Latest news with #Renesas
Forbes
2 days ago
- Business
- Forbes
Japanese Semiconductor Startup Secures $21 Million In Grants For Edge AI
EdgeCortix's Sakura-II module. As Japan races to develop its domestic semiconductor ecosystem, Tokyo-headquartered chip design startup EdgeCortix announced it received 3 billion yen ($21 million) from a government-backed agency to develop specialized chips that can power 'edge AI,' a rapidly growing field of AI that involves running applications on devices themselves instead of on the cloud. The fresh funds, in the form of a project award from Japan's New Energy and Industrial Technology Development Organization (NEDO), bring the five-year-old company's total funding to $86 million, including $49 million in non-dilutive government grants and $37 million in equity financing. It received a 4 billion yen ($27.7 million) subsidy from a separate NEDO program last November. Across three previous equity funding rounds, with the most recent being a $20 million raise in October 2023, the startup's investors include SBI Investment, a CVC unit of Japanese financial services conglomerate SBI Group; Monozukuri Ventures; Seoul-based VC firm Futureplay; and automotive chips maker Renesas Electronics, formerly under Japanese electronics giant NEC. Renesas is also a customer of EdgeCortix. 'Building systems that are significantly more performance-per-watt efficient for AI processing than the current status quo, whether that's GPUs or other types of systems, especially in constrained environments…that is a critical factor for almost all edge applications,' says Sakyasingha Dasgupta, founder and CEO at EdgeCortix, in a video interview. 'That essentially differentiates us from the broader edge AI market.' In addition to the startup's focus on optimizing energy efficiency, Dasgupta adds, what distinguishes EdgeCortix is its architecture, referring to the design and programming that powers chips. Its patented 'Dynamic Neural Accelerator' architecture is an IP core, akin to a 'brain' for AI computing that can direct processors within a chip and adjust the way its components interact. This IP core can be integrated with processors such as neural processing units (NPU), which are tailored for machine learning. The latest grant will finance the development of EdgeCortix's new chiplet, a type of chip that uses interchangeable components, as opposed to monolithic ones. Dubbed 'NovaEdge,' EdgeCortix's chiplet for edge AI is designed for high-performance generative AI inference and on-device learning, the company says. Founded in 2019, EdgeCortix operates as a fabless semiconductor company, meaning it does not own its own fabrication facility, or 'fab.' The NovaEdge chiplet will utilize a 12-nanometer node produced by billionaire Morris Chang's Taiwan Semiconductor Manufacturing Co. (TSMC). EdgeCortix plans to commence mass production at TSMC subsidiary Japan Advanced Semiconductor Manufacturing (JASM)'s facility in Kumamoto, Japan, by 2027. A plant of Japan Advanced Semiconductor Manufacturing Company (JASM). With a wide range of applications, ranging from robotics to industrial automation, EdgeCortix's chips and accompanying software have recently gained traction in the defense industry. Earlier in May, the startup inked an agreement with the U.S. Department of Defense's venture-oriented Defense Innovation Unit (DIU) to use EdgeCortix's products for defense technologies, including AI-powered vision and generative AI. In December, the DIU had announced it would launch a new effort to accelerate the adoption of generative AI in both warfighting and enterprise management. Specifically, on the battlefield, edge AI may help quickly process sensitive information in environments with limited network connectivity or potential cybersecurity threats. Tech giant Palantir–cofounded by billionaires Peter Thiel, Alexander Karp, Stephen Cohen and Joe Lonsdale–has developed a range of edge AI offerings for military purposes, including Skykit, a backpack-sized server that can act as a fully operational intelligence unit for soldiers, analyzing data from sensors on drones and surveillance equipment. In the nascent field of edge AI, the decentralization of AI represents 'a profound shift in the technological landscape,' according to a report published in February by consulting firm Deloitte. Such computing developments may be particularly effective for use cases 'requiring rapid responses or operating in disconnected