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Deccan Herald
2 days ago
- Business
- Deccan Herald
First made-in-India semiconductor chip to come in market by 2025 end: PM Narendra Modi
The Cabinet approved a 3D glass semiconductor packaging unit to be set up by 3D Glass Solutions Inc -- which is backed by US technology majors such as Intel, Lockheed Martin and Applied Materials, entailing an investment of Rs 1,943 crore with an annual production capacity of 5 crore units.
Economic Times
2 days ago
- Business
- Economic Times
Made-in-India chips to hit market by 2025-end for first time, says PM Modi
Synopsis Prime Minister Modi announced India's first indigenous semiconductor chip will launch by year-end, highlighting the nation's push for self-reliance in this vital sector. Six units are operational, with four newly approved plants across Odisha, Andhra Pradesh, and Punjab. These projects signify a mission-mode approach to semiconductor development, aiming for rapid growth and technological independence after decades of stagnation. Agencies PM Modi on Friday announced that India's first fully made-in-India semiconductor chip will hit the market by the end of this year. Speaking during his 79th Independence Day address from the Red Fort, the prime minister said six semiconductor units are already operational, while four new units have received government approval. 'By the end of this year, made in India, made by the people of India, made in India chips will come to the market,' he said, highlighting the country's push to achieve self-reliance in this critical technology sector. Read Also | Independence Day 2025: From slashing GST to 'Sudarshan Chakra' defence system; here are highlights from PM Modi's speech"My dear youth, you will be surprised to know that today, the semiconductor, which has become the strength of the world, 50-60 years ago, that thought process, those files, got stuck. They got stuck. The thought process of the semiconductor itself was foeticide 50-60 years ago. It lost 50-60 years. After us, many countries, in semiconductors, today, have mastered the technology and consolidated their power," he vital components for devices ranging from mobile phones and computers to electric vehicles and home appliances, are expected to see India's market grow from $45-50 billion in 2024-25 to $100-110 billion by 2030, according to industry estimates. The PM recalled that India's semiconductor journey started over 50 years ago but remained stalled for decades while other countries dominated the industry. 'The thought process for semiconductors existed 50-60 years ago, but the files got stuck. Today, several countries have mastered the technology and consolidated their power,' he said, urging the youth to learn from this Also | PM Viksit Bharat Rozgaar Yojana: PM Modi announces Rs 1 lakh crore scheme for youth in Independence Day 2025 Speech He noted that the government is no longer burdened by the past and is pursuing semiconductors in a mission mode, focusing on rapid growth and technological independence. The Union Cabinet recently approved four new semiconductor plants with a total investment of Rs 4,594 crore across Odisha, Andhra Pradesh, and Punjab. Read Also | Next-gen GST reforms by Diwali, will reduce tax on every day use items: PM Modi Notable projects include: A 3D glass semiconductor packaging unit by 3D Glass Solutions Inc backed by Intel, Lockheed Martin, and Applied Materials, with a production capacity of 5 crore units annually. India's first commercial silicon carbide (SiC) fabrication unit by SiCsem in Bhubaneswar, capable of producing 9.6 crore chips per year. A chip packaging plant by Advanced System in Package Technologies in Andhra Pradesh, with an annual capacity of 9.6 crore units. A semiconductor project by CDIL in Punjab with an annual output of 15.8 crore units.
Hans India
4 days ago
- Business
- Hans India
Big Push For ‘Make In India': Cabinet clears 4 new chip plants
New Delhi: The Union Cabinet on Tuesday approved four semiconductor manufacturing projects worth Rs 4,600 crore in Andhra Pradesh, Odisha and Punjab under the India Semiconductor Mission. The India Semiconductor Mission (ISM) aims to build a strong semiconductor and display ecosystem, positioning India as a global hub for electronics manufacturing and design. The four approved proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc, and Advanced Systems in Package (ASIP) Technologies. SiCSem and 3D Glass Solutions Inc will set up their manufacturing facilities in Odisha. Continental Device India Private Limited (CDIL) is already based in Punjab, and it will expand its discrete manufacturing facility, and ASIP Technologies will start its manufacturing plant in Andhra Pradesh. These proposals are worth Rs 4600 crore and are expected to generate employment opportunities for about 2034 skilled professionals, which will drive up the major creation of indirect jobs. With these four approvals, the total approved projects under ISM reach 10, with cumulative investments of about Rs 1.60 lakh crore in six states. Under this proposal, SiCSem Private Limited partners with Clas-SiC Wafer Fab Ltd, UK, for establishing the integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneswar, Odisha. This is the country's first compound facility producing almost 60,000 wafers and a packaging capacity of 96 million units. Moreover, the products made at this facility will have applications in Missiles, Defence Equipment, Electric Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters. 3D Glass Solutions Inc (3DGS) will also set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubneshwar, Odisha. This step will bring the world's most advanced packaging technologies to India for powering the efficiency of the Semiconductor Industry. This facility has a large variety of advanced technologies, including glass interposers and 3D heterogeneous Integration Modules with a planned production capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. Advanced System in Package (ASIP) Technologies has a tech tie-up with APACT Co., Ltd, South Korea. These companies will jointly set up a semiconductor manufacturing unit in Andhra Pradesh with an annual production capacity of 96 billion units. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab, and manufacture devices like MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors both in Silicon and Silicon carbide. Devices manufactured at this facility will have applications in Automotive Electronics, including EVs, renewable energy systems, power conversion applications, industrial applications, and communication infrastructure. New facilities will support the growing chip design capabilities in the country. The government already supported it by providing 278 academic institutions and 72 start-ups. The decision to set up an additional four plants will drive India's momentum in both the chip and electronics markets. Setting up new plants will also cater to the growing employees. This mission achieved great success as India's semiconductor chip market is expected to reach USD 100- 110 billion by 2030, as per the report. Plus, India's electronics exports witnessed a surge of over 47 pc YoY in Quarter 1 of FY26 as per the India Cellular and Electronics Association (ICEA).
