MaxLinear's Web-Smart 2.5G Ethernet Switch SoCs Power HiSource Smart PoE Switches
Integrated CPUs in the SoCs enable Ethernet switches with web-smart applications that improve network management and optimization
CARLSBAD, Calif., May 14, 2025--(BUSINESS WIRE)--MaxLinear, Inc. (Nasdaq: MXL) a global leader in wired network solutions, today announced that HiSource, a leading supplier of PoE switches, has selected the MxL86252S and MxL86282S Web-Smart 2.5G Ethernet Switch SoCs for its next generation PoE Ethernet switches that include smart features for network management and optimization. MaxLinear will demonstrate the MxL86282S at Computex 2025, May 20-23, 2025 in Taipei, Taiwan.
Smart Ethernet switches simplify network management with user-friendly web interfaces and remote access, allowing administrators to easily configure and monitor network settings. Switch designers utilize the on-board processor in the MxL86282S to power these added smart features.
"We've integrated CPUs into our 2.5G Ethernet switches to empower our partners to develop smart Ethernet switches with enhanced performance and advanced features sets," said Vikas Choudhary, Vice President of Connectivity and Storage business at MaxLinear. "By handling data processing tasks directly within the switch, we reduce latency and improve overall network performance."
"We've incorporated MaxLinear's Web-Smart 2.5G Ethernet Switch SoCs into our next-generation PoE switches," said Jack Mao, Chief Executive Officer at HiSource. "The integrated CPUs, 2.5G PHYs, and advanced features of these SoCs allow us to provide our customers with high-performance, reliable, and easy-to-manage networking solutions."
MxL86282S Key Features and Benefits:
Highly Integrated: Eight integrated Ethernet 2.5GBASE-T PHYs that support four data rates: 2500, 1000, 100, and 10Mbps. Two optional 10G SERDES uplink ports that provide additional flexibility for network configurations. And one integrated CPU to enable web-smart applications.
Low Power Consumption: Under 700mW per PHY. Supports the Energy-Efficient Ethernet (EEE) feature to reduce idle mode power consumption. Offers additional power savings modes for short cables, through EEE, and no-link detection. Power saving at the system level is also possible with the wake-on-LAN (WoL) feature.
Switching Performance: Unblocking wire-speed switching between all ports to support all ports at full rate without packet loss.
Future-Proof Features: A programmable packet parser and a powerful classification engine allow future-proof designs that enable various data traffic types. The MxL86282S supports IPv4 and IPv6, HTTPS security, IGMPv1/IGMPv2/IGMPv3 multicast forwarding, and MLDv1/MLDv2 snooping.
Advanced Features: Include: VLAN, QinQ, QoS, loop detection, ACL, and traffic shaping.
The MxL86282S and MxL86252S are available now in RoHS compliant, green/halogen free 12mm x 12mm BGA packages. Visit MxL86252S and MxL86282S for additional information or to request samples.
For more information on MaxLinear's Ethernet switches:
1G Ethernet PHYs, visit https://www.maxlinear.com/Ethernet-PHY
1G Ethernet Switches, visit: https://www.maxlinear.com/Eth-switches
2.5G Ethernet PHYs, visit: https://www.maxlinear.com/ethernet-switches
About MaxLinear, Inc.
MaxLinear, Inc. (Nasdaq: MXL) is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. For more information, please visit https://www.maxlinear.com/.
