CorporationPowerchip Semiconductor Manufacturing Corporation (PSMC) is the world's seventh-largest pure-play foundry, with four 12-inch and two 8-inch fabs in Taiwan, capable of producing over 2.1 million 12-inch equivalent wafers annually. Since its establishment in 1994, the company transitioned successfully from DRAM manufacturing to advanced foundry services for memory and logic chips. Ranked seventh in global semiconductor ESG evaluations, PSMC demonstrates strong governance and environmental commitment. In May 2024, PSMC's new 12-inch fab in Taiwan's Tongluo Science Park began operations with a planned capacity of 1.2 million wafers annually, using advanced 28nm and wafer stacking technologies. About Himax Technologies, Technologies, Inc. (NASDAQ: HIMX) is a leading global fabless semiconductor solution provider dedicated to display imaging processing technologies. The Company's display driver ICs and timing controllers have been adopted at scale across multiple industries worldwide including TVs, PC monitors, laptops, mobile phones, tablets, automotive, ePaper devices, industrial displays, among others. As the global market share leader in automotive display technology, the Company offers innovative and comprehensive automotive IC solutions, including traditional driver ICs, advanced in-cell Touch and Display Driver Integration (TDDI), local dimming timing controllers (Local Dimming Tcon), Large Touch and Display Driver Integration (LTDI) and OLED display technologies. Himax is also a pioneer in tinyML visual-AI and optical technology related fields. The Company's industry-leading WiseEye™ ultralow power AI sensing technology which incorporates Himax proprietary ultralow power AI processor, always-on CMOS image sensor, and CNN-based AI algorithm has been widely deployed in consumer electronics and AIoT related applications. Himax optics technologies, such as diffractive wafer level optics, LCoS microdisplays and 3D sensing solutions, are critical for facilitating emerging AR/VR/metaverse technologies. Additionally, Himax designs and provides touch controllers, OLED ICs, LED ICs, EPD ICs, power management ICs, and CMOS image sensors for diverse display application coverage. Founded in 2001 and headquartered in Tainan, Taiwan, Himax currently employs around 2,200 people from three Taiwan-based offices in Tainan, Hsinchu and Taipei and country offices in China, Korea, Japan, Germany, and the US. Himax has 2,649 patents granted and 402 patents pending approval worldwide as of December 31, 2024. Forward Looking Statements Factors that could cause actual events or results to differ materially from those described in this conference call include, but are not limited to, the effect of the Covid-19 pandemic on the Company's business; general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non-driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortage in supply of key components; changes in environmental laws and regulations; changes in export license regulated by Export Administration Regulations (EAR); exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company's SEC filings, including those risks identified in the section entitled "Risk Factors" in its Form 20-F for the year ended December 31, 2023 filed with the SEC, as may be amended. Himax Contacts Eric Li, Chief IR/PR OfficerHimax Technologies, +886-6-505-0880 Fax: +886-2-2314-0877Email: hx_ir@ Karen Tiao, Investor RelationsHimax Technologies, +886-2-2370-3999Fax: +886-2-2314-0877Email: hx_ir@ Mark Schwalenberg, DirectorInvestor Relations - US RepresentativeMZ North AmericaTel: +1-312-261-6430Email: HIMX@

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