Latest news with #SOCAMM
Yahoo
6 days ago
- Business
- Yahoo
FMS 2025 Announces Lineup Of Keynote Presentations Highlighting Breakthroughs In Memory And Storage Innovation
Industry Leaders to Share Cutting-Edge Advances in AI, Big Data, and High-Performance Storage Solutions SANTA CLARA, Calif., May 30, 2025 /PRNewswire/ -- FMS: the Future of Memory and Storage, the world's leading conference focused on high-performance memory, storage, and SSD technology, today announced it will feature 11 keynote presentations at this year's event. The keynotes will spotlight cutting-edge developments and applications driving next-generation technologies across AI, big data, quantum computing, and 5G infrastructure. "Keynote addresses are a longstanding highlight of FMS, and this year promises to deliver another powerful series of insights," said Jay Kramer, FMS Keynote Master of Ceremonies. "Attendees will hear about infrastructure for the datacenter for support of cloud storage, the new SOCAMM memory module optimized for AI data centers, the newest HBM4 and 3D High-Bandwidth Memory, and software-defined memory (SDM) for virtualized memory resource management." The innovative companies scheduled to deliver keynote presentations include FADU, KIOXIA, KOVE, MaxLinear, Micron, Neo Semiconductor, Samsung, Sandisk, Silicon Motion, SK hynix and The keynotes take place on Tuesday and Wednesday of the conference. "The FMS keynote stage is where industry leaders unveil breakthrough technologies and trends," said Tom Coughlin, FMS General Chair. "This year's keynotes cover a wide range of topics—from new product categories to emerging uses in AI, machine learning, and cognitive computing—providing attendees with essential knowledge and perspective." FMS 2025 will once again serve as the definitive platform for memory and storage professionals, featuring the industry's most comprehensive technical program, exhibits, and special events. Attendees can look forward to: Invited talks from renowned experts Analyst panels addressing major industry trends Chat with the Experts interactive sessions The renowned FMS Lifetime Achievement Award The prestigious FMS Best of Show Awards The one-of-a-kind SuperWomen of FMS award and networking reception hosted by Hammerspace and Pure Storage FMS will also feature a Thursday Main Stage Special Event: an Executive AI Panel hosted and moderated by NVIDIA, which is focused on the evolving role of memory and storage in AI workloads. This high-profile session will bring together top executives from some of the industry's most innovative companies, offering a range of expert perspectives on the latest AI trends and technological breakthroughs. Attendees will gain critical insights into the future of AI infrastructure and the emerging solutions driving the next wave of intelligent applications. Registration is now open at For more information on the event and the full program lineup, visit To become an FMS sponsor or exhibitor, see the prospectus at: About FMS: The Future of Memory and Storage FMS: the Future of Memory and Storage, produced by Conference ConCepts, is the premier global event showcasing cutting-edge developments in multi-billion-dollar high-speed memory and storage technologies. As the world's largest conference and exhibition in this sector, FMS highlights mainstream applications, breakthrough innovations, key enabling technologies, and the full spectrum of players—from leading vendors to disruptive startups. This event spans critical application areas including AI, enterprise data centers, high-performance computing, mobile devices at the edge, and embedded systems. FMS serves as a dynamic hub where technology professionals, executive leaders, customers, cloud providers, hyperscaler companies, and industry analysts converge to explore the evolving landscape of memory and storage. With a renewed commitment to inclusivity and innovation, FMS is shaping the future of memory and storage—especially at its intersection with artificial intelligence. Press Contact: Michelle Suzuki310-930-6655http:// View original content to download multimedia: SOURCE FMS: The Future of Memory and Storage
Korea Herald
24-04-2025
- Business
- Korea Herald
SK hynix Announces 1Q25 Financial Results
