Latest news with #thermalmanagement
Yahoo
3 days ago
- Business
- Yahoo
Intel experimenting with direct liquid cooling for up to 1000W CPUs
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel is testing a new way to tackle the growing heat output of its power hungry chips. At its recent Foundry Direct Connect event, the company showcased an experimental package-level water cooling solution designed to more efficiently cool CPUs . Intel has working prototypes for both LGA (Land Grid Array) and BGA (Ball Grid Array) CPUs, with demos using Intel's Core Ultra as well as Xeon server processors. The cooling solution doesn't apply coolant directly to the silicon die. Instead, a specially designed compact cooling block sits atop the package, featuring microchannels made of copper that precisely guide the coolant flow. These channels can be optimized to target specific hotspots on the die, potentially improving heat removal where it matters the most. Intel claims the system can dissipate up to 1,000 watts of heat using standard liquid cooling fluid. That kind of thermal load isn't typical for consumer CPUs, but it could be relevant for high-end AI (Artificial Intelligence) workloads, HPC (High Performance Computing), and workstation applications. Image 1 of 9 Image 2 of 9 Image 3 of 9 Image 4 of 9 Image 5 of 9 Image 6 of 9 Image 7 of 9 Image 8 of 9 Image 9 of 9 The cooling assembly is also said to make use of solder or liquid metal TIM (Thermal Interface Material), which is said to offer better contact than polymer based TIM. Compared to a traditional liquid cooler mounted to a delidded bare die, Intel says this solution can deliver 15–20% better thermal performance. Notably, Intel's approach isn't just a lab experiment. The company has reportedly been working on this technology for years. With rising thermal demands from modern chip designs, Intel is now exploring how to produce this system for real-world deployment. While Intel refines its prototype, the enthusiast community is already experimenting with similar concepts. YouTuber octppus recently modified the heatspreader of an Intel Core i9-14900KS, machining it into a functioning miniature water block. With internal channels carved into the IHS (Integrated Heat Spreader) and sealed under acrylic, the mod somewhat mirrors Intel's concept in DIY fashion. Intel hasn't confirmed when or if this cooling approach will hit mainstream products, but the demonstration is critical for CPU thermal design. As power consumption and package density increase, direct cooling may become a necessity for both professional and enthusiast hardware in the coming future. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
Yahoo
19-05-2025
- Business
- Yahoo
Ventiva to Demonstrate Air Cooling Innovation for PCs Up to 45W TDP at Computex 2025
TAIPEI, Taiwan, May 18, 2025--(BUSINESS WIRE)--Ventiva®, the leader in thermal solutions, today announced it will demonstrate its latest air-cooling innovation at Computex 2025: a 45W TDP (thermal design power) reference design suitable for high-performance, AI-enabled laptops. The reference design incorporates the company's ICE9™ thermal management system, which cools electronics devices without moving parts, noise, or vibration. "Ventiva technology is redefining what's possible in electronic design, with this demonstration of a Dell 45W TDP laptop showcasing how our silent, intelligent, thermal management solutions are ideally suited for high-performance, AI-enabled laptops," said Carl Schlachte, Chairman, President, and CEO, Ventiva. "Our ICE9 thermal management system delivers silent computing that speaks volumes, enabling our customers to unlock new levels of innovation in performance possibilities, while offering an entirely new approach to thermal management that enhances user experiences in unprecedented ways." Ventiva's ICE9 thermal management system is based on the company's patented Ionic Cooling Engine (ICE®) technology, which eliminates the need for mechanical fans. The system's enhanced intelligent software control allows the air-cooling solution to act as an advanced air quality detector, detecting and defeating dust and airborne contaminants to ensure optimal system performance in laptop computers and other electronic devices. The ultra-compact ICE9 solution enables laptop designs with a height of less than 12 mm, rivaling the thinnest laptops on the market today. Its space-efficient form factor not only supports sleek, thin designs but also provides original equipment manufacturers (OEMs) with the flexibility to integrate additional functionalities into their products. About ICE Technology Ventiva's patented ICE technology generates movement of air without any moving parts, noise, or vibration, leveraging the principles of electrohydrodynamic (EHD) flow to move ionized air molecules within an electric field. The ICE9 thermal management system offers a "smart" cooling