logo
MiTAC Computing Powers Next-Gen AI and Cloud Servers at COMPUTEX 2025

MiTAC Computing Powers Next-Gen AI and Cloud Servers at COMPUTEX 2025

Korea Herald21-05-2025

TAIPEI, May 21, 2025 /PRNewswire/ -- MiTAC Computing Technology Corporation, a leading server platform designer, manufacturer, and a subsidiary of MiTAC Holdings Corporation (TSE:3706), displays its server-to-data center integration solutions at COMPUTEX 2025 (Booth M1110). In collaboration with Solidigm, a pioneer in enterprise data storage, MiTAC Computing highlights a new level of storage performance tailored for AI, high-performance computing, and enterprise data center environments.
Scaling AI with MiTAC TN85-B8261 and Solidigm D5-P5336 122TB QLC SSD
The MiTAC TN85-B8261 is a 2U dual-socket GPU server built for AI inference workloads, supporting up to four dual-slot GPUs, 24 DDR5-6400 RDIMMs with memory up to 6TB, and 8 NVMe U.2 drives for high-speed performance and serviceability.
With the integration of the Solidigm™ D5-P5336 122TB QLC SSD, the industry's highest capacity PCIe SSD, TN85-B8261 delivers exceptional read-optimized performance, and significantly improves power and space efficiency, enabling data centers to reduce storage rack space and consume less storage power compared to hybrid HDD and TLC storage arrays. The efficiency gain allows more compute capacity for GPU servers, which is critical for AI data center builds.
Cloud-Optimized Performance with MiTAC R1520G6 and Solidigm D7-PS1010
The MiTAC R1520G6 is a 1U dual-socket server powered by Intel® Xeon® 6700P processors, built for cloud-native and memory-intensive workloads. With support for 10 NVMe U.2 drive bays, it delivers high storage density in a compact footprint.
Paired with the Solidigm™ D7-PS1010—a 15.36TB PCIe 5.0 SSD—the system offers high throughput, low latency, and dependable endurance. Its U.2 15mm form factor and 176L TLC 3D NAND make it ideal for real-time analytics, AI inference, and scalable cloud infrastructure.
Fueling AI-Ready Infrastructure
Whether integrating Intel® Xeon® or AMD EPYC™ processors with advanced accelerators, MiTAC Computing's server platforms are built to support high-density compute workloads. Solidigm's enterprise SSDs further elevate system performance by enabling efficient GPU utilization, accelerating AI inference, and supporting high-speed data ingestion—all while maintaining industry-leading performance-per-watt metrics.
Through this strategic collaboration, MiTAC Computing and Solidigm continue to deliver innovative, scalable infrastructure solutions for next-generation AI, high-performance and cloud computing applications.
Visit MiTAC Computing at COMPUTEX 2025 – Booth M1110
Explore our new launches: https://www.mitaccomputing.com/en/campaign/computex2025
About MiTAC Computing Technology Corporation
MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings, delivers comprehensive, energy-efficient server solutions backed by industry expertise dating back to the 1990s. Specializing in AI, HPC, cloud, and edge computing, MiTAC Computing employs rigorous methods to ensure uncompromising quality not just at the barebone level but more importantly, at the system and rack levels—where true performance and integration matter most. This commitment to quality at every level sets MiTAC Computing apart from others in the industry. The company provides tailored platforms for hyperscale data centers, HPC, and AI applications, guaranteeing optimal performance and scalability.
With a global presence and end-to-end capabilities—from R&D and manufacturing to global support—MiTAC Computing offers flexible, high-quality solutions designed to meet unique business needs. Leveraging the latest advancements in AI and liquid cooling, along with the recent integration of Intel DSG and TYAN server products, MiTAC Computing stands out for its innovation, efficiency, and reliability, empowering businesses to tackle future challenges.
Visit our corporate website: https://www.mitaccomputing.com/

Orange background

Try Our AI Features

Explore what Daily8 AI can do for you:

Comments

No comments yet...