SEOUL, South Korea, April 24, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", announced today that it recorded 17.6391 trillion won in revenues, 7.4405 trillion won in operating profit (with an operating margin of 42%), and 8.1082 trillion won in net profit (with a net margin of 46%) in the first quarter this year. Both revenues and operating profit are the 2nd highest records following last quarter when the company achieved its best quarterly results. Operating margin improved by 1%p compared to the previous quarter to 42%, resulting in 8th consecutive quarterly growth. SK hynix explained that memory market ramped up faster than expected due to competition to develop AI systems and inventory accumulation demand. The company responded to the demand with an expansion in sales of high value-added products such as 12-layer HBM3E and DDR5. The company believes the strong financial results despite a low seasonality reflect its outstanding competitiveness compared to the past. The company plans to focus on enhancing the business fundamentals to achieve distinguished financial outcome, even in times of market correction. Based on the financial result, cash and cash equivalents increased by 0.2 trillion won to 14.3 trillion won at the end of the first quarter, compared to the end of 2024, leading to an improvement in the debt and net debt ratio to 29% and 11%, respectively. SK hynix will continue to strengthen collaboration with supply chain partners to meet customer needs despite demand fluctuation amid global uncertainties. Due to the characteristics of the HBM market that supply volume is mutually agreed a year in advance, the company maintains its earlier projection that HBM demand will approximately double compared to the last year. As a result, sales of 12-layer HBM3E are expected to favorably increase to account for over 50% of total HBM3E revenues in the second quarter. In addition, the company started to supply LPCAMM2 [1], high performance memory module for AI PC, to customers in the first quarter and plans to supply SOCAMM [2], a low-power DRAM module for AI servers, when demand ramps up. For NAND, the company plans to actively respond to demand for high-capacity eSSD, while maintaining profitability-first operation with cautious approach for investment. "In compliance with the 'Capex Discipline', SK hynix will focus on products with demand feasibility and profitability to enhance investment efficiency," said Kim Woohyun, Chief Financial Officer. "As an AI memory leader, we will strengthen collaboration with partners and carry out technological innovation in efforts to continue profit growth with industry-leading competitiveness." 1Q25 Financial Results (K-IFRS) * Financial information of the earnings is based on K-IFRS * Please note that the financial results discussed herein are preliminary and speak only as of April 24, 2025. Readers should not assume that this information remains operative at a later time. About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at
Yahoo
23-04-2025
- Business
- Yahoo
SK hynix Announces 1Q25 Financial Results
Revenues at 17.6391 trillion won, operating profit at 7.4405 trillion won, net profit at 8.1082 trillion won Both revenues, operating profit achieve 2nd highest quarterly records and operating margin improves for 8th consecutive quarters Company will strive to continue profit-centered growth based on AI memory leadership SEOUL, South Korea, April 23, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", announced today that it recorded 17.6391 trillion won in revenues, 7.4405 trillion won in operating profit (with an operating margin of 42%), and 8.1082 trillion won in net profit (with a net margin of 46%) in the first quarter this year. Both revenues and operating profit are the 2nd highest records following last quarter when the company achieved its best quarterly results. Operating margin improved by 1%p compared to the previous quarter to 42%, resulting in 8th consecutive quarterly growth. SK hynix explained that memory market ramped up faster than expected due to competition to develop AI systems and inventory accumulation demand. The company responded to the demand with an expansion in sales of high value-added products such as 12-layer HBM3E and DDR5. The company believes the strong financial results despite a low seasonality reflect its outstanding competitiveness compared to the past. The company plans to focus on enhancing the business fundamentals to achieve distinguished financial outcome, even in times of market correction. Based on the financial result, cash and cash equivalents increased by 0.2 trillion won to 14.3 trillion won at the end of the first quarter, compared to the end of 2024, leading to an improvement in the debt and net debt ratio to 29% and 11%, respectively. SK hynix will continue to strengthen collaboration with supply chain partners to meet customer needs despite demand fluctuation amid global uncertainties. Due to the characteristics of the HBM market that supply volume is mutually agreed a year in advance, the company maintains its earlier projection that HBM demand will approximately double compared to the last year. As a result, sales of 12-layer HBM3E are expected to favorably increase to account for over 50% of total HBM3E revenues in the second quarter. In addition, the company started to supply LPCAMM2[1], high performance memory module for AI PC, to customers in the first quarter and plans to supply SOCAMM[2], a low-power DRAM module