Latest news with #RossSabolcik
Time of India
4 days ago
- Business
- Time of India
Silicon Labs, Wirepas ship 10 mn wireless chipsets for industrial IoT, primarily in India
NEW DELHI: NASDAQ-listed Silicon Labs and Finnish Wirepas on Wednesday said the companies have jointly shipped 10 million units of the Silicon Labs sub-GHz FG23 chipset to date, primarily in the Indian market. Silicon Labs makes low-power wireless solutions, while Wirepas is a decentralised IoT connectivity provider. The chipsets, running Wirepas' radio frequency (RF) mesh software, power demanding industrial mesh networks across sectors, including smart electricity metering, emergency lighting, industrial monitoring and building automation, according to a joint statement. In December 2024, the companies said 4 million smart electric meters using Wirepas Mesh software had been deployed in India, built on the sub-GHz FG13 and FG23 platforms, helping the country meet the goals of its Advanced Metering Infrastructure (AMI) initiative. In Norway, more than one million similarly equipped smart meters are connected in a single decentralised mesh network , one of the largest of its kind in the world, as per the statement. Other segments are also gaining momentum, with some, such as the emergency lighting sector, experiencing very high adoption rates, the companies said. 'By combining Silicon Labs' energy-efficient wireless platforms with Wirepas' decentralised mesh stack, we help our customers build massive, secure, and resilient IoT networks faster and more cost-effectively. We're excited to continue driving transformation across industries together,' said Ross Sabolcik, senior vice president (product lines) at Silicon Labs. 'This 10-million milestone demonstrates the unmatched scalability and resilience of our joint solution,' said Teppo Hemiä, CEO of Wirepas. 'With Silicon Labs' hardware and our mesh software, we've enabled massive networks that simply work, even in the most challenging conditions.
Yahoo
6 days ago
- Business
- Yahoo
Silicon Labs and Wirepas Surpass 10 Million Chipsets, Powering Industrial IoT at Scale
AUSTIN, Texas and TAMPERE, Finland, June 3, 2025 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless solutions, and Wirepas, a global leader in decentralized IoT connectivity, today announced they have shipped 10 million wireless SoCs running Wirepas' RF mesh connectivity software, primarily in the Indian market with the Silicon Labs sub-GHz FG23 SoC. These chips power some of the world's largest and most demanding industrial mesh networks across sectors including smart electricity metering, emergency lighting, industrial monitoring and building automation. The two companies have a long history of collaboration enabling robust, ultra-resilient and massively scalable IoT networks that meet the scale, security, and reliability demands of industrial-grade applications. This milestone confirms that their joint solution is not just technically sound, it is market-proven at scale, and ready to support the digital backbone of global infrastructure. In December 2024, Silicon Labs and Wirepas announced that four million smart electric meters using Wirepas Mesh software had been deployed in India built on the sub-GHz FG13 and FG23 platforms, helping the country meet the goals of its Advanced Metering Initiative. The solution provides reliable, cost-effective connectivity across dense, complex environments, being a critical enabler for India's ambitious grid modernization and electrification goals. Another standout success is in Norway, where more than one million similarly-equipped smart meters are connected in a single decentralized mesh network, one of the largest of its kind in the world. These types of deployments demonstrate that robust, self-healing mesh connectivity can now support national-scale infrastructure, laying the groundwork for smarter, more efficient, and more sustainable infrastructure powering cities and industries. Other segments are also gaining momentum, with some, such as the emergency lighting sector, experiencing very high adoption rates. "Our partnership with Wirepas is built on a shared vision: to enable industrial-grade wireless connectivity at scale," said Ross Sabolcik, Senior Vice President of Product Lines at Silicon Labs. "By combining Silicon Labs' energy-efficient wireless platforms with Wirepas' decentralized mesh stack, we help our customers build massive, secure, and resilient IoT networks faster and more cost-effectively. We're excited to continue driving transformation across industries together." "This 10-million milestone demonstrates the unmatched scalability and resilience of our joint solution," said Teppo Hemiä, CEO of Wirepas. "With Silicon Labs' hardware and our mesh software, we've enabled massive networks that simply work, even in the most challenging conditions. Our partnership is helping industries solve real problems at the infrastructure level, accelerating the digitalization and electrification of society." More information Read more about the collaboration between Silicon Labs and Wirepas to deliver smart meters to India, here and here. Learn more about how Silicon Labs and Wirepas are collaborating on the 2.4 GHz spectrum, here. See more features of the FG23 wireless SoC, here. About Silicon LabsAbout Silicon Labs Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power wireless connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world's most highly integrated SoCs, Silicon Labs provides device makers with the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin, Texas, Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in the smart home, industrial IoT, and smart cities markets. Learn more at About WirepasWirepas is a global leader in IoT connectivity, providing ultra-resilient, infinitely scalable mesh networks for large-scale industrial and commercial deployments. Its technology connects millions of devices worldwide, including the largest network of more than a million smart electricity meters. With proven 99.99% reliability and a team of deep experts guiding projects from planning to maintenance, Wirepas ensures unmatched business continuity. Wirepas is also the main contributor to and first implementor of the first non-cellular 5G standard NR+, purpose-built for massive IoT and using a free global spectrum. Wirepas operates globally across smart tracking, smart building and smart metering sectors. Learn more on View original content to download multimedia: SOURCE Silicon Labs
