logo
West Central Railway introduces optical fibre-enabled signal control technology at Nishatpura yard

West Central Railway introduces optical fibre-enabled signal control technology at Nishatpura yard

Business Mayor11-05-2025

Bhopal: In a significant move towards modernity and safety, West Central Railway's Bhopal division has introduced a state-of-the-art signal control technology based entirely on optical fibre operation at its Nishatpura yard, replacing the traditional wiring system, officials said on Sunday. 'This first-of-its-kind cutting-edge technology will play a key role in making Indian Railways safer and more technologically advanced in the coming years,' WCR's Bhopal division's PRO Naval Agrawal told PTI. Senior Divisional Commercial Manager Saurabh Kataria said that this advanced technology has recently been commissioned on two signal posts at Nishatpura yard.
A phased roll-out has already begun on the Bhopal-Bina railway section. As per current plans, the entire section is expected to be upgraded with this new system by June 2026.
Agrawal said that until now, signal control systems used conventional multi-wire mechanisms, which were prone to delays and occasional malfunctions.
The newly introduced system uses optical fibre cables, ensuring faster, more secure, and highly reliable signal transmission compared to traditional methods, he added.
The core of this upgrade is the 'Lamp Output Module' (LOM)- a device that sends signal commands directly from the control room to the signal posts through optical fibre, he said. With this new method, signals along the railway track are controlled directly through fibre lines instead of conventional wiring, the PRO added. 'No bulky wiring is required as all communication will happen through fibre optics, ensuring smooth and uninterrupted signal operations,' he said, adding that signals cannot go blank under the modern system.
Even if one component fails, the signal remains visible to trains. Additionally, trains will run more safely and punctually, Agrawal said.
The system includes an automatic cooling fan that activates when needed to prevent over-heating of equipment, he added.
In the event of the failure of a fibre line, a backup line takes over instantly, ensuring uninterrupted service, the railway officer explained.
This system makes maintenance easier and is cost-effective due to minimal hardware and streamlined setup.
READ SOURCE

Orange background

Try Our AI Features

Explore what Daily8 AI can do for you:

Comments

No comments yet...

Related Articles

Nordson Electronics Solutions为Powertech Technology, Inc.开发面板级封装方案,半导体制造中底部填充良率超99%
Nordson Electronics Solutions为Powertech Technology, Inc.开发面板级封装方案,半导体制造中底部填充良率超99%

Business Wire

time13 hours ago

  • Business Wire

Nordson Electronics Solutions为Powertech Technology, Inc.开发面板级封装方案,半导体制造中底部填充良率超99%

加州卡尔斯巴德--(BUSINESS WIRE)--(美国商业资讯)-- 可靠电子制造技术领域的全球领导者 Nordson Electronics Solutions 为半导体制造中的面板级封装(PLP)开发了多项解决方案。在 一个具体案例 中,Nordson客户 Powertech Technology, Inc. (PTI) 在计划从晶圆制造转向面板制造的过程中,底部填充良率提升至99%以上。如需了解有关2024年底至2025年开发的该解决方案的详情,请在此处下载案例研究: 客户成功案例:Powertech Technology Inc. (PTI)与Nordson携手推进面板级封装 。 作为全球顶尖的半导体封装测试外包(OSAT)企业之一,PTI与Nordson应用团队合作,搭建了全面的PLP演示方案。该方案采用行业领先的ASYMTEK Vantage®系列 流体点胶系统(配备ASYMTEK IntelliJet®喷射系统 ),成规模地实现了高质量、无空洞的底部填充效果。Nordson的精密技术不仅缓解了翘曲问题、优化了流体流动,还将循环时间缩短了近30%。 随着半导体行业从300毫米晶圆向面板转型,PLP提供了解决方案,既能应对更大芯片尺寸和更高密度设计带来的复杂性,又能同时保持可制造性和成本效益。PTI正推动PLP应用的发展,这些应用旨在满足半导体行业不断增长的需求,以服务于AI、高性能计算(HPC)和基于小芯片的架构。 自20世纪90年代倒装芯片技术普及以来,底部填充在 半导体封装 中一直至关重要。随着应用需求愈发严苛(尤其是高性能CPU、GPU及倒装芯片和2.5D/3D IC等先进架构),底部填充对于增强机械可靠性和热性能的重要性与日俱增。从行业发展之初,随着应用场景从印刷电路板、基板、晶圆发展到如今的面板,Nordson始终致力于底部填充工艺的创新研发。 Nordson的分销商Jetinn Global Equipment Ltd.通过投资演示设备并提供专业技术支持,为本案研究中讨论的技术进展提供了支持。 关于Nordson Electronics Solutions Nordson Electronics Solutions 使可靠的电子产品成为现实。我们通过ASYMTEK、MARCH和SELECT品牌,为全球半导体、电子和精密装配制造商提供其产品所需的创新 流体点胶 、 保形涂覆 、 等离子处理 和 选择性焊接 解决方案,从而保护敏感电子元件,并提供可靠的使用寿命。40多年来,我们日复一日、年复一年地在全球提供卓越的工程设计和应用,帮助客户取得成功。 关于Nordson Corporation Nordson Corporation(NASDAQ: NDSN)是一家创新型精密技术公司,通过以部门为主导的创业型组织,利用可扩展的增长框架,实现一流的增长和领先的利润与回报。公司的直销模式和应用专长通过各种关键应用为全球客户提供服务。公司的多样化终端市场包括非耐用消费品、医疗、电子和工业终端市场。公司成立于1954年,总部位于俄亥俄州韦斯特莱克,在全球超过35个国家设有运营和支持办事处。访问Nordson网站 。 免责声明:本公告之原文版本乃官方授权版本。译文仅供方便了解之用,烦请参照原文,原文版本乃唯一具法律效力之版本。