Cautionary Note About Forward-Looking Statements
This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Forward-looking statements include, among others, statements concerning or implying future financial performance, statements relating to MaxLinear's ethernet switch products and the functionality, performance, benefits, and market opportunity for such products, statements by our Vice President of Connectivity and Storage business and statements by the Chief Executive Officer of HiSource. These forward-looking statements involve known and unknown risks, uncertainties, and other factors that may cause actual results to be materially different from any future results expressed or implied by the forward-looking statements and our future financial performance and operating results forecasts generally. Forward-looking statements are based on management's current, preliminary expectations and are subject to various risks and uncertainties. In particular, our future operating results are substantially dependent on our assumptions about market trends and conditions. Additional risks and uncertainties affecting our business, future operating results and financial condition include, without limitation; risks relating to the development, testing, and commercial introduction of new products and product functionalities; risks relating to our relationship with HiSource; risks relating to our terminated merger with Silicon Motion and related arbitration and class action complaint and the risks related to potential payment of damages; the effect of intense and increasing competition; increased tariffs, export controls or imposition of other trade barriers; impacts of global economic conditions; the cyclical nature of the semiconductor industry; a significant variance in our operating results and impact on volatility in our stock price, and our ability to sustain our current level of revenue, which has previously declined, and/or manage future growth effectively, and the impact of excess inventory in the channel on our customers' expected demand for certain of our products and on our revenue; escalating trade wars, military conflicts and other geopolitical and economic tensions among the countries in which we conduct business; our ability to obtain or retain government authorization to export certain of our products or technology; risks related to the loss of, or a significant reduction in orders from major customers; costs of legal proceedings or potential violations of regulations; information technology failures; a decrease in the average selling prices of our products; failure to penetrate new applications and markets; development delays and consolidation trends in our industry; inability to make substantial research and development investments; delays or expenses caused by undetected defects or bugs in our products; substantial quarterly and annual fluctuations in our revenue and operating results; failure to timely develop and introduce new or enhanced products; order and shipment uncertainties; failure to accurately predict our future revenue and appropriately budget expenses; lengthy and expensive customer qualification processes; customer product plan cancellations; failure to maintain compliance with government regulations; failure to attract and retain qualified personnel; any adverse impact of rising interest rates on us, our customers, and our distributors and related demand; risks related to compliance with privacy, data protection and cybersecurity laws and regulations; risks related to conforming our products to industry standards; risks related to business acquisitions and investments; claims of intellectual property infringement; our ability to protect our intellectual property; risks related to security vulnerabilities of our products; use of open source software in our products; and failure to manage our relationships with, or negative impacts from, third parties.
In addition to these risks and uncertainties, investors should review the risks and uncertainties contained in our filings with the Securities and Exchange Commission, including our Current Reports on Form 8-K, as well as the information to be set forth under the caption "Risk Factors" in MaxLinear's Quarterly Report on Form 10-Q for the quarter ended March 31, 2025. All forward-looking statements are based on the estimates, projections and assumptions of management as of the date of this press release, and MaxLinear is under no obligation (and expressly disclaims any such obligation) to update or revise any forward-looking statements whether as a result of new information, future events, or otherwise.
View source version on businesswire.com: https://www.businesswire.com/news/home/20250514330628/en/
Contacts
MaxLinear, Inc. Press Contact: Debbie BrandenburgSr. Marketing Communications ManagerTel: +1 669.265.6083dbrandenburg@maxlinear.com
Hashtags
Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles
Forbes
an hour ago
- Forbes
Has Apple Just Accidentally Leaked A Major Upgrade For iPhone 17?
A regulatory filing has just happened which, it's claimed, is for two iPhone MagSafe chargers, suggesting that a faster-than-ever wireless charging capability could be coming to the iPhone 17 series when it's announced this fall. Will MagSafe charging be super-fast on the iPhone 17 series? Taiwan's National Communications Commission website shows two MagSafe chargers which Apple has never announced, sighted by 91mobiles. That seems to be the case because, 'Current MagSafe chargers are compatible with Qi 2 and the original Qi standard. While WPC (Wireless Power Consortium), the body behind Qi, incorporated MagSafe's magnetic accessory support into the Qi standard and introduced Qi 2.1, Apple didn't announce a product with that standard. Apple appears to have leapfrogged to Qi 2.2,' the report said. The site shows images of the chargers and says the model numbers are A3502 and A3503, looking the same but for one having a 1-meter cable, and the other a 2-meter one. The cables are braided, by the way, as the photos clearly show. Why does any of this matter? Qi 2.2 supports maximum output to 50W and, ccording to the report, it looks like the chargers will support up to 45W charging, when connected to the right wall adaptor. Right now, the most powerful MagSafe wireless charging for the latest iPhone 16 is 25W. More than that, another benefit for Qi 2.2 it's more efficient, with less power loss or heat generation. Plus, the magnetic alignment 'should ensure the device snaps into the charger quickly and properly,' the report said. Since the iPhone 17 Air looks like having a smaller battery than other iPhones, to accommodate its super-thin design, fast, efficient charging without unnecessary heat, could be important, especially if it meant that a super-quick top-up could juice your phone for hours. It looks like the chargers have been tested both with the iPhone 16 and iPhone 11. This wouldn't mean faster charging rates on older phones, but the efficiency element would still be key.
