Adlink unveils compact module for high-power edge computing
The new module features up to 14 CPU cores, 8 Xe GPU cores, and an integrated Neural Processing Unit (NPU) designed to deliver both high performance and energy efficiency. The COM-HPC-mMTL is designed for use in edge environments such as industrial automation, data logging, unmanned aerial vehicles (UAVs), portable medical ultrasound systems, and AI-enabled robotics.
According to ADLINK, the module integrates up to 64GB of LPDDR5x memory—soldered directly onto the board and operating at speeds as high as 7467MT/s. The device's footprint measures just 95mm by 70mm, enabling its deployment in constrained spaces. Selected versions are specified for operating in temperatures ranging from -40°C to 85°C, supporting deployment in a variety of demanding settings.
In terms of connectivity and input/output options, the COM-HPC-mMTL incorporates up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, as well as multiple DDI/USB4 and USB 3.0/2.0 interfaces. These interfaces are designed to accommodate data-intensive tasks and high throughput requirements typical of modern edge computing workloads.
Alex Wang, Senior Product Manager at ADLINK, said, "The COM-HPC-mMTL is not just another embedded module. It redefines what's possible in edge computing with its exceptional performance and efficiency in such a compact form."
The company stated that the module addresses requirements from customers who need a combination of strong computational capability, space efficiency, and ruggedness. The form factor is intended to enable stackable designs, which the company says helps maximise space efficiency without reducing functionality. This approach enables developers and manufacturers to integrate the module into compact or portable devices where space and energy constraints are a critical issue.
ADLINK cited high-performance, battery-powered devices as one of the key target areas for the COM-HPC-mMTL, in line with industry trends toward more mobile, intelligent systems capable of functioning effectively at the network edge.
For those seeking to accelerate product development, ADLINK will make available the COM-HPC-mMTL development kit in the second half of 2025. The kit is intended to help developers prototype and test their solutions using the new module.
The COM-HPC-mMTL is positioned as a product that brings together processing power, compact size, scalability and a level of connectivity that supports next-generation applications in edge computing. The module is designed for use in a range of sectors where densification of computing resources and localised AI processing are becoming increasingly essential.
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