Latest news with #Vertiv360AI
Techday NZ
2 days ago
- Business
- Techday NZ
Vertiv unveils 142kW AI data centre design for NVIDIA GB300
Vertiv has introduced a 142kW cooling and power reference architecture for the NVIDIA GB300 NVL72 platform, aiming to facilitate higher density and energy efficiency in data centres supporting advanced AI workloads. This new reference architecture is designed for customisation in bespoke data centre environments to reduce both planning times and risks associated with modern data centre buildouts. Vertiv's solutions are now available as SimReady 3D assets within the NVIDIA Omniverse Blueprint, supporting AI factory design and operations through digital simulation and validation. Reference architecture capabilities The architecture supports rack densities of up to 142 kW and offers integrated end-to-end cooling and power strategies for AI-driven data centre deployments. These capabilities address the increasing requirements of data centres as AI workloads become more prevalent and power consumption rises accordingly. Vertiv collaborates closely with NVIDIA on developing AI infrastructure strategies and designs that anticipate higher rack power densities. The company is developing support for 800 VDC data centre power infrastructure, including 1 MW IT racks and beyond, with these solutions anticipated to be available starting in 2026. The Vertiv 360AI infrastructure platform, under which the new reference architecture is based, aims to help customers meet the demands of powering and cooling AI workloads and other high-performance computing requirements. Simulation and deployment path One of the key aspects of Vertiv's solution is the emphasis on digital simulation to streamline deployment. Leveraging NVIDIA Omniverse technologies, the architecture bridges physical and digital environments, enabling real-time collaboration and allowing data centre teams to test and optimise their designs before construction. The reference architecture for the NVIDIA GB300 NVL72 has several highlighted benefits: it allows simulation to deployment in a unified workflow; it is built to support the increasing power and cooling needs of large-scale AI operations; and it promises accelerated performance, scale, and speed, claiming to deliver 1.5 times more AI performance, up to 50% faster on-site builds, and operation in 30% less physical space compared to traditional data centre builds. The system is also liquid cooling-ready and adaptable to air- and hybrid-cooled configurations, enabling up to a 70% improvement in annual energy efficiency by operating at higher water temperatures. Vertiv's global reach, with over 4,000 field service engineers, underpins its capability to support large-scale, international rollouts of the reference architecture for GB300 NVL72. Industry collaboration Vertiv's announcement reflects the ongoing collaboration between the companies as they seek to equip data centres to meet the evolving requirements of AI infrastructure. Dion Harris, Senior Director of HPC and AI Infrastructure at NVIDIA, provided additional detail: "By combining NVIDIA's advanced AI platforms with Vertiv's expertise in power and cooling infrastructure, we're enabling customers to deploy next-generation data centres that are more efficient, scalable, and ready for the most demanding AI workloads. Together, we're helping organisations unlock new levels of performance and sustainability as they build the future of AI." As AI-generated workloads continue to accelerate on a global scale, data centre providers and operators are seeking new infrastructure strategies to meet demand efficiently and with a view to sustainability. Vertiv's latest reference architecture, together with its SimReady assets, is positioned to enable deployment-ready designs that anticipate future industry requirements. The company continues to develop energy-efficient solutions for cooling and power delivery in response to the escalating computing needs of next-generation AI applications, focusing on digital optimisation and global serviceability across data centre deployments.
Channel Post MEA
03-06-2025
- Business
- Channel Post MEA
Vertiv Unveils Expanded Liquid Cooling Portfolio In EMEA
Vertiv has announced the expansion of the Vertiv CoolChip CDU (coolant distribution units) family with the launch of the Vertiv CoolChip CDU 70, Vertiv CoolChip CDU 100 and Vertiv CoolChip CDU 600 models in Europe, the Middle East and Africa (EMEA). These direct-to-chip (DTC) liquid cooling solutions enhance Vertiv's position as a leading innovator and enabler in AI and HPC infrastructure. The Vertiv CoolChip CDU 600 will be showcased for the first time in EMEA at the Vertiv booth at Datacloud Global Congress held this week in Cannes. 'As workloads continue to drive higher rack densities and cooling demands, customers need liquid cooling solutions that adapt to their unique deployment strategies, whether retrofitting an existing environment or scaling a new build,' said Sam Bainborough, vice president, EMEA thermal business at Vertiv. 'The Vertiv CoolChip CDU family offers flexible, scalable solutions that simplify deployment and support long-term growth. By reducing integration complexity and adapting to a range of data center environments, these CDUs help organizations scale liquid cooling more efficiently.' The new models are designed to suit retrofit or greenfield data center environments, with models including in-rack and row-based configurations, and liquid-to-air and liquid-to-liquid technologies. The innovative systems offer a flexible, scalable approach to address rising capacity demands while accelerating liquid cooling adoption. The Vertiv CoolChip CDU family is part of Vertiv's comprehensive liquid cooling offering and the broader Vertiv 360AI portfolio of power, cooling and services that solve the complex challenges of AI deployment. Backed by Vertiv Liquid Cooling Services, a global end-to-end offering that supports design, installation, commissioning, fluid management, and maintenance, the liquid cooling portfolio fits in a wide variety of scenarios ranging from retrofitting existing facilities to scaling high-density AI and HPC clusters in new builds. Vertiv CoolChip CDU 70 is an in-row, liquid-to-air coolant distribution unit that enables a fast, cost-effective entry into liquid cooling for data centers retrofitting existing environments or deploying new infrastructure. Designed to utilize existing thermal infrastructure, this liquid-to-air CDU is ideal for facilities looking to deploy liquid cooling capacity without requiring major infrastructure changes. The system delivers up to 70 kW of cooling capacity and is designed for agility and scalability, helping to reduce secondary fluid network complexity and infrastructure footprint. Its integrated controller supports real-time monitoring, group control and unit-to-unit communication, for coordinated thermal performance, simplified management, and efficient scaling across multiple racks. Vertiv CoolChip CDU 100 brings powerful liquid-to-liquid in-rack cooling performance, giving data centers a secure and space-efficient solution for high-density workloads. Ideal for operators to introduce or expand liquid cooling deployments one rack at a time, supporting incremental growth or AI pilot programs without the need for large-scale infrastructure changes. With 100 kW of cooling capacity in a 4U form factor and a large-surface heat exchanger engineered for low approach temperatures, Vertiv CoolChip CDU 100 enables optimal heat transfer. An integrated controller provides monitoring and control capabilities to streamline operations and enhance visibility. Built-in filtration and precise temperature control within ±1°C help maintain fluid quality and thermal stability, while the physical separation of facility and IT loops supports secure, efficient system management in mission-critical environments. Vertiv CoolChip CDU 600 is an in-row, liquid-to-liquid model delivering robust, scalable liquid cooling capacity for high-density AI and HPC deployments. The 600 kW system is designed to meet the demands of hyperscale and colocation environments, supporting in-row configurations and integrating easily into raised floor or retrofit installations. Its design, including top or bottom piping connections and available internal manifolds, streamlines infrastructure planning and speeds implementation. With redundant pumps, advanced monitoring for temperature and fluid quality, and a flexible approach to deployment, Vertiv CoolChip CDU 600 offers reliability, visibility, and performance for customers scaling liquid cooling across broader IT environments. 0 0
