SBI SCO registration deadline today; here's direct link
The recruitment drive aims to fill 33 vacancies, of which 1 vacancy is for General Manager post, 14 for Assistant Vice President, and 18 for Deputy Manager. Applicants can check the eligibility criteria, age limit, pay scale, and other details available in the notification below:
Here's the official notification.
Application Fee
Applicants from the General/ EWS/ OBC category are required to pay a fee of Rs 750, whereas no fees/ intimation charges apply to SC/ ST/ PwBD candidates.
Steps to apply for SBI SCO post 2025
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Time of India
an hour ago
- Time of India
Four new semiconductor units worth Rs 4,594 crore to come up in Odisha, AP, Punjab: Union minister Ashwini Vaishnaw
Academy Empower your mind, elevate your skills ETtech The Union Cabinet on Tuesday approved four semiconductor projects worth Rs 4,594 crore under the India Semiconductor Mission , taking the total number of approved chip manufacturing facilities in India to ten. The latest approvals push up the projected investments in semiconductor projects to about Rs 1.6 lakh crore across six newly approved proposals are from SiCSem Pvt Ltd , Heterogeneous Integrated Packaging Solutions Pvt Ltd (HIPSPL), Continental Device India Pvt Ltd and Advanced System in Package (ASIP) Technologies. While SiCSem and HIPSPL will set up units at Bhubaneshwar in Odisha, CDIL will expand its existing facility in Punjab's Mohali and ASIP will build a plant in Andhra Pradesh. The proposals are expected to generate 2,034 skilled jobs cumulatively."The complete ecosystem of design, wafer fabrication, packaging, manufacturing of components, assembly, testing, and high-volume final production, is in the works. This will help every sector and dimension of electronics manufacturing," union minister for electronics and information technology Ashwini Vaishnaw government hopes to give the semiconductor ecosystem a significant boost with the latest approvals, given that it will include the country's first commercial compound fab, as well as a highly advanced glass-based substrate semiconductor packaging products from these new plants will have applications in missiles, defence equipment, electric vehicles, railway, fast chargers, data centre racks, consumer appliances and solar power inverters, among others, Vaishnaw said. The new plants are expected to be ready for production in 2-3 years given that all government bodies have promised to provide expeditious permissions, he said, while pointing to previous such plants breaking ground in 6 terms of investment figures, the new plants are smaller than each of the six projects that are already coming up. Tata Electronics is investing Rs 91,000 crore in a fab facility in Gujarat's Dholera and Rs 27,000 crore for an semiconductor assembly and test facility at Morigaon, Assam, both announced in February last year. US-based Micron Technology is investing Rs 23,000 crore in an assembly, testing, marking and packaging (ATMP) plant at Sanand in Gujarat, announced in June SicSem is collaborating with Scotland's Clas-SiC Wafer Fab to establish a Rs 2,066 crore facility for silicon carbide-based compound semiconductors in Bhubaneswar. Set to be the first commercial compound fab in India, it will have an annual capacity of 60,000 wafers and a packaging capacity of 96 million chips."There is a world-wide movement from silicon to silicon carbide. It is a robust material and can sustain high voltage and temperatures. It is used in missiles, space equipment, satellites, rockets, railway engines and telecom tower equipment. Silicon carbide is a strategic necessity for our country,' the minister said. The Bhubaneshwar plant will also do research. 'At IIT-Bhubaneswar, a Rs 45 crore R&D unit has been set up," he will also be home to HIPSPL's vertically integrated advanced packaging and embedded glass substrate unit. A subsidiary of Albuquerque, New Mexico-based high-tech manufacturing firm 3D Glass Solutions Inc, HIPSPL will put in Rs 1,943 crore into the unit. It will be the first in the world to provide 3D packaging on a glass substrate on a commercial scale, Vaishnaw plant will have 11-13% equity investments each from US majors Intel, Lockheed Martin and Applied Materials, as well as venture capital funds, an official planned capacity of this unit will be nearly 70,000 glass panel substrates, 50 million assembled units and 13,200 3D heterogeneous integration modules every ASIP will set up a unit in Andhra Pradesh with an investment of Rs 468 crore, through a technology tie-up with South Korea's APACT, with an annual capacity of 96 million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications and other electronic products. Venkata Simhadri, chief executive, ASIP Technologies, told ET: "Our OSAT/ATMP is focused on advanced (2.5D/3.0D) packaging of semiconductors, targeting data centres, high-speed communications and AI applications."New Delhi-based Continental Device will expand its discrete semiconductor manufacturing facility at Mohali with an investment of Rs 117 crore. It will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, schottky bypass diodes and transistors, both in silicon and silicon carbide. The annual capacity of this brownfield expansion will be 158.38 million general manager Prithvideep Singh told ET: "With this investment, we would expand our installed capacity of 600 million units to over 760 million units annually and sharpen our focus on silicon and silicon carbide chips."With a capacity of producing 24 billion chips, the six semiconductor projects that have already got approvals are in various stages of first-ever made in India chip will become available in the next 2-3 months, with three of the projects competing with each other, Vaishnaw a result of domestic chip production, the government expects the average value addition for electronics in India to rise to 30% in the future from 22% now, he said.
