
Blackstone bolsters Korea portfolio with 2 logistics centers near Seoul
The New York-based alternative investment firm said Monday that its real estate division acquired properties totaling 1.3 million square feet in Gimpo and Namyangju, two of the most competitive infill logistics markets in Gyeonggi Province.
The firm said the properties are Grade A facilities — modern, high-quality logistics centers designed for efficient supply chain operations, typically featuring large space, advanced technology and strategic transport access — and are leased to major local and global e-commerce and logistics companies.
'This is a continuation of our commitment to investing in prime Korean assets in fast-growing sectors,' said Chris Kim, Head of Blackstone Real Estate–Korea.
'Logistics is one of our highest-conviction investment themes in real estate globally, and a focus for us in Korea, particularly in Seoul, where last-mile new supply remains extremely limited and vacancy rates are in the low 4 percent range,' Kim stated. 'We are pleased to bring together our global scale and expertise, local insights and asset management capabilities to grow the platform for long-term success.'
Blackstone has ramped up its real estate activity in Korea since launching the dedicated team three years ago.
Last year, it completed three major transactions, including an investment in a multistory logistics facility in Gimpo and the acquisition of an office building in Seoul's Gangnam district for conversion into a select-service hotel with Travelodge Asia. The firm also finalized the landmark sale of Arc Place, following years of repositioning the asset into a premier office building in central Seoul.

Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles


Korea Herald
9 hours ago
- Korea Herald
Korean expertise vital for Egypt's sustainable aviation: minister
Egypt is eyeing closer cooperation with South Korea for the country's transition to a sustainable and smart aviation system, said Sameh El-Hefny, Egypt's minister of civil aviation, in an interview with The Korea Herald. El-Hefny visited Incheon to attend the International Conference on Aviation Cooperation (CIAT 2025), Korea's leading triennial aviation conference for global cooperation and the future of air transport. 'South Korea possesses advanced expertise in smart technologies and transport systems," said El-Hefny, expressing his willingness to work with Korean companies to modernize Egypt's aviation system. Referring to Egypt's progress toward green infrastructure, he cited Borg El Arab International Airport, located 40 kilometers southwest of Alexandria, Egypt, as a 'pioneering model' for environmentally friendly development in the region. Borg El Arab serves as the main international gateway for Alexandria, Egypt's northern coast and the Nile Delta, with capacity to handle 3.5-4 million passengers and 10,000 tons of cargo annually. El-Hefny highlighted the airport's focus on reducing carbon emissions and generating solar energy, calling it a key step toward sustainable infrastructure, featuring advanced technology and reinforcing Egypt's role as a global aviation hub. According to El-Hefny, partnering with South Korea will enhance tourism, boost regional connectivity and advance Egypt's Vision 2030 for sustainable development. El-Hefny was in South Korea to attend CIAT 2025 last week, hosted by South Korea's Ministry of Land, Infrastructure and Transport. On the sidelines of the event, he held bilateral talks with his Korean counterpart, Transport Minister Park Sang-woo. He described the visit as 'a manifestation of civil aviation diplomacy,' highlighting Egypt's push for digital transformation and sustainability while strengthening aviation ties with South Korea.