solution that continuously monitors its operation, delivering more or less airflow as an electronic system requires. Combining advanced monitoring and algorithms, the ICE9 solution's real-time software can be combined with overall system performance monitoring to provide a robust, device-wide thermal solution. About Ventiva Ventiva, a leading company in active cooling solutions for electronic devices, enables thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company's patented ICE® technology is a pioneering all-electronic heat transfer technology created to address the thermal problems exacerbated by modern high-performance semiconductor design. Learn more at or follow us on LinkedIn. © 2025, Ventiva, Inc. All rights reserved. VENTIVA, ICE, and ICE9 are trademarks or registered trademarks of Ventiva. Inc., in the U.S. and other countries. All other trademarks are the property of their respective owners. View source version on Contacts Media Contact: Julie Sign in to access your portfolio
Yahoo
18-05-2025
- Business
- Yahoo
Ventiva Unveils Intelligent Air-Cooling Solution for Electronics that Delivers Up To 100 Watts
Company to demonstrate ICE9 innovation developed for new era of AI and discrete graphics at Computex 2025 TAIPEI, Taiwan, May 18, 2025--(BUSINESS WIRE)--Ventiva®, the leader in thermal solutions, today announced it will demonstrate a laptop thermal test vehicle (TTV) of its ICE9™ thermal management system, providing up to 100W thermal design power (TDP) for high-performance devices, at Computex 2025. With increased AI and graphics processing capabilities, laptops are shifting from traditional computing devices to powerful AI-driven machines that enhance productivity, creativity, and entertainment. To support these advanced high-performance capabilities, next-generation devices require greater processing power as well as heat transfer technology to keep them cool. However, traditional cooling solutions such as fans and vents have reached their limits in both performance and form factor adaptability. In addition, they create excessive noise and vibrations that can cause distractions for use cases such as gaming, video editing, or coding. Ventiva's ICE9 thermal management system uses the company's Ionic Cooling Engine (ICE®) technology to cool electronic devices without moving parts, noise, or vibration, enabling devices that are thin, silent, and totally cool. With the enhanced, intelligent system controller, the innovative air-cooling system is able to dynamically respond to the device environment, enabling it to identify and combat dust throughout a product's lifespan to prevent overheating and system degradation. "AI-driven laptops are transforming the way we work, create, and play, but their increasing thermal output requires a new level of device heat management," said Carl Schlachte, Chairman, President and CEO, Ventiva. "This is our highest-performing thermal management system to date, enabling laptop OEMs and ODMs to push power to the limit, and stay totally cool, under any workload, from 3D design to AI development to immersive game playing." About ICE Technology Ventiva's patented ICE technology generates movement of air without any moving parts, noise, or vibration, leveraging the principles of electrohydrodynamic (EHD) flow to move ionized air molecules within an electric field. The ICE9 thermal management suite offers an intelligent cooling solution that continuously monitors its operation, delivering more or less airflow as an electronic system requires. Combining advanced monitoring and algorithms, the ICE9 suite's real-time software can be combined with overall system performance monitoring to provide a robust, device-wide thermal solution. About Ventiva Ventiva, a leading company in active cooling solutions for electronic devices, enables thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company's patented ICE® technology is a pioneering all-electronic heat transfer technology created to address the thermal problems exacerbated by modern high-performance semiconductor design. Learn more at or follow us on LinkedIn. © 2025, Ventiva, Inc. All rights reserved. VENTIVA, ICE, and ICE9 are trademarks or registered trademarks of Ventiva. Inc., in the U.S. and other countries. All other trademarks are the property of their respective owners. View source version on Contacts Media Contact: Julie Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
18-05-2025
- Business
- Yahoo
Axiado and Posiflex Group Unveil AI-Enabled Secure Control and Management Solution for Intel Servers at COMPUTEX 2025