Startup plane maker says it will create 14,500 jobs in North Carolina
Startup plane maker says it will create 14,500 jobs in North Carolina

Axios

time21 hours ago

  • Axios

Startup plane maker says it will create 14,500 jobs in North Carolina

Aircraft maker JetZero, a startup trying to build a more sustainable commercial airplane, is pledging to create 14,500 jobs and manufacture its planes in North Carolina. Why it matters: It is the largest economic development win in the state's history, if the jobs come to fruition as planned near Greensboro's Piedmont Triad International Airport (PTI). Driving the news: On Thursday morning in Raleigh, the state's Economic Investment Committee approved an incentives package for JetZero worth around $1 billion. The Greensboro area was competing against 25 other sites across the country, according to the state's Commerce Department. North Carolina has been working to recruit the company for more than a year, including a final phone call between N.C. Gov. Josh Stein and JetZero CEO Tom O'Leary in the past few weeks. By the numbers: The jobs, which are expected to be added between 2027 and 2037, would pay a minimum average wage of $89,000. JetZero plans to invest $4.7 billion into the site, in return for state and local incentives. Guildford County and Greensboro will put $784 million in incentives toward the project, according to the Commerce Department. The state's contribution, under a transformative-level Job Development Investment Grant, would be $1 billion over 37 years, and it is anticipated the state's General Assembly would appropriate another $450 million toward site preparation and road improvements. JetZero would only earn the incentives if the company maintains 10,000 workers and invests $3.8 billion locally. PTI would maintain ownership of the land that the state is doing site preparation work on, according to N.C. Commerce Secretary Lee Lilley. Zoom in: California-based JetZero has designed a blended-wing-body airframe that it expects to be up to 50% more fuel efficient than today's tube-and-wing aircraft, a huge advantage for airlines seeking to decarbonize their operations, Axios previously reported. The company has attracted investments from several big players in the industry, including Delta and United Airlines, and has said it hopes to begin flying in 2027. The U.S. Air Force is also investing $235 million into JetZero, and Lee said the state had extensive conversations with the Air Force while vetting the company. State of play: Greensboro's PTI airport has become a hotspot for aviation manufacturers. It's already home to HondaJet and another startup, Boom Supersonic, is building a factory there. The jobs in Greensboro would include manufacturing roles to research and development positions, according to Lilley. The Greensboro factory would focus on the body of the planes, while Pratt & Whitney would manufacture the engines. Under the agreement with the state, JetZero would begin hiring in 2027 and reach 14,500 jobs by 2037. Between the lines: Some of North Carolina's largest economic development wins in recent years have come from startups seeking to disrupt established industries. That includes Boom, a company trying to resurrect supersonic travel that makes its planes in Greensboro, and VinFast, a Vietnamese electric vehicle startup whose plans to hire 7,500 in Chatham County have been delayed several times already. VinFast was the previous largest economic development announcement in the state's history.

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing
Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing

Yahoo

time2 days ago

  • Yahoo

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. CARLSBAD, Calif., June 11, 2025--(BUSINESS WIRE)--Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson's customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson. PTI, one of the world's top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson's precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%. PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry's growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures. Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications. Nordson's distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support. About Nordson Electronics Solutions Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed. About Nordson Corporation Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company's direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at View source version on Contacts For information:MAIN OFFICE:Roberta Foster-SmithNordson Electronics Solutions2762 Loker Ave WestCarlsbad, CA, USA 92010Tel: +1.760.431.1919Email: IN CHINA:Izzie LiuNordson Electronics Solutions – China# 137 Guoshoujing RoadZhangjiang Hi-Tech ParkPudong, Shanghai China 201203Tel: +86.21.3866.9166Email: Info-electronics@ Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data

DOWNLOAD THE APP

Get Started Now: Download the App

Ready to dive into the world of global news and events? Download our app today from your preferred app store and start exploring.
app-storeplay-store