for AI servers, when demand ramps up. [1] Low-Power Compression Attached Memory Module (LPCAMM2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM2 [2] Small Outline Compression Attached Memory Module (SOCAMM): A low-power DRAM-based memory module for AI server For NAND, the company plans to actively respond to demand for high-capacity eSSD, while maintaining profitability-first operation with cautious approach for investment. "In compliance with the 'Capex Discipline', SK hynix will focus on products with demand feasibility and profitability to enhance investment efficiency," said Kim Woohyun, Chief Financial Officer. "As an AI memory leader, we will strengthen collaboration with partners and carry out technological innovation in efforts to continue profit growth with industry-leading competitiveness." 1Q25 Financial Results (K-IFRS) *Unit: Billion KRW1Q25 QoQ YoY4Q24 Change 1Q24 Change Revenues 17,639.1 19,767.0 -11 % 12,429.6 42 % Operating Profit 7,440.5 8,082.8 -8 % 2,886.0 158 % Operating Margin 42 % 41 % 1%p 23 % 19%p Net Income 8,108.2 8,006.5 1 % 1,917.0 323 % * Financial information of the earnings is based on K-IFRS* Please note that the financial results discussed herein are preliminary and speak only as of April 24, 2025. Readers should not assume that this information remains operative at a later time. About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at Media ContactSK hynix Public Relations Technical LeaderKanga Kong, Minseok Jang, Sooyeon Lee E-Mail: global_newsroom@ View original content: SOURCE SK hynix Inc. Sign in to access your portfolio
Korea Herald
14-04-2025
- Business
- Korea Herald
SOCAMM: the next big thing in DRAM innovation
AI chips are emerging as game changers, and SOCAMM could create a new market leader As artificial intelligence creates new markets across industries, it is also fueling growth for Small Outline Compression Attached Memory Modules (SOCAMM), an emerging technology often described as the 'next High Bandwidth Memory.' While not a direct replacement for HBM memory, SOCAMM, with its scalability and lower power requirements, could prove just as critical and lucrative in reshaping the global memory chip landscape. Nvidia -- the world's top graphic processor unit provider -- has proposed a new modular memory chip standard for servers that maximizes performance while reducing power consumption, and tailored specifically for its upcoming AI processors. While the price of SOCAMM is expected to be just 25-33 percent of HBMs, the expensive memory chip powering GPUs for AI processing, leading memory chip makers Samsung Electronics, SK hynix and Micron Technology have jumped into the race to gain an early lead in the emerging server module market. "The SOCAMM market will be as competitive and strategically important for chipmakers as HBMs," an industry official said. "The real competition will be over who passes Nvidia's qualification tests first and becomes the main supplier of the new server module, once servers incorporating SOCAMM hit the market." Next innovation in DRAM SOCAMM is a compact, high-performance memory module optimized for AI servers. Unlike traditional server modules built using DDR5, SOCAMM uses LPDDR, the low power chip typically used in mobile devices. It vertically stacks multiple LPDDR5X -- the advanced model -- to boost data processing performance, while significantly improving energy efficiency. "While DDR5 is the standard in servers, power consumption has become a major issue with large-scale deployments," an industry official explained. "SOCAMM is designed with low power in mind, and with mobile DRAM performance improving significantly, it is now viable for server use." SOCAMM features 694 input and output pins -- tiny contact points that allow the chip to send and receive data -- significantly more than traditional DRAM modules with 262 pins, and even LPCAMM's 644. LPCAMM is the typical memory module for laptops. The higher pin count helps reduce data bottlenecks. What also makes SOCAMM attractive is its modular design, enabling users to easily remove and replace it for updates. The chip is expected to be used together with HBM chips to enhance the performance of Nvidia's upcoming AI processors. Nvidia is planning to use both HBM and SOCAMM chips in its next-generation AI accelerator GB300, which is planned for launch later this year. SOCAMM modules are expected to be installed in servers equipped with the Nvidia's AI accelerators. The GPU giant is also planning to use SOCAMM in its upcoming personal AI supercomputer developed under the name Project DIGITS, according to industry sources. The device, with its compact size — small enough to fit on a desk — is designed to make high performance AI computing more accessible to the public. Market condition At Nvidia's developers conference this year, GTC 2025, Micron Technology was the first to