Yahoo
8 hours ago
- Yahoo
Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan. TSMC, which produces more than 90% of the world's advanced semiconductor chips that power everything from smartphones and artificial intelligence (AI) applications to weapons, will build two new advanced packaging facilities in Arizona, among others. Here's everything you need to know about advanced packaging technology, which has seen exponential demand growth along with the global AI frenzy, and what that means for the struggle between the US and China for AI dominance. While the two countries have announced a temporary truce that rolled back disruptive three-digit tariffs for 90 days, the relationship remains tense because of ongoing feuding over chip restrictions imposed by the US and other issues. Last month at Computex, an annual trade show in Taipei that has been thrust under the limelight because of the AI boom, the CEO of chipmaker Nvidia, Jensen Huang, told reporters that 'the importance of advanced packaging for AI is very high,' proclaiming that 'no one has pushed advanced packaging harder than me.' Packaging generally refers to one of the manufacturing processes of semiconductor chips, which means sealing a chip inside a protective casing and mounting it to the motherboard that goes into an electronic device. Advanced packaging, specifically, refers to techniques that allow more chips — such as graphic processing units (GPU), central processing units (CPU) or high bandwidth memory (HBM) — to be placed closer together, leading to better overall performance, faster transmission of data and lower energy consumption. Think of these chips as different departments within a company. The closer these departments are to each other, the easier it is, and less time it takes, for people to travel between them and exchange ideas, and the more efficient the operation becomes. 'You're trying to put the chips as close together as possible, and you're also putting in different solutions to make the connection between the chips very easy,' Dan Nystedt, vice president of Asia-based private investment firm TrioOrient, told CNN. In a way, advanced packaging keeps afloat Moore's Law, the idea that the number of transistors on microchips would double every two years, as breakthroughs in the chip fabrication process become increasingly costly and more difficult. While there are many types of advanced packaging technologies, CoWoS, short for Chips-on-Wafer-on-Substrate and invented by TSMC, is arguably the best known that was thrown under the limelight since the debut of OpenAI's ChatGPT, which sparked the AI frenzy. It has even become a household name in Taiwan, prompting Lisa Su, CEO of Advanced Micro Devices (AMD), to say that the island is the 'only place that you can say CoWoS and everybody would understand.' Advanced packaging has become a big deal in the tech world because it ensures AI applications, which require a lot of complex computing, run without delays or glitches. CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. 'You could call it the Nvidia packaging process if you want to. Almost anyone making AI chips is using the CoWoS process,' said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity. In a visit to Taiwan in January, Huang told reporters that the amount of advanced packaging capacity currently available was 'probably four times' what it was less than two years ago. 'The technology of packaging is very important to the future of computing,' he said. 'We now need to have very complicated advanced packaging to put many chips together into one giant chip.' If advanced fabrication is one piece of the puzzle in terms of chip manufacturing, advanced packaging is another. Analysts say having both pieces of that jigsaw in Arizona means the US will have a 'one-stop shop' for chip production and a strengthened position for its AI arsenal, benefitting Apple, Nvidia, AMD, Qualcomm and Broadcom, some of TSMC's top clients. 'It ensures that the US has a complete supply chain from advanced manufacturing to advanced packaging, which would benefit the US' competitiveness in AI chips,' Eric Chen, an analyst with market research firm Digitimes Research, told CNN. Because advanced packaging technologies key to AI are currently only produced in Taiwan, having it in Arizona also reduces potential supply chain risks. 'Instead of having all eggs in one basket, CoWoS would be in Taiwan and also the US, and that makes you feel more safe and secure,' said Nystedt. While CoWoS got its moment recently, the technology has actually existed for at least 15 years. It was the brainchild of a team of engineers led by Chiang Shang-yi, who served two stints at TSMC and retired from the company as its co-chief operating officer. Chiang first proposed developing the technology in 2009 in an attempt to fit more transistors into chips and solve bottlenecks in performance. But when it was developed, few companies took up the technology because of the high cost associated with it. 'I only had one customer … I really became a joke (in the company), and there was so much pressure on me,' he recalled in a 2022 oral history project recorded for the Computer History Museum in Mountain View, California. But the AI boom turned CoWoS around, making it one of the most popular technologies. 'The result was beyond our original expectation,' Chiang said. In the global semiconductor supply chain, companies that specialize in packaging and testing services are referred to as outsourced semiconductor assembly and test (OSAT) firms. In addition to TSMC, South Korea's Samsung and America's Intel, as well as OSAT firms including China's JCET Group, America's Amkor and Taiwan's ASE Group and SPIL are all key players in advanced packaging technologies.