Yahoo
22-05-2025
- Business
- Yahoo
Silicon Labs Unveils First Series 3 SoCs, Powering the Next Wave of IoT Breakthroughs
SiXG301 and SiXG302, Silicon Labs' first wireless SoC families at the 22 nm process node, deliver breakthroughs in compute, power efficiency, integration and security AUSTIN, Texas, May 22, 2025 /PRNewswire/ -- Silicon Labs, the leading innovator in low-power wireless solutions, today announced the first products of its Series 3 portfolio with the introduction of two new wireless SoC families built at the advanced 22 nanometer (nm) process node: the SiXG301 and SiXG302. These highly integrated solutions represent a significant leap forward in compute power, integration, security, and energy efficiency, addressing the growing demands of both line-powered and battery-powered IoT devices. As smart devices grow more sophisticated and compact, the need for powerful, secure, and highly integrated wireless solutions has never been greater. The new Series 3 SoCs deliver on this promise with advanced processing capabilities, flexible memory options, best-in-class security, and streamlined external component integration. Silicon Labs' Series 1, Series 2, and Series 3 platforms will continue to complement one another in the market and address the full breadth of IoT applications. The new Series 3 families of SoCs include: SiXG301: Optimized for Line-Powered ApplicationsPurpose-built for line-powered smart devices, the SiXG301 includes an integrated LED pre-driver and offers an ideal solution for advanced LED smart lighting and smart home products, supporting Bluetooth, Zigbee, and Thread with support for Matter. Built with high Flash and RAM overhead of 4 MB and 512 kB, respectively, the SiXG301 helps future-proof customer designs as the requirements for Matter and other more demanding IoT applications continue to grow. This SoC enables concurrent multi-protocol operation for Zigbee, Bluetooth and Matter over Thread networks at the same time, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability. Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025. SiXG302: Designed for Battery-Powered EfficiencyExpanding Series 3 to battery-powered applications, the upcoming SiXG302 will deliver groundbreaking energy efficiency without sacrificing performance. Featuring Silicon Labs' advanced power architecture, the SiXG302 is designed to use only 15 µA/MHz active current, 30% lower than competitive devices in its class. This makes it ideal for battery-powered wireless sensors and actuators for both Matter and Bluetooth applications. The SiXG302 is planned for customer sampling in 2026. "Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency," said Ross Sabolcik, Senior Vice President of Product Lines at Silicon Labs. "With the SiXG301 and upcoming SiXG302 families, we're delivering flexible, highly integrated solutions that enable next-generation IoT devices—whether they're plugged in or running on battery power." The SiXG301 and SiXG302 families will initially include "M" devices for multiprotocol, the SiMG301 and SiMG302, and "B" devices optimized for Bluetooth LE communications, the SiBG301 and SiBG302. By leveraging the 22 nm process node for all Series 3 devices, Silicon Labs is addressing the growing demand for more powerful and efficient far-edge devices across a wide range of IoT applications—from smart cities and industrial automation to healthcare, smart homes, and beyond. These new SoCs offer device makers a scalable, secure platform to create the next wave of innovative, high-performance IoT products. Learn More About the Series 3 Platform at Works With 2025 To learn more about the Series 3 platform and how it is advancing wireless connectivity, visit: Learn more about Series 3 Wireless Platform Learn more about SiMG301 Learn more about SiBG301 Additionally, Silicon Labs will highlight the SiXG301 along with its portfolio of industry-leading innovations during the 2025 Works With conference series. This global event brings together industry experts to explore the best practices, emerging technologies, and transformative trends shaping the industry. The conference will be hosted across multiple international locations, with a virtual edition available for broader accessibility: Works With Summit: October 1-2 in Austin, TX Works With Shenzhen: October 23 Works With Bangalore: October 30 Works With Virtual: November 19-20 Learn more about Works With today. About Silicon Labs Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power wireless connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world's most highly integrated SoCs, Silicon Labs provides device makers with the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin, Texas, Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in the smart home, industrial IoT, and smart cities markets. Learn more at View original content to download multimedia: SOURCE Silicon Labs
