Ryan Specialty to Participate in the William Blair Growth Stock Conference
CHICAGO--(BUSINESS WIRE)--Ryan Specialty Holdings, Inc. (NYSE: RYAN) ('Ryan Specialty'), a leading international specialty insurance firm, today announced that it will be presenting at the William Blair Growth Stock Conference on Tuesday, June 3, 2025 at 11:40 AM Eastern Time.
The presentation will be available via a link to the live stream accessible through Ryan Specialty's website at ir.ryanspecialty.com. A replay of the presentation will be available for 90 days following the conclusion of the event.
About Ryan Specialty
Founded in 2010, Ryan Specialty is a service provider of specialty products and solutions for insurance brokers, agents, and carriers. Ryan Specialty provides distribution, underwriting, product development, administration, and risk management services by acting as a wholesale broker and a managing underwriter with delegated authority from insurance carriers. Our mission is to provide industry-leading innovative specialty insurance solutions for insurance brokers, agents, and carriers. Learn more at ryanspecialty.com.
Hashtags
Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles
Yahoo
42 minutes ago
- Yahoo
Xcel Brands to Host Fourth Quarter 2024 combined with First Quarter 2025 Earnings Call on June 4, 2025
NEW YORK, June 03, 2025 (GLOBE NEWSWIRE) -- Xcel Brands, Inc. (NASDAQ: XELB) ('Xcel' or the 'Company'), today announced that it will report its first quarter 2025 financial results on June 4, 2025. The Company will hold a conference call with the investment community on June 4, 2025, at 5:00 p.m. ET, which will also include coverage of the 4th quarter 2024 earnings that were released on May 28, 2025. A webcast of the conference call will be available live on the Investor Relations section of Xcel's website at or directly at Interested parties unable to access the conference call via the webcast may dial 800-715-9871 or 646-307-1963 and use the Conference ID 1032939. A replay of the webcast will be available on Xcel's website. About Xcel Brands Xcel Brands, Inc. (NASDAQ: XELB) is a media and consumer products company engaged in the design, licensing, marketing, live streaming, and social commerce sales of branded apparel, footwear, accessories, fine jewelry, home goods and other consumer products, and the acquisition of dynamic consumer lifestyle brands. Xcel was founded in 2011 with a vision to reimagine shopping, entertainment, and social media as social commerce. Xcel owns the Halston, Judith Ripka, and C. Wonder brands, as well as the co-branded collaboration brands TowerHill by Christie Brinkley, LB70 by Lloyd Boston, Trust. Respect. Love. by Cesar Millan, and GemmaMade by Gemma Stafford, and also holds noncontrolling interests or long-term license agreements in the Isaac Mizrahi brand, Orme Live and Jenny Martinez Live brands. Xcel also owns and manages the Longaberger brand through its controlling interest in Longaberger Licensing, LLC. Xcel is pioneering a true modern consumer products sales strategy which includes the promotion and sale of products under its brands through interactive television, digital live-stream shopping, social commerce, brick-and-mortar retailers, and e-commerce channels to be everywhere its customers shop. The company's brands have generated in excess of $5 billion in retail sales via livestreaming in interactive television and digital channels alone and consisting of over 20,000 hours of content production time in live-stream and social commerce. The brand portfolio reaches in excess of 40 million social media followers with broadcast reach into 200 million households. Headquartered in New York City, Xcel Brands is led by an executive team with significant live streaming, production, merchandising, design, marketing, retailing, and licensing experience, and a proven track record of success in elevating branded consumer products companies. For more information, visit For further information please contact:Seth Burroughs Xcel Brands, Inc. sburroughs@
Yahoo
an hour ago
- Yahoo
DuPont Powers AI and Next-Gen Electronics with Advanced Interconnect Innovations at JPCA Show 2025
TOKYO, June 3, 2025 /PRNewswire/ -- DuPont (NYSE:DD) today announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025), taking place from June 4-6 at the Tokyo Big Sight East Exhibition Halls. At Booth #6C-03, DuPont will showcase its extensive portfolio of advanced interconnect solutions, which encompass fine line, signal integrity, power and thermal management. "Our participation at JPCA 2025 underscores our commitment to innovation within the electronics industry," said Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, Interconnect Solutions. "For over 50 years, we have collaborated with industry leaders to power remarkable advancements in electronics, with a strategic focus on integrate circuit (IC) substrate, advanced printed circuit boards (PCB), and advanced packaging. Our deep customer intimacy, along with the depth and breadth of our technical capabilities, continues to empower advanced computing and connectivity." As artificial intelligence (AI) continues to transform industries, the demand for high-performance IC substrates is surging, with Japan at the forefront of providing innovative materials and processes. These advanced substrates are critical for bridging AI chips and printed circuit boards, enabling quicker data processing and improved thermal management. The global IC substrate market is poised to experience notable growth, driven by the expanding AI ecosystem and the increasing demand for advanced solutions. DuPont's comprehensive solutions empower IC substrate manufacturers to expedite product development and enhance production efficiency. Key offerings include DuPont™ Circuposit™ desmear and electroless copper for mSAP and SAP processes, and DuPont™ Copper Gleam™ electrolytic copper for conformal through-hole plating, which enhances core layer plating technologies. Moreover, DuPont™ Microfill™ acid copper optimizes blind via filling for build-up layers, thereby boosting mSAP and SAP process efficiency. Additionally, DuPont™ Riston® dry film photoresist is essential for a variety of applications, including core and build-up