environments,' including smart home devices, autonomous vehicles, wearable health monitors, and industrial Internet of Things (IoT) systems. Global spending on edge infrastructure is projected to grow from $25.3 billion in 2022 to $55.6 billion by 2027, the report added, citing research from the International Data Center (IDC). A Palantir Technologies Skykit on display. Japan's government-backed investments align with broader efforts to bolster domestic chip design and manufacturing, with the aim of establishing greater independence for advanced AI technologies. Last November, Prime Minister Shigeru Ishiba announced a $65 billion plan to invest in the country's chip and artificial intelligence industry by 2030, according to local media. Central to these efforts is the state-backed chipmaker Rapidus. In March, the Japanese government pledged an additional $5.4 billion to Rapidus, bringing its total government subsidies or grants to around $11.5 billion. Headquartered in Tokyo and backed by industry giants, including financial services groups MUFG Bank and SoftBank, electronics makers NEC and Sony, Toyota, and telecoms provider NTT, Rapidus aims to launch commercial production of 2-nanometer chips—some of the world's thinnest and most advanced—by 2027. A major link in the global semiconductor supply chain, Japan is also home to industry giants including billionaire Uchiyama family's Lasertec, which manufactures chip testing equipment; KKR-backed chip production equipment maker Kokusai Electric; Bain-backed Kioxia, Advantest (chip testing equipment); and Sumco, a silicon wafer supplier.
Coin Geek
6 days ago
- Business
- Coin Geek
India sets up 3nm chip design centers in semiconductor push
Getting your Trinity Audio player ready... India has officially launched two advanced semiconductor design centers operated by Renesas Electronics India Private Limited in Noida and Bengaluru. These centres will work on the ultra-advanced 3-nanometer (nm) chip design, making it the first of its kind in the country. These new facilities represent a major leap forward in the nation's technology infrastructure, particularly in the semiconductor space. 'Designing at 3nm is truly next-generation. We've done 7nm and 5nm earlier, but this marks a new frontier,' Ashwini Vaishnaw, Minister for Electronics and Information Technology, said in a statement. In its effort to bolster the country's semiconductor capabilities, the Indian government has consistently promoted the establishment of chip design facilities across the nation. This strategic push is aimed at creating a robust and self-reliant semiconductor ecosystem. Emphasizing the accelerating progress in this sector, Vaishnaw remarked that the launch of prominent design hubs marks a pivotal moment in India's journey toward becoming a global semiconductor powerhouse. He noted that these new centers are not just isolated developments but integral components of a broader national initiative to leverage the country's vast pool of skilled engineers and researchers, laying the foundation for a comprehensive, pan-India semiconductor network. 'Within just three years, India's semiconductor industry has moved from a nascent stage to an emerging global hub, and is now poised for long-term, sustainable growth,' he said. 'With manufacturing of electronic products in smart phones, laptops, servers, medical equipment, defense equipment, automobiles and many other sectors, the demand for semiconductors is going to increase exponentially. Therefore, this momentum for growth of the semiconductor industry is timely,' Vaishnaw added. The minister also introduced a new semiconductor learning kit designed to boost hands-on hardware expertise among engineering students. He stated that more than 270 academic institutions—already equipped with cutting-edge electronic design and automation software through the India Semiconductor Mission—will now also be provided with these practical training kits to further enrich students' technical experience. 