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Vivo Y400 5G India launch: Check expected specifications, features & price here

Vivo Y400 5G India launch: Check expected specifications, features & price here

Time of India04-08-2025
Vivo will launch the Vivo Y400 5G in India on Monday. The phone will come in Glam White and Olive Green colours. It may feature a 6.67-inch AMOLED display and a dual camera setup. The device could have a Snapdragon 4 Gen 2 processor. It is expected to run on Funtouch OS 15 based on Android 15.
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Vivo Y400 5G confirmed details
Vivo Y400 5G rumored specs:
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Vivo Y400 5G expected price:
Vivo is set to launch its mid-range Vivo Y400 5G smartphone in India on Monday. This comes after the phone-maker launched the Y400 Pro in India last month, which started at a price of Rs 24,999.Vivo has confirmed that the Y400 5G will come in two colours, including Glam White and Olive Green. The teaser images by Vivo reveal a similar design to the Y400 Pro, with a curved back, vertical camera layout and what seems like a dual camera setup.Ahead of the much anticipated launch, tipster Sudhanshu Ambhore shared a few leaks about the gadget. According to the leak, the Vivo Y400 5G could have a 6.67-inch AMOLED display with a resolution of 2400 x 1080 pixels and a 120Hz refresh rate. The phone could have a peak brightness of 1800 nits.It might also get get a dual camera setup with a 50MP Sony IMX852 primary shooter and a 2MP bokeh sensor to make up the numbers. On the front, it could feature a 32MP shooter for selfies and video calls.The device could be equipped with Snapdragon 4 Gen 2 processor, which is the same SoC previously seen on budget phones like the Poco M7 and the recently launched Lava Blaze Dragon. The phone could come in two storage variants, including 8GB RAM/128GB storage and 8GB RAM/256GB storage.Vivo Y400 5G could also have a bigger battery compared to the Y400 Pro, with the former tipped to get a 6,000mAh setup with support for 90W wired fast charging.Similar to other Vivo phones launched this year, the Y400 5G is expected to run on Funtouch OS 15 based on Android 15.The tipster does not go into specifics for each variant but states that the phone is likely to be priced under ₹25,000 in India.The tipster stated that 8GB RAM/128GB storage variant of the Y400 5G could be priced at Rs 21,999 while the 8GB RAM/256GB storage variant could be priced at Rs 23,999.These are not the confirmed prices and the wait for the official announcement continues. .
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Centre approves two semiconductor units for Odisha
Centre approves two semiconductor units for Odisha

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Centre approves two semiconductor units for Odisha

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The minister said that the plant will have a capacity to produce 9.6 crore chips per Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. 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Centre approves two semiconductor units for Odisha
Centre approves two semiconductor units for Odisha

Time of India

time17 minutes ago

  • Time of India

Centre approves two semiconductor units for Odisha

Chief Minister Mohan Charan Majhi on Tuesday said the Union Cabinet 's approval for the establishment of two semiconductor units in Odisha will accelerate the state's growth in the CM expressed his gratitude to Prime Minister Narendra Modi and Union minister Ashwini Vaishnaw for the Centre's approval of the two semiconductor units in BJD, which had announced the Odisha Semiconductor Manufacturing and Fabless Policy 2023, said: "While other states were only announcing semiconductor units in 2024, the decision by the Union Cabinet to approve two such units in Odisha today is truly commendable."BJD senior vice-president Debi Prasad Mishra at a press conference here, expressed confidence that the state government will take proactive steps to develop the required supporting ecosystem for these units within the stipulated in the day, the Union Cabinet, chaired by Prime Minister Narendra Modi, approved four more semiconductor projects under India Semiconductor Mission (ISM), two of which will come to Odisha and one each for Punjab and Andhra the Union Cabinet meeting, Vaishnaw said that a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem. Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc," Vaishnaw minister said that the plant will have a capacity to produce 9.6 crore chips per Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Pvt Ltd with an annual production capacity of 5 crore units."I sincerely express my gratitude to Hon'ble Prime Minister Shri @narendramodi ji and Hon'ble Union Minister Shri @AshwiniVaishnaw ji for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha," Majhi said in a post on chief minister said the recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness, and sustainability, together with this significant Cabinet approval, marks a major milestone in the state's industrial and technological advancement."This collaborative effort will accelerate innovation, generate employment, and strengthen Odisha's position as a vital contributor towards the vision of #AtmanirbharBharat. I look forward to continued partnership between the state and Central governments to further this strategic initiative for the comprehensive development of Odisha and the nation. #doubleengine," Majhi Private Limited is collaborating with Clas-SiC Wafer Fab Ltd, UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, an official statement said.3D Glass Solutions Inc (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring the world's most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry, the statement facility will have a large variety of advanced technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics and leader Mishra said the process of setting up semiconductor units in Odisha was initiated under the leadership of former Chief Minister Naveen Patnaik during the BJD government. "The recent decision by the Union Cabinet to establish two semiconductor units in Odisha is rooted in the initiatives undertaken during the BJD regime," he said that investors interested in establishing a semiconductor industry in the state was cultivated during the 2nd edition of the Make in Odisha conclave held in December 2022, where several proposals were received. Accordingly, a dedicated policy for the semiconductor sector and its supporting ecosystem was formulated in 2023, he BJD leader said that discussions were held with multiple international investors to attract investment in this sector, and efforts began to establish the necessary ecosystem to develop Odisha as a cutting-edge electronics manufacturing hub.

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