Indian Express
an hour ago
- Indian Express
CBI arrests two senior CPWD engineers for taking bribe
Five persons, including two senior engineers of the Central Public Works Department (CPWD), were arrested by the CBI on Monday for allegedly taking bribes to clear pending bills of a private contractor involved in executing works at Chanakyapuri in Delhi. Four more engineers, who have been booked, are being questioned, the central agency said. The CBI identified the arrested persons as Jai Prakash, executive engineer (Civil); Prabhat Chaurasiya, assistant engineer (Civil); as well as Shubham Goel, and his father Rajesh Goel, the owner of Shubham Electricals. 'The CBI registered a case on August 11 against 12 persons, including the four arrested accused. The agency had received information that Shubham would be paying a bribe of Rs 6 lakh to Jai Prakash on August 11. Accordingly, a trap was laid and both were caught along with money,' a CBI spokesperson said, adding that CPWD has awarded multiple contracts to Shubham Electricals. The agency said that searches were conducted at 10 places during which Rs 55 lakh in cash was recovered. The CBI alleged in the FIR that on August 1, it received a tip-off stating that Shubham has informed his father that CPWD has sought a payment of Rs 1.52 crore against some of the company's pending bills. He also allegedly asked Rajesh on how much bribe money is to be given to various CPWD officers. 'His father directed that 3% of total bill is to be given to the executive engineer, 2% to the assistant engineer and the junior engineer, 1% to the CPWD accounts section, 1% to computer operators and clerks, and rest 1-2% to the superintending engineer for the award of the tender,' the FIR stated. It accused CPWD engineers of taking bribes from private contractors engaged in executing works in Chanakyapuri in lieu of extending undue favours in awarding contracts, allowing poor quality construction materials and clearing inflated bills, as well as causing wrongful loss to government exchequer.
Economic Times
an hour ago
- Economic Times
Banks boost equity investments by 49% in FY25 amid retail FOMO
Indian banks significantly increased their equity investments in FY25, driven by strategic treasury diversification. An analysis of 16 major banks revealed a 49% surge, reaching ₹49,572 crore, with SBI's investments tripling. This rise coincided with growing retail participation in the market and the implementation of new accounting norms. Tired of too many ads? Remove Ads Tired of too many ads? Remove Ads Mumbai: Retail investors may have entered the equity market driven by the fear of missing out, or FOMO, but for banks, the move was more strategic. Their treasury operations saw an opportunity to diversify, leading to a sharp rise in equity investments in analysis by ET covering 16 banks - together accounting for 90% of the lending market - showed that their investments in stocks rose 49% to ₹49,572 by State bank of India (SBI) tripled to ₹22,000 crore over the previous year, while equity commitments by Bank of Baroda Canara Bank and UCO Bank more than participation in the markets also grew in the same period, as investor accounts on NSDL surged to 39.5 million (35.8 million in the previous year). Retail presence on CDSL grew to 153 million (115.6 million the year ago).Investments in equities by banks are part of their treasury operations that include both fresh and existing commitments in their subsidiaries and affiliates. Equity investments also rose as banks implemented fair value treatment accounting norms, which came into effect from April 1, FY25, the BSE Sensex touched an all-time high of 85,978 points on September 27, 2024. However, through FY25, it climbed just 5.1%, opening at 73,968.6 points on April 1, 2024, and closing at 77,414.9 points on March 28, 2025 - the last trading day of the previous fiscal year.
