NIA raids hideouts of banned outfit Hizb-ut-Tahrir in Madhya Pradesh, Rajasthan
According to the agency, the raids were conducted as part of its efforts to destroy various terror modules that are involved in the conspiracy to radicalise and recruit vulnerable Muslim youths. Further investigations by the agency are presently on in this case. Last week, the NIA also conducted several raids across various locations in the Kashmir valley as part of its investigation against terror conspiracy by Pakistan-backed terrorist organisations and their offshoots. A total of thirty-two locations were raided as part of the crackdown. The locations included residences of terrorists and overground workers associated with Pakistan-based terror outfits such as The Resistance Front (TRF), United Liberation Front, Jammu & Kashmir (ULFJ&K), Mujahideen Gazwat-ul-Hind (MGH), Jammu & Kashmir Freedom Fighters (JKFF), Kashmir Tigers, PAAF and others, which are affiliated to proscribed terrorist organisations such as Laskar-e-Toiba (LeT), Jaish-e-Mohammed (JeM), Al- Badr and others.Must Watch
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NIA chargesheets four accused in 2024 Champaran fake currency seizure case
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Economic Times
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BJD senior vice-president Debi Prasad Mishra at a press conference here, expressed confidence that the state government will take proactive steps to develop the required supporting ecosystem for these units within the stipulated in the day, the Union Cabinet, chaired by Prime Minister Narendra Modi, approved four more semiconductor projects under India Semiconductor Mission (ISM), two of which will come to Odisha and one each for Punjab and Andhra Pradesh. After the Union Cabinet meeting, Vaishnaw said that a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem. "Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc," Vaishnaw said. 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The plant will be set up by Heterogenous Integration Packaging Solutions Pvt Ltd with an annual production capacity of 5 crore units."I sincerely express my gratitude to Hon'ble Prime Minister Shri @narendramodi ji and Hon'ble Union Minister Shri @AshwiniVaishnaw ji for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha," Majhi said in a post on chief minister said the recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness, and sustainability, together with this significant Cabinet approval, marks a major milestone in the state's industrial and technological advancement."This collaborative effort will accelerate innovation, generate employment, and strengthen Odisha's position as a vital contributor towards the vision of #AtmanirbharBharat. I look forward to continued partnership between the state and Central governments to further this strategic initiative for the comprehensive development of Odisha and the nation. #doubleengine," Majhi Private Limited is collaborating with Clas-SiC Wafer Fab Ltd, UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, an official statement said.3D Glass Solutions Inc (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring the world's most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry, the statement facility will have a large variety of advanced technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics and leader Mishra said the process of setting up semiconductor units in Odisha was initiated under the leadership of former Chief Minister Naveen Patnaik during the BJD government. 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