24-04-2025
Toppan's Chip-Material Unit Tekscend Said to Plan IPO This Year
Japanese chip-material maker Tekscend Photomask Corp. is planning an initial public offering in Tokyo as soon as the second half of this year, according to people familiar with the matter.
Bank of America Corp., Nomura Holdings Inc. and SMBC Nikko Securities Inc. have been tapped to work on the potential listing, the people said, asking not to be identified because the information isn't public. More banks may be added, they said.