New Indian Express
5 days ago
- Business
- New Indian Express
India approves four new semiconductor projects worth Rs. 4600 crore; first chip likely this year
NEW DELHI: The government on Tuesday approved four additional semiconductor manufacturing projects in the states of Odisha, Punjab, and Andhra Pradesh under the India Semiconductor Mission (ISM). These projects, involving a cumulative investment of approximately Rs 4,600 crore, are expected to generate employment for 2,034 skilled professionals. With these new approvals, the total number of projects sanctioned under ISM has reached ten, spread across six states and attracting total investments of around Rs 1.60 lakh crore. The four newly approved companies are SiCSem Private Limited, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc. (3DGS), and Advanced System in Package (ASIP) Technologies. SiCSem and 3DGS will establish their units in Info Valley, Bhubaneswar, Odisha. CDIL will expand its operations in Mohali, Punjab, while ASIP will set up its unit in Andhra Pradesh. Minister for Electronics and Information Technology Ashwini Vaishnaw said that all four companies are expected to begin production within the next two to three years. Speaking about the overall progress of the India Semiconductor Mission, the minister said that implementation of approved projects is advancing at a rapid pace and, most probably, India will witness the rollout of its first made-in-India semiconductor chip within this year. SiCSem Private Limited, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., will set up the country's first commercial compound semiconductor fabrication facility focused on Silicon Carbide (SiC) devices. Located in Info Valley, Bhubaneswar, this fab will have an annual production capacity of 60,000 wafers and a packaging capacity of 96 million units. In the same location, US-based 3D Glass Solutions Inc. will establish a vertically integrated advanced packaging and embedded glass substrate unit. ASIP Technologies will establish a semiconductor manufacturing facility in Andhra Pradesh in partnership with South Korea's APACT Co. Ltd. With an annual capacity of 96 million units, the products manufactured here will cater to applications in mobile phones, set-top boxes, automobiles, and other electronic devices. Meanwhile, CDIL will expand its existing discrete semiconductor manufacturing facility in Mohali, Punjab. This brownfield expansion will focus on the production of high-power discrete devices such as MOSFETs, IGBTs, Schottky diodes, and transistors using both Silicon and Silicon Carbide technologies. The facility will have an annual capacity of 158.38 million units.
Indian Express
5 days ago
- Business
- Indian Express
Cabinet clears four new chip plants for Rs 4,600 crore in Odisha, Punjab and Andhra Pradesh
The Union Cabinet on Tuesday cleared four new semiconductor assembly and testing plants under its India Semiconductor Mission, which have a total financial outlay of Rs 4,594 crore. Two of these plants will come up in Odisha, and one each in Punjab and Andhra Pradesh. With these, the government is now offering financial incentives for the construction of a total of 10 chip-related factories, ranging from a fabrication plant to assembly and testing operations. The two plants in Odisha include a Rs 2,066 crore assembly and testing (ATMP) facility being set up by SiCSem Pvt Ltd, which will produce silicon carbide based diodes and MOSFETs, and another ATMP plant by 3D Glass Solutions Inc. worth Rs 1,943 crore. Union IT Minister Ashwini Vaishnaw said the second plant has investments from Intel, Lockheed Martin, and other VC and PE funds. The first plant will have an ATMP capacity of 96 million chips per year, and the second has a capacity of producing 50 million chips a year. Both these plants will be constructed in Bhubaneswar. Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, under a technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide. The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these proposed units will have applications in automotive electronics including EVs and its charging infrastructure, renewable energy systems, power conversion applications, industrial applications and communication infrastructure. The new locations for the chip plants mark a break from a majority of the facilities which have been approved for construction in Gujarat. Of the 10 plants now approved, four are in Gujarat. Before these, the government has managed to attract six chip plants under its Rs 76,000 crore India Semiconductor Mission. This includes the Tata-PSMC fab, being built at a cost of roughly $11 billion, along with assembly and testing plants by US-based Micron Technology, the Tatas, Murugappa Group's CG Power in partnership with Japan's Renesas, Kaynes Semicon, and HCL-Foxconn. Some of these facilities are in an advanced stage of construction, with the first made-in-India chip expected to roll out later this year. In August 2024, The Indian Express had reported that the Centre had created a fresh $15 billion blueprint for the second phase of the India Semiconductor Mission. Under the renewed scheme, the government was planning to offer capital support for raw materials and gases used in chip manufacturing, this paper had reported.