'This integration of software and hardware learning will create truly industry-ready engineers. We are not just building infrastructure but investing in long-term talent development,' he said. The minister further outlined India's comprehensive approach to developing its semiconductor sector, which includes every critical segment—from chip design and fabrication to ATMP (Assembly, Testing, Marking, and Packaging), as well as the supporting infrastructure of equipment, specialty chemicals, and gas supply chains. He highlighted the growing global confidence in India's semiconductor potential, referencing enthusiastic responses from international forums like Davos. He also pointed to substantial ongoing investments by major industry players, including Applied Materials and Lam Research, as evidence of this momentum. According to the statement, Hidetoshi Shibata, chief executive officer of Renesas Electronics, emphasized Renesas' commitment to expanding end-to-end semiconductor capabilities in India, from architecture to testing, while supporting over 250 academic institutions and numerous startups through government-backed initiatives like Chips to Startup (C2S) Programme and Design Linked Incentive (DLI) Scheme. He added that India's talent strength and shared Indo-Japan strategic interests will help reinvent the global semiconductor lifecycle. 'India is a strategic cornerstone for Renesas. Our long-term ambition is to jointly build a robust electronics ecosystem—from ideation to design, and production to lifecycle management—to meet the country's growing needs,' Shibata said. Renesas is an embedded semiconductor solution provider, the statement said. The company provides scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and internet of things (IoT) industries based on the broadest product portfolio, including high-performance computing, embedded processing, analog and connectivity. Renesas, a niche product designer, is setting up a design center in India with facilities in Noida, Bengaluru and Hyderabad. Renesas, MeitY to support local startups, academia Renesas Electronics Corporation has partnered with India's Ministry of Electronics & Information Technology (MeitY) to support local startups and academic institutions in VLSI (very large scale integration) and embedded semiconductor systems. Renesas and the Centre for Development of Advanced Computing (C-DAC), an autonomous scientific institution under MeitY, formalized their collaboration by signing two Memoranda of Understanding (MoUs) as part of the MeitY Chips to Startup (C2S) initiative. These agreements are aimed at empowering domestic startups to spearhead technological innovation and boost indigenous manufacturing, aligning with the objectives of the Make in India campaign. Additionally, the MoUs emphasize strengthening ties between academia and industry by cultivating a product-oriented and innovation-driven mindset among students. In a statement, Renesas said it is committed to deepening its partnerships with local companies, startups, and universities, aiming to generate over 10% of its global revenue from the Indian market by 2030. Its recent collaborations include the OSAT factory project with CG Power and Stars Microelectronics in India's Gujarat state and the MoU with IIT Hyderabad. Renesas said it is expanding its operations in India, with plans to increase its headcount to 1,000 by the end of 2025. 'The inauguration of our expanded offices marks a significant milestone for Renesas in India. It reflects our unwavering commitment to innovation, excellence, and the nurturing of local talent. By building products in India, for India and the world, we continue to drive growth and deliver meaningful impact across the Indian market,' said Malini Narayanamoorthi, India Country Manager and VP, MID Engineering, Analog & Connectivity Group at Renesas. 'We are proud to sign two MoUs under the MeitY C2S programme, focused on advancing research, fostering innovation, and nurturing product-focused engineers. These strategic collaborations align with the Make in India initiative, aiming to strengthen local design and manufacturing capabilities and empower homegrown talent to drive the future of industry.' Watch: Blockchain, IPv6, AI & 5G will pave the way for the new Internet title="YouTube video player" frameborder="0" allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share" referrerpolicy="strict-origin-when-cross-origin" allowfullscreen="">
Yahoo
22-05-2025
- Business
- Yahoo
Correlated Electron RAM (CeRAM) Industry Research Report 2025-2034: Innovators Eye Competitive Edge Across Key Tech Sectors, CeRAM Emerges as Next-Gen Memory Solution