Live Computex Demo to Highlight AI-Driven Security, Power Efficiency, and Dynamic Thermal Management Intel Birch Stream and x86 Platforms TAIPEI, May 18, 2025 /PRNewswire/ -- COMPUTEX 2025 — Axiado Corporation, a leading AI-driven, hardware-anchored platform security solutions company, today announced a partnership with Posiflex Group to demonstrate a new Baseboard Management Controller (BMC) solution with integrated AI capabilities. The joint solution, built on Intel's Birch Stream server platform, will be showcased at COMPUTEX 2025 in the Posiflex Group booth TaiNEX 1F, Hall 2, Booth P0506 from May 20-23, 2025. The joint solution, co-developed by Portwell, Inc. and Kiosk Integrated Solutions, Inc., subsidiaries of the Posiflex Group, demonstrates how OpenBMC paired with Axiado's AI-enabled DC-SCM 2.0 module can meet rising demands for secure, intelligent, and remotely manageable infrastructure. "Axiado's AI-driven technologies provide robust computing security and energy-saving benefits in connectivity-centric environment," said Jackal Wu, Chief Technology Officer of Posiflex Group. "We're proud to collaborate on this AI BMC initiative, which not only integrates seamlessly with the Intel server platform but also leverages Posiflex's Remote Management System (RMS) to deliver secure, enterprise-grade remote management." This partnership brings together Axiado's Trusted Control/Compute Unit (TCU) technology with OpenBMC software and Posiflex's proprietary RMS, delivering an AI-enhanced platform security and control solution for x86-based servers. The integration delivers hardware-anchored protection, energy savings, and thermal efficiency, optimized for edge and enterprise deployments. "This collaboration marks Axiado's continued expansion into the Intel server ecosystem with a compelling, integrated AI BMC offering," said Gopi Sirineni, CEO of Axiado. "We've already demonstrated the value of our technology in hyperscale AI infrastructure, and this partnership brings the same security and sustainability benefits to broader server and networking markets." The demo at COMPUTEX will highlight key features including AI-enhanced anomaly detection, dynamic thermal management, and root-of-trust-based security integrated directly into the silicon. This solution targets a range of applications including AIoT, edge servers, kiosks, and commercial embedded systems. About AxiadoAxiado Corporation is an AI-driven platform security solutions company focused on protecting cloud data centers, 5G networks, and critical infrastructure against ransomware, supply chain, side-channel, and other cyberattacks. Axiado's Trusted Control/Compute Unit (TCU) delivers real-time, pre-emptive threat detection and platform security, while its Dynamic Thermal Management (DTM) solution reduces energy consumption and operational costs in data centers, advancing the goal of carbon-net zero emissions. For more information, visit or follow us on LinkedIn. About POSIFLEX GroupPosiflex Group is a global leading Commercial AIoT platform powered by smart Online-to-Offline (O2O) and Scenario-defined Embedded Appliance Solutions. Pillared by three brands, Posiflex Group consists of Posiflex as global top 5 brand in POS & Kiosk, Portwell as Embedded Foundry for AIoT Edge Compute, and KIOSK Information Systems (KIS) for managed self-service automation – together with a common mission to enable optimized productivity and superior customer journey across the connected world. For more information, go to or follow us on LinkedIn. View original content to download multimedia: SOURCE Axiado Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
18-05-2025
- Business
- Yahoo
Was Jim Cramer Right About Modine Manufacturing Company (MOD) Stock?
Back in 2024, on May 14, a caller asked about Modine Manufacturing Company (NYSE:MOD), an industrial company specializing in thermal management and HVAC systems. Cramer said this was exactly the kind of industrial stock that's working in the market back then: "Okay, that kind of metal-bending industrial company is precisely what's working here. And it's what we preach at the club. And that is a club-like name. Well, not club, I mean like the group of people. Not a club. But I like the concept." Cramer's endorsement had limited effect, as the stock declined slightly by 0.55% since the call. Modine Manufacturing Company (NYSE:MOD) engineers thermal management and HVAC solutions for vehicles, data centers, and commercial buildings. Earlier in March, Cramer mentioned that the stock was getting hit by a swarm of sellers: 'Yeah, I gotta tell you… people decided that that is part of the data center and the CFO sold a lot of stock so people are itching to get out. It has come down so much. I don't know what they're itching about.' While we acknowledge the potential of MOD to grow, our conviction lies in the belief that some AI stocks hold greater promise for delivering higher returns and have limited downside risk. If you are looking for an AI stock that is more promising than MOD and that has 100x upside potential, check out our report about this cheapest AI stock. READ NEXT: 20 Best AI Stocks To Buy Now and 30 Best Stocks to Buy Now According to Billionaires. Disclosure: None.