Korea Herald
12 hours ago
- Korea Herald
Can LG break into AI chips game with hybrid bonder?
Tech giant bets on in-house expertise to take on rivals, but faces uncertain demand and scalability hurdles LG Electronics is eyeing a bold expansion in its semiconductor equipment operations, developing critical machinery for manufacturing the high-bandwidth memory chips that power AI innovation. The South Korean tech giant said it has kicked off development of a hybrid bonder at its in-house R&D unit, the Production Engineering Research Institute. A hybrid bonder is a kind of chip packaging machine, and LG wants to develop one for use in the HBM chips used in AI. The confirmation comes after a recent media report that LG aims to commercialize the equipment by 2028. An LG spokesperson, however, said that while it is currently conducting technical research on hybrid bonders for HBM, the timeline for mass production remains undecided. For LG, semiconductors are a sensitive topic. The company's chip aspirations suffered a devastating blow during the 1997 Asian financial crisis, when government-mandated restructuring stripped away its chipmaking business, LG Semicon, and merged it into Hyundai Electronics, which later became SK hynix. But LG kept the flame alive, holding onto crucial design capabilities and continuing to develop custom chips for its own products. The company has also partnered with Canada-based AI chip design company Tenstorrent to develop AI chips together. Its Production Engineering Research Institute also sells packaging and testing equipment and has conducted research on HBM technologies. This time, LG appears to be seeking a new growth engine by entering the red-hot AI chips sector, in line with LG Group Chair Koo Kwang-mo's AI vision. Observers say that because the hybrid bonder market is still in its early stages, LG could gain an edge if it succeeds in developing it. 'LG is entering the market because there's clear business potential,' said Lee Jong-hwan, a system semiconductor engineering professor at Sangmyung University. 'HBM is expected to see continued growth because it is a critical component in AI chips, which are becoming dominant in the market.' Lee noted that the Production Engineering Research Institute has long handled equipment and systems related to mass production. 'So they have strengths in developing related tools. That's why they are confident in commercializing this technology,' Lee said Why hybrid bonders matter HBM chips — used in AI accelerators like Nvidia's GPUs — are built by stacking multiple DRAM chips vertically, like a high-rise tower, allowing rapid and efficient data transfer. The key to their performance hinges on how precisely and securely these memory chips are bonded together. That's where advanced packaging tools like the hybrid bonder and the widely-used thermocompression bonder, or TC bonder, come in. These machines physically connect the chips to form a single, high-performance memory unit. The hybrid bonder LG is developing promises a significant advancement over conventional TC bonders. TC bonding uses heat and pressure to attach the semiconductor chips, relying on microscopic bumps to connect the stacked dies. In contrast, hybrid bonding eliminates the bumps entirely and enables direct chip-to-chip connections. This allows for thinner chip stacks, improved thermal performance and higher stacking capability, ultimately enabling the high-performance packaging needed for cutting-edge AI chips. Only a few global companies, such as Netherlands-based Besi and US-based Applied Materials, have developed hybrid bonders, and even those have yet to be commercialized for HBM. If LG succeeds, it could carve out a lucrative niche in a fast-growing market. The global hybrid bonding equipment market is expected to grow from $1.5 billion in 2024 to $3.2 billion by 2033, according to market research firm Verified Market Research. 'Hybrid bonding has a clear advantage,' said Lee. 'AI chips require higher data throughput as models become more complex and training workload increases. This leads to significant heat generation, and hybrid bonding offers a structural advantage in managing thermal issues.' 'But mass production capability will be critical, and once those manufacturing challenges are addressed, hybrid bonding will be more favorable for future HBMs.' Heated competition Samsung and SK hynix, the world's two largest memory chip makers, are mulling the use of hybrid bonding in their next-generation HBM products, such as HBM4E. As the number of DRAM layers in HBM increases to 16 or even 20, the use of TC bonding is expected to reach its limits. With the major HBM players eyeing the hybrid bonding technology, the equipment market will hinge on who can mass produce reliable and scalable equipment the fastest. Major equipment makers are entering the fray. Hanmi Semiconductor, the market leader in TC bonders, which supplies HBM leaders SK hynix and Micron, announced Friday that it will invest 100 billion won ($72.67 million) in hybrid bonding technology, with plans to release a hybrid bonder by the end of 2027. The company is constructing a hybrid bonder factory in Incheon, with the goal of completion in the second half of next year. Hanwha Semitech, which also supplies TC bonders to SK Hynix, is also ramping up efforts to develop hybrid bonding equipment. Then there's Applied Materials, which in April became the largest shareholder of Besi, a move expected to accelerate the development of hybrid bonding technology. Semes, the semiconductor equipment subsidiary of Samsung Electronics, is also reportedly developing a hybrid bonder that could be used for Samsung's HBM. "Since B2B equipment production and supply depend on customer demand, actual rollouts will be determined by market response and client needs," said an industry official on condition of anonymity. "Currently SK hynix gets its TC bonder from Hanmi Semiconductor and Hanwha Semitech, while Micron also sources from Hanmi. If Samsung decides to use tools from Semes, the key for LG is to make a marketable product and secure customers." sahn@


Korea Herald
12 hours ago
- Korea Herald
Jennie of Blackpink taps ex-Spotify executive's Alta Music to manage her US activities
K-pop star joins Jeremy Erlich's newly launched company for stateside career support while retaining creative control under her label Odd Atelier Jennie of Blackpink has signed with former Spotify global music head Jeremy Erlich's newly launched Alta Music Group for US management, in a strategic move to expand her solo activities stateside. While the exact date of the contract signing has not been disclosed, it is expected to have taken place in July, as reports of the deal surfaced in the US on July 24. The agreement marks the first artist management signing for Alta Music, an independent, full-service company based in Los Angeles. Jennie will continue to operate under her label Odd Atelier, which clarified that Alta Music will only oversee her US management and will not be involved in music distribution. Alta Music Group, launched by Erlich earlier in July, will span management, publishing and recorded music. The company has also secured distribution through Sony Music's independent distributor The Orchard and entered a co-development partnership with The Black Label — a Seoul-based label helmed by producer Teddy Park, known for his longtime work with Blackpink. Erlich, who previously helped facilitate Blackpink's US expansion and co-managed Jennie's activities, emphasized his long-term vision for artist-centered management. 'Throughout my career, I've focused on the best way to service artists around the world that would create an environment that sets them up for long-term, global success,' Erlich said in a statement. 'With Alta, we have the opportunity to do just that — a best-in-class team focused solely on supporting our artists and the music they create. Everything else does not matter.' Jennie parted ways with YG Entertainment for her solo activities in December 2023, along with other Blackpink members, while maintaining her group contract. Since then, she has expanded her solo career and business through Odd Atelier.