announce that it has begun mass production of SOCAMM for Nvidia's GB300. According to the American chipmaker, its SOCAMM module delivers more than 2.5 times the bandwidth of RDIMMs while using one-third the power. The compact design is also expected to enable more efficient server layout and better thermal management, the company added. Samsung and SK hynix also showcased their SOCAMM prototypes at the GTC 2025. Samsung reported its uses 9.2 watts, delivering over 45 percent greater power efficiency compared to DDR5-based DIMMs. The two Korean chipmakers have yet to announce their mass production plans, but said they are preparing so that they can hit the market "in line with market demand." "Micron appears to be taking the lead in early volume production, but it would not be fore immediate server installation, but for early-stage optimization," an industry official said. At the same time, SOCAMM is being seen as a comeback opportunity for Samsung. After falling behind SK hynix in the AI memory race with HBM chips, Samsung lost its top spot in the DRAM market during January-March period this year. The chip giant was over taken by its smaller rival for the first time after failing to get an early lead in the AI memory sector. According to industry sources, Samsung recently delivered SOCAMM module samples to Nvidia, in significantly larger volumes than its competitors, signaling a push to reclaim leadership in the next wave of AI memory market. Samsung is expected to leverage its dominance in the LPDDR segment as it pushes into the SOCAMM market. According to market tracker Omdia, Samsung had a 57.9 percent share in revenue in the mobile DRAM makret in the first quarter of last year.
Yahoo
01-04-2025
- Business
- Yahoo
Micron Technology (NasdaqGS:MU) Teams Up With NVIDIA For AI Memory Solutions
Micron Technology recently captured attention with its announcement to pay a cash dividend and its early move in the AI memory solutions arena by releasing HBM3E and SOCAMM products, developed alongside industry leader NVIDIA. During the past quarter, Micron's share price increased by 3.24%. This move coincided with broader developments such as the company's entry into a $3.5 billion revolving credit arrangement and fresh board appointments. Moreover, the tech sector experienced volatility, with major indices witnessing mixed performances against a backdrop of trade tariff concerns and market fluctuations, yet Micron managed to post its modest gain. Buy, Hold or Sell Micron Technology? View our complete analysis and fair value estimate and you decide. The best AI stocks today may lie beyond giants like Nvidia and Microsoft. Find the next big opportunity with these 22 smaller AI-focused companies with strong growth potential through early-stage innovation in machine learning, automation, and data intelligence that could fund your retirement. Over the past five years, Micron Technology's total shareholder return, including dividends, reached 91.67%. This period reflected significant product advancements and strategic growth initiatives. In early 2025, Micron expanded its High Bandwidth Memory manufacturing, enhancing its market presence, particularly in AI-driven sectors. This development aligned with its introduction of cutting-edge DRAM products and collaboration with NVIDIA, embedding itself further in next-generation data center solutions. Micron's ability to manage financial strategies through a US$3.5 billion revolving credit agreement in March 2025 also provided financial resilience. Additionally, the company reinforced its leadership board, tapping industry veterans to guide its trajectory amid a fluctuating semiconductor market. However, facing a class-action lawsuit for alleged product demand misrepresentation, Micron must navigate these legal challenges while sustaining operational and shareholder credibility. Notably, despite its strong five-year returns, Micron underperformed the US Semiconductor industry, which saw a 1.2% gain in the past year. Unlock comprehensive insights into our analysis of Micron Technology stock in this financial health report. This article by Simply Wall St is general in nature. We provide commentary based on historical data and analyst forecasts only using an unbiased methodology and our articles are not intended to be financial advice. It does not constitute a recommendation to buy or sell any stock, and does not take account of your objectives, or your financial situation. We aim to bring you long-term focused analysis driven by fundamental data. Note that our analysis may not factor in the latest price-sensitive company announcements or qualitative material. Simply Wall St has no position in any stocks mentioned. Companies discussed in this article include NasdaqGS:MU. Have feedback on this article? Concerned about the content? with us directly. Alternatively, email editorial-team@