The Correlated Electron RAM (CeRAM) market is rapidly emerging as a crucial player in next-gen memory technology, offering faster speeds and reduced power consumption over traditional solutions. With escalating demand in computing, telecom, and electronics, CeRAM is poised for significant growth. Market challenges include integrating CeRAM into existing manufacturing, raising costs and development time, yet companies like Toshiba, Renesas, IMEC, and STMicroelectronics are innovating to overcome these hurdles. Key segments include application, product, and region. Dublin, May 22, 2025 (GLOBE NEWSWIRE) -- The "Correlated Electron RAM (CeRAM) Market: Focus on End User, Wafer Type, and Region - Analysis and Forecast, 2025-2034" report has been added to Correlated Electron RAM (CeRAM) market is quickly emerging as a key player in the next generation of memory technology. CeRAM, which harnesses correlated electron effects, offers faster speeds and lower power consumption compared to traditional memory solutions. As industries seek more efficient and high-performance memory technologies, CeRAM is gaining attention for its potential to revolutionize data storage and processing. With growing demand for advanced memory solutions in sectors such as computing, telecommunications, and consumer electronics, the CeRAM market is positioned for significant growth. As the technology matures, companies have a unique opportunity to innovate and secure a competitive edge in this expanding market.A major driver of the Correlated Electron RAM (CeRAM) market is the increasing demand for faster and more energy-efficient memory solutions. As data processing requirements surge across industries, traditional memory technologies struggle to keep up with the need for higher speed and lower power consumption. CeRAM, with its ability to offer rapid data access while consuming less power, is emerging as a preferred choice for applications in computing, telecommunications, and consumer electronics. This push for enhanced performance and energy efficiency is accelerating the adoption of CeRAM, positioning it as a crucial technology in the evolving memory a significant challenge facing the Correlated Electron RAM (CeRAM) market is the complexity of integrating this emerging technology into existing manufacturing processes. CeRAM, while offering superior performance, requires specialized production techniques that differ from those used for traditional memory technologies. This complexity can lead to higher manufacturing costs and longer development cycles, making it difficult for companies to achieve large-scale production and market adoption quickly. Additionally, the need for extensive research and development to optimize CeRAM's performance and reliability further adds to the challenges, potentially slowing down its commercialization and widespread like Toshiba, Renesas Electronics Corporation, Interuniversity Microelectronics Centre (IMEC), and STMicroelectronics are at the forefront of the Correlated Electron RAM (CeRAM) market, each leveraging their unique strengths to lead in this emerging field. Toshiba has been actively investing in advanced memory technologies, positioning itself as a pioneer in CeRAM development through extensive research and innovation. Renesas Electronics Corporation is enhancing its market presence by integrating CeRAM into its broad portfolio of semiconductor solutions, aiming to meet the growing demand for high-performance memory in automotive and industrial applications. IMEC, known for its cutting-edge research in microelectronics, is collaborating with industry leaders to push the boundaries of CeRAM technology, ensuring its scalability and commercial viability. STMicroelectronics is capitalizing on its strong foothold in the semiconductor market by exploring CeRAM's potential for low-power and high-speed applications, focusing on creating customized solutions for various sectors. These companies are driving the CeRAM market forward through strategic investments, collaborations, and the development of innovative memory solutions. Companies Featured Toshiba Renesas Electronics Corporation Arm Limited Interuniversity Microelectronics Centre (IMEC) STMicroelectronics Intel Micron Technology, Inc. Symetrix Corporation Cerfe Labs, LLC Key Topics Covered:1. Markets: Industry Outlook1.1 Trends: Current and Future Impact Assessment1.2 Supply Chain Overview1.2.1 Value Chain Analysis1.3 Pricing Analysis1.4 R&D Review1.4.1 Patent Filing Trend by Country, by Company1.5 Regulatory Landscape1.6 Stakeholder Analysis1.6.1 Use Case1.6.2 End User and Buying Criteria1.7 Impact Analysis for Key Global Events1.8 Market Dynamics Overview2. Global Correlated