Related Articles

TWSC Debuts at COMPUTEX 2025: Empowering AI with Full-Stack Storage Solutions
TWSC Debuts at COMPUTEX 2025: Empowering AI with Full-Stack Storage Solutions

Korea Herald

time23-05-2025

  • Korea Herald

TWSC Debuts at COMPUTEX 2025: Empowering AI with Full-Stack Storage Solutions

TAIPEI, May 23, 2025 TWSC made its debut at COMPUTEX 2025, one of the world's leading technology exhibitions, under the theme "Transcending Intelligence, Ascending Full-Stack Solutions." The company showcased a full range of storage products and solutions designed to support next-generation AI and computing applications. As AI adoption accelerates, storage technology is becoming more scenario-driven. TWSC provides tailored "One Solution for One Scenario" services based on its full-chain capabilities in chips, algorithms, and application scenarios, accurately addressing the diverse needs of smart terminals, industrial control, servers, and other fields. Full-Stack Storage Matrix Unleashes Efficiency TWSC highlighted high-throughput, low-latency solutions at the event, including PCIe 5.0 SSDs, DDR5, eMMC, UFS, and LPDDR series. Combining performance and efficiency, these products enable AI inference and edge computing applications. According to TWSC's 2024 annual report, the company reported revenue of RMB 4.773 billion, a 168.74% increase year-over-year. Embedded storage sales reached RMB 843 million, rising by 1730.6%, while high-speed PCIe SSD sales grew 979%, becoming a major growth driver. The company now offers scenario-based solutions across enterprise, embedded, consumer, and industrial applications, building a strong foundation for global growth through advanced storage modules. Full-Stack Self-Developed Capabilities Build Competitive Edge To enhance control over the industrial chain, TWSC has developed an integrated "wafer-to-product" scenario-based service capability, enabling differentiation through media analysis, chip design, firmware optimization, and packaging control. TWSC uses its "5+1+N" global supply chain network to ensure smooth coordination across R&D, production, and delivery. With a robust validation system and adaptive quality control, the company aligns product quality closely with customer needs. From chips to scenarios, and data to value — TWSC's participation highlights the shift of storage technology from basic functions to intelligent services. By integrating industrial resources and expanding application scenarios, the company is building an open and collaborative innovation ecosystem for smart storage. About TWSC: Shenzhen Techwinsemi Technology Co., Ltd. (Stock Code: was established in 2008 and specializes in integrated circuit solutions for storage controllers and modules. The product line covers four major series: SSD, embedded storage, DDR, and portable storage — offering reliable storage solutions for high-value applications such as smart terminals, data centers.

MAXSUN Unveils Intel Arc Pro B60 Dual 48G Turbo at COMPUTEX 2025
MAXSUN Unveils Intel Arc Pro B60 Dual 48G Turbo at COMPUTEX 2025

Korea Herald

time23-05-2025

  • Korea Herald

MAXSUN Unveils Intel Arc Pro B60 Dual 48G Turbo at COMPUTEX 2025

TAIPEI, May 21, 2025 /PRNewswire/ -- MAXSUN is showcasing its latest breakthrough product at COMPUTEX 2025, the MAXSUN Intel Arc Pro B60 Dual 48G Turbo graphics card. Featuring dual-GPU architecture, 48GB of GDDR6 memory, and dual hardware media engines, this powerhouse is engineered for the most demanding AI inference and video processing workloads. The card delivers exceptional performance, offering high-speed data processing, accelerated AI capabilities, and efficient video encoding/decoding. It is a game-changer for professionals requiring cutting-edge hardware for intensive tasks. With this launch, we're further reinforcing our commitment to delivering high-value AI and workstation hardware—offering developers, AI enthusiasts, and enterprise users a new high-efficiency, cost-effective computing solution purpose-built for the AI era. In addition to the MAXSUN Intel Arc Pro B60 Dual 48G Turbo, MAXSUN is displaying the Intel Arc B580 series graphics cards. These cards offer high-frequency output and advanced cooling solutions, making them ideal for both gaming and professional applications. They are designed to provide stable, powerful performance under heavy workloads. High-Performance Motherboards: MS-iCraft Z890 Series MAXSUN is also presenting its MS-iCraft Z890 series motherboards, including the Z890 Vertex and Z890 Pacific. These high-performance boards are designed for gaming and demanding builds, offering robust stability and support for the latest components. The MAXSUN iCraft B860m Cross Pro motherboard, with its anime styl design and solid performance, is also receiving attention from attendees. For professional applications, MAXSUN is showcasing the MS-WorkStation W790 112L motherboard. Designed for high-performance workstations, it's ideal for tasks such as video editing, 3D rendering, and scientific computing. Additionally, the MS-Q670M vPro motherboard is tailored for enterprise environments, offering reliability and security for business use. Specialty Gaming Products: MS-Terminator B850M PRO WIFI The MS-Terminator B850M PRO WIFI motherboard stands out with its battle armor-inspired design. The full metal armor enhances cooling performance, making it ideal for gamers who need both style and durability in their builds. Visit MAXSUN at COMPUTEX 2025 MAXSUN's products will be showcased at COMPUTEX 2025, May 20–23, 2025 in Hall 1, 4th Floor, Booth L1118. Visitors will have the chance to experience hands-on demos and learn more about MAXSUN's cutting-edge products.