layers, final finishes, and copper pillars. Visitors to DuPont's booth are invited to connect with our experts and discover integrated solutions designed to drive success in the rapidly evolving electronics industry, including our complete range of offerings for PCBs. Circuposit™ SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced packaging, meeting the demands for low roughness dielectrics and low Dk and Df properties, essential for fine line and high-frequency designs. Microfill™ SFP-II-M acid copper offers excellent pattern uniformity, ideal for high-performance computing and AI chip applications. Microfill™ GFH-100 acid copper efficiently fills high aspect ratio through-holes for TGV applications with a unique bridging waveform and one-bath plating. Meanwhile, Microfill™ AHF acid copper supports various hole types in HDI and IC substrates, enabling stacked via structures for simpler processing. Riston® DI1600 and DI1600M dry film photoresists are advanced solutions that enable fine line direct imaging for IC substrate applications. They provide excellent adhesion and resolution, ensuring high-yield performance. Solderon™ TS7000 series solder is a SnAg micro bump plating solution for HBM applications. It offers excellent coplanarity, ideal for mixed and fine pitch micro-bumps, and supports both soluble and insoluble electrode plating solutions for added versatility. CYCLOTENE™ dry-film photo-imageable dielectric (DF-PID) for fan-out panel level package (FOPLP) provides excellent coplanarity through lamination and achieves desired thickness in a single step, unlike liquid dielectrics that require multiple coatings. Additionally, DF-PID for glass core substrate effectively fills through-glass vias (TGV) without voids in glass core substrates, which have successfully passed multi-reflow, biased highly accelerated stress test (bHAST), and high-temperature storage (HTS) reliability tests, showing no delamination or cracking post-assessment. Pyralux® ML laminates are a breakthrough in non-copper-based materials, providing OEMs with a reliable, customizable solution for high-performance markets. By setting a new industry standard and leveraging advanced polyimide technology, these laminates are poised to expand their impact across critical industries, becoming essential for the next generation of electronic and thermal management applications. Pyralux® AP flexible copper-clad laminate is a double-sided laminate featuring an all-polyimide dielectric and a unique manufacturing process. It offers exceptional reliability and reduced transmission loss, meeting customer demands for high-speed, high-frequency signal transmission. About DuPont DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at Investors can access information included on the Investor Relations section of the website at DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, SM or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted. View original content to download multimedia: SOURCE DuPont Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
an hour ago
- Yahoo
Best's Market Segment Report: AM Best Maintains Stable Outlook on South Korea's Non-Life Insurance Market
HONG KONG, June 04, 2025--(BUSINESS WIRE)--AM Best has maintained its stable outlook on South Korea's non-life insurance segment, noting a continued refinement of the country's domestic solvency standards that have helped strengthen insurers' capital management. Additional factors include moderate growth in the long-term and general insurance segments, and efforts to improve profitability in the former as well as in investment strategies. However, AM Best notes an offsetting factor of slow growth prospects and weakened underwriting profitability in South Korea's auto insurance segment. According to the Best's Market Segment Report, "Market Segment Outlook: South Korea Non-Life Insurance," the country's non-life insurance industry is facing capital pressure with increasing insurance liabilities, following the Financial Supervisory Service's (FSS) push for more realistic actuarial assumptions and a phased plan to cut discount rates until 2027, which are intended to improve credibility and comparability of insurers' financials. "These ongoing regulatory changes, coupled with a decreasing trend in domestic interest rates, are expected to pose a considerable burden on insurers' solvency, especially those with relatively weaker capital positions," said Seokjae Lee, senior financial analyst, AM Best. "However, AM Best expects these changes will promote economic value-based capital management for insurers to maintain sound capital adequacy across the industry." Over the next 12 months, AM Best expects the industry to experience moderate growth with heightened emphasis on profitability management of long-term insurance following a few years of intensified market competition and with a focus on mitigating increasing solvency pressures. According to the report, the auto insurance segment has experienced a slowdown in its premium growth in recent years, owing to sluggish vehicle registrations and cumulative premium rate cuts to support the consumer economy. A notable trend is a high and increasing market concentration among large insurers. "With the fast-growing online auto insurance market, large insurers are more likely to maintain premium growth as they benefit from factors such as economies of scale, strong marketing capability and digital infrastructure," said Chanyoung Lee, director, AM Best. To access the full copy of this market segment report, please visit AM Best is a global credit rating agency, news publisher and data analytics provider specializing in the insurance industry. Headquartered in the United States, the company does business in over 100 countries with regional offices in London, Amsterdam, Dubai, Hong Kong, Singapore and Mexico City. For more information, visit Copyright © 2025 by A.M. Best Rating Services, Inc. and/or its affiliates. ALL RIGHTS RESERVED. View source version on Contacts Seokjae LeeSenior Financial Analyst +852 2827 3407 Christopher Sharkey Associate Director, Public Relations +1 908 882 2310 Chanyoung Lee Director, Analytics +852 2827 3404 Cynthia Ang Senior Industry Research Analyst +65 6303 5026