Electron RAM (CeRAM) Market by Application2.1 Application Segmentation2.2 Application Summary2.3 Global Correlated Electron RAM (CeRAM) Market by End User2.3.1 Consumer Electronics2.3.2 Enterprise Storage2.3.3 Automotive and Transportation2.3.4 Military and Aerospace2.3.5 Industrial2.3.6 Telecommunication2.3.7 Energy2.3.8 Healthcare2.3.9 Others3. Global Correlated Electron RAM (CeRAM) Market by Products3.1 Product Segmentation3.2 Product Summary3.3 Global Correlated Electron RAM (CeRAM) Market by Wafer Type3.3.1 200MM3.3.2 300MM3.3.3 450MM4. Global Correlated Electron RAM (CeRAM) Market by Region4.1 Global Correlated Electron RAM (CeRAM) Market - by Region4.2 North America4.2.1 Regional Overview4.2.2 Driving Factors for Market Growth4.2.3 Factors Challenging the Market4.2.4 Application4.2.5 Product4.2.6 U.S.4.2.6.1 Market by Application4.2.6.2 Market by Product4.2.7 Canada4.2.7.1 Market by Application4.2.7.2 Market by Product4.3 Europe4.4 Asia-Pacific4.5 Rest-of-the-World5. Competitive Landscape5.1 Next Frontiers5.2 Geographic Assessment5.2.1 Overview5.2.2 Top Products/Product Portfolio5.2.3 Top Competitors5.2.4 Target Customers5.2.5 Key Personnel5.2.6 Analyst View6. Research MethodologyFor more information about this report visit About is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends. CONTACT: CONTACT: Laura Wood,Senior Press Manager press@ For E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900
Yahoo
19-05-2025
- Business
- Yahoo
Renesas Extends RZ/A MPU Line-up with RZ/A3M for Cost-Sensitive, Advanced HMI Solutions
Built-in 128MB DDR3L SDRAM for System Cost Reduction with 30fps Video/Animation and Camera Display up to 1280x800 Resolution TOKYO, May 19, 2025--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems. The new RZ/A3M MPU comes with large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays. The RZ/A3M drives video and camera output on large LCD panels with resolutions up to 1280x800, addressing the display requirements in next-generation home appliances, industrial and office automation, healthcare devices and building control systems. Similar to its existing RZ/A3UL, the RZ/A3M features a 64-bit Arm® Cortex®-A55 core with a maximum operating frequency of 1 GHz and 128 KB (kilobytes) of on-chip SRAM. By integrating high-speed 128MB DDR3L-SDRAM in a single System-in-Package (SiP), the device eliminates the complex task of designing a high-speed signal interface for connecting external memory. Reducing System Cost with Built-in Memory and Simplified PCB Design The RZ/A3M is designed to reduce system costs and accelerate development. It supports both external NAND and NOR flash via QSPI for data and code storage. Paired with a driver, high-capacity NAND flash offers a cost-effective option for memory expansion. Additionally, the RZ/A3M's BGA package has a unique pin layout with two main rows positioned on the outside edge. This layout simplifies PCB routing and enables a low-cost, dual-layer printed wiring board design, providing significant cost and time savings. This memory integration simplifies PCB design by reducing the routing complexity and minimizing layout constraints. "I'm pleased to launch the RZ/A3M, the first RZ product with large built-in memory targeting high-function video/animation HMI performance while keeping overall system costs low," said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. "In addition, we aim to deliver a highly responsive user experience with high-quality, real-time graphics, and provide the ease of design and cost efficiency to help our customers build advanced HMI solutions quickly." Comprehensive Development Environment Renesas offers a comprehensive HMI development environment that includes the Flexible Software Package (FSP), evaluation kits, development tools, and sample software. Graphical user interface (GUI) solutions from partner companies such as LVGL, Crank, SquareLine Studio, and Envox will be available for the RZ/A3M to facilitate rapid HMI graphics development. Key Features of RZ/A3M Arm Cortex-A55 CPU with a maximum operating frequency of 1GHz 128KB SRAM with error correction, Built-in 128MB DDR3L SDRAM Graphics capabilities: LCD controller supporting resolutions up to 1280x800 (WXGA), parallel RGB and MIPI-DSI (4-lane) interfaces, 2D graphics drawing engine Peripheral functions: QSPI interface for serial NOR/NAND flash memory, SPI, I2C, SDHI, USB2.0, I2S, temperature sensor, timer Package: 244-pin LFBGA, 17mm x 17mm, 0.8mm pitch Renesas' Comprehensive HMI Solutions Renesas offers a wide variety of HMI solutions ranging from the 32-bit RX and RA MCU families to the 64-bit RZ family supporting 4K displays. The RZ/A series, built on RTOS-based MPUs with fast startup, includes the new RZ/A3M, which delivers high-performance HMI capabilities with the same ease of use offered by MCUs using large memory capacity. Multi-HMI Winning Combination Renesas offers Multi-HMI Solution which combines the new RZ/A3M MPU with numerous compatible devices from its portfolio to offer HMI functions for appliances. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at Availability The RZ/A3M is available in volume production today along with the FSP, evaluation kits and development tools. More information is available at: About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, X, YouTube, and Instagram. (Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners. View source version on Contacts Media Contacts: Americas Akiko IshiyamaRenesas Electronics Corporation+ Sign in to access your portfolio
The Print
14-05-2025
- Business
- The Print
High level of confidence on India's economy, PM's policy: Vaishnaw on investor's mood
'There is a very high level of confidence about our country's economy, about our Prime Minister's policies, about the excellent talent that we have in our country, and the way, the measured, the calibrated way by which our economy is growing,' Vaishnaw said in response to question the mood of investors after heightened tension between India and Pakistan following their four-day military confrontation. The minister was responding to a question on investor sentiment post-India-Pakistan military standoff on the sidelines of the inauguration of a new design centre by the Japanese semiconductor company Renesas. New Delhi, May 13 (PTI) Investors have continued to exude a high level of confidence in India's economy, the Prime Minister's policy and the country's talent, Union Minister Ashwini Vaishnaw said on Tuesday. 'Everybody wants to come to India at a much faster pace,' Vaishnaw said. The minister said that Renesas has started a new semiconductor design centre in Noida which will mark the beginning of design for the world's smallest chip in the country. 'The key point about this centre is, for the first time in our country, three nanometer chips, which are the most advanced, will be designed here in India end-to-end,' Vaishnaw said. Renesas, India Country Manager and VP, MID Engineering, Analog & Connectivity Group Malini Narayanamoorthi said that it is a proud moment for the company to start designing 3-nanometer chips at its Noida facility. 'We are proud to announce that, for the first time, 3-nanometer chips—an industry first—will be designed right here at the new Renesas Design Centre in Noida,' she said. Vaishnaw said that as part of the chip design effort, the government will provide a microcontroller-based hardware kit, which can be used to develop many semiconductor-based products. 'That will be given to the 270 academic institutions, in which we have set up the EDA tools so that the students can learn, while they are learning the software part of it, they can also try their hands at hardware and develop new products,' Vaishnaw said. Renesas CEO Hidetoshi Shibata, who joined the event virtually, announced that the company has grown 10 times in India to date and plans to grow the total workforce in the country to 1,000 by the end of 2025. He said that Renesas expects 10 per cent of the company's total revenue to come from India in the next few years. 'Initial target was to achieve 10 per cent business by 2030, but it may take longer because of (US) tariff discussion,' Shibata said. Vaishnaw asked Renesas to grow the India facility by 10 times. Renesas during the inaugural event signed a memorandum of understanding (MoU) with the Centre for Development of Advanced Computing (C-DAC) and exchanged two memoranda of understanding (MoUs) under the MeitY Chips to Startup (C2S) programme. The MoUs focus on supporting local startups by enabling them to drive technological advancement and promote local manufacturing in alignment with the Make in India initiative. The MoU will also focus on enhancing industry-academia collaboration by fostering an innovative, product-focused mindset among students. PTI PRS PRS MR This report is auto-generated from PTI news service. ThePrint holds no responsibility for its content.