Innodisk at COMPUTEX 2025: Driving Edge AI and Embedded Vision with Heterogeneous Platform Compatibility
Innodisk at COMPUTEX 2025: Driving Edge AI and Embedded Vision with Heterogeneous Platform Compatibility

Korea Herald

time23-05-2025

  • Korea Herald

Innodisk at COMPUTEX 2025: Driving Edge AI and Embedded Vision with Heterogeneous Platform Compatibility

TAIPEI, May 20, 2025 /PRNewswire/ -- Innodisk, a leading global provider of industrial AI solutions, reaffirmed its pioneering position by showcasing its latest innovations at COMPUTEX 2025 in Taipei. This year, Innodisk's live demonstrations spotlighted its optimized AI systems—including the APEX series —and computing solutions built on NVIDIA, Intel, and Qualcomm Technologies solutions. These were seamlessly integrated with Innodisk's comprehensive portfolio of embedded solutions, such as camera modules, AI memory modules, flash storage, and peripherals. The smooth integration across heterogeneous platforms reflects Innodisk's robust R&D capabilities and brings real-world applications to enterprise workloads, industrial deployments, and smart city infrastructure. The highlight of this year's exhibition is Innodisk's enterprise on-premise private LLM solution, powered by the APEX-X100 —an AI computing platform purpose-built for local AI training and paired with the AccelBrain software tool. Also taking the spotlight is the APEX-S100 short-depth server. Housed in a compact 2U, 420mm-depth chassis, it supports up to two double-width GPUs and multiple memory expansion slots, delivering exceptional performance suited for large-scale data analytics. Recognizing the pivotal role of camera modules in AI machine vision, Innodisk has expanded its embedded camera module lineup and built a specialized team to support it. The lineup now includes mainstream specifications such as USB, MIPI, and GMSL2 —all supported by highly customized drivers and adaptor boards. This demonstrates broad platform compatibility, from Raspberry Pi and industrial computers to AI servers. At Computex, Innodisk is also working closely with Advantech's iMobility & Rugged Edge AI Division showcasing the integration of 16 virtual channels of GMSL2 camera modules on Advantech's TREK-50N and REX-52N edge AI systems. This joint demonstration highlighted applications for heavy-duty environments, such as synchronized video capture around large vehicles and real-time driver behavior monitoring—contributing to enhanced workplace safety. As part of its ongoing collaboration with Qualcomm Technologies, Inc., Innodisk showcased its enhanced platform integration capabilities with a live demo of a Smart Parking Recognition and Security Solution. Powered by the Qualcomm Dragonwing™ IQ9, the system utilizes an integrated Neural Processing Unit (NPU) to efficiently handle multi-modal AI workloads, including Vision Language Models (VLM) and Generative AI. The NPU enables high-throughput, low-latency inference directly at the edge—crucial for real-time tasks like vehicle identification (make, model, color) and behavior tracking. With support for expandable camera modules and fully local processing, the solution delivers fast, cloud-independent decision-making, making it ideal for smart city deployments where responsiveness and security features are paramount. In parallel, Innodisk is offering an Intel® Core™ Ultra Series 2 reference kit featuring its compatibility of Innodisk exclusive MIPI-over-Type C camera, DRAM modules, SSDs, and additional expansion options—highlighting the partnership between Intel and Innodisk as an ideal choice for industry players looking to adopt next-generation computing platforms and lead in the AI era. Furthermore, Innodisk continues to strengthen its technical expertise in memory and storage solutions. This year's product lineup features market-ready LPDDR5X CAMM2 and DDR5 MRDIMM modules, alongside a comprehensive range of PCIe Gen5 SSDs, including U.2 and EDSFF form factors such as E3.L, E3.S, and E1.S while compliant with the OCP SSD 2.0 specification, making it ideal for enterprise environments, AI servers, and data centers.

DOWNLOAD THE APP

Get Started Now: Download the App

Ready to dive into the world of global news and events? Download our app today from your preferred app store and start exploring.
app-storeplay-store