Yahoo
9 hours ago
- Yahoo
Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan. TSMC, which produces more than 90% of the world's advanced semiconductor chips that power everything from smartphones and artificial intelligence (AI) applications to weapons, will build two new advanced packaging facilities in Arizona, among others. Here's everything you need to know about advanced packaging technology, which has seen exponential demand growth along with the global AI frenzy, and what that means for the struggle between the US and China for AI dominance. While the two countries have announced a temporary truce that rolled back disruptive three-digit tariffs for 90 days, the relationship remains tense because of ongoing feuding over chip restrictions imposed by the US and other issues. Last month at Computex, an annual trade show in Taipei that has been thrust under the limelight because of the AI boom, the CEO of chipmaker Nvidia, Jensen Huang, told reporters that 'the importance of advanced packaging for AI is very high,' proclaiming that 'no one has pushed advanced packaging harder than me.' Packaging generally refers to one of the manufacturing processes of semiconductor chips, which means sealing a chip inside a protective casing and mounting it to the motherboard that goes into an electronic device. Advanced packaging, specifically, refers to techniques that allow more chips — such as graphic processing units (GPU), central processing units (CPU) or high bandwidth memory (HBM) — to be placed closer together, leading to better overall performance, faster transmission of data and lower energy consumption. Think of these chips as different departments within a company. The closer these departments are to each other, the easier it is, and less time it takes, for people to travel between them and exchange ideas, and the more efficient the operation becomes. 'You're trying to put the chips as close together as possible, and you're also putting in different solutions to make the connection between the chips very easy,' Dan Nystedt, vice president of Asia-based private investment firm TrioOrient, told CNN. In a way, advanced packaging keeps afloat Moore's Law, the idea that the number of transistors on microchips would double every two years, as breakthroughs in the chip fabrication process become increasingly costly and more difficult. While there are many types of advanced packaging technologies, CoWoS, short for Chips-on-Wafer-on-Substrate and invented by TSMC, is arguably the best known that was thrown under the limelight since the debut of OpenAI's ChatGPT, which sparked the AI frenzy. It has even become a household name in Taiwan, prompting Lisa Su, CEO of Advanced Micro Devices (AMD), to say that the island is the 'only place that you can say CoWoS and everybody would understand.' Advanced packaging has become a big deal in the tech world because it ensures AI applications, which require a lot of complex computing, run without delays or glitches. CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. 'You could call it the Nvidia packaging process if you want to. Almost anyone making AI chips is using the CoWoS process,' said Nystedt. That is why demand for CoWoS technology has skyrocketed. As a result, TSMC is scrambling to ramp up production capacity. In a visit to Taiwan in January, Huang told reporters that the amount of advanced packaging capacity currently available was 'probably four times' what it was less than two years ago. 'The technology of packaging is very important to the future of computing,' he said. 'We now need to have very complicated advanced packaging to put many chips together into one giant chip.' If advanced fabrication is one piece of the puzzle in terms of chip manufacturing, advanced packaging is another. Analysts say having both pieces of that jigsaw in Arizona means the US will have a 'one-stop shop' for chip production and a strengthened position for its AI arsenal, benefitting Apple, Nvidia, AMD, Qualcomm and Broadcom, some of TSMC's top clients. 'It ensures that the US has a complete supply chain from advanced manufacturing to advanced packaging, which would benefit the US' competitiveness in AI chips,' Eric Chen, an analyst with market research firm Digitimes Research, told CNN. Because advanced packaging technologies key to AI are currently only produced in Taiwan, having it in Arizona also reduces potential supply chain risks. 'Instead of having all eggs in one basket, CoWoS would be in Taiwan and also the US, and that makes you feel more safe and secure,' said Nystedt. While CoWoS got its moment recently, the technology has actually existed for at least 15 years. It was the brainchild of a team of engineers led by Chiang Shang-yi, who served two stints at TSMC and retired from the company as its co-chief operating officer. Chiang first proposed developing the technology in 2009 in an attempt to fit more transistors into chips and solve bottlenecks in performance. But when it was developed, few companies took up the technology because of the high cost associated with it. 'I only had one customer … I really became a joke (in the company), and there was so much pressure on me,' he recalled in a 2022 oral history project recorded for the Computer History Museum in Mountain View, California. But the AI boom turned CoWoS around, making it one of the most popular technologies. 'The result was beyond our original expectation,' Chiang said. In the global semiconductor supply chain, companies that specialize in packaging and testing services are referred to as outsourced semiconductor assembly and test (OSAT) firms. In addition to TSMC, South Korea's Samsung and America's Intel, as well as OSAT firms including China's JCET Group, America's Amkor and Taiwan's ASE Group and SPIL are all key players in advanced packaging technologies. Error while retrieving data Sign in to access your portfolio Error while retrieving data Error while retrieving data Error while retrieving data Error while retrieving data
