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The Print
6 days ago
- Business
- The Print
Union Cabinet approves 4 semiconductor projects Rs 4,600 crore to boost domestic chip making
The approvals take the total India Semiconductor Mission (ISM) portfolio to 10 projects across six states with cumulative investments of Rs 1.6 lakh crore. The government said the move is in line with its vision of building a robust and self-reliant semiconductor ecosystem to support sectors ranging from defence to consumer electronics. 'Four new semiconductor projects have been approved. You know that six projects are already approved and four new ones have been added to it today. These are in Odisha, Andhra Pradesh and Punjab, at an investment of Rs 4,594 Crore,' Union Minister Ashwini Vaishnaw said at a press conference in New Delhi today. New Delhi: In a significant push to India's chip-making ambitions, the Union Cabinet chaired by Prime Minister Narendra Modi on Tuesday approved four new semiconductor manufacturing projects with a total investment of Rs 4,600 crore under the India Semiconductor Mission (ISM). The projects will boost domestic production of chips, packaging and advanced materials, generating over 2,000 skilled jobs directly. Out of the four projects that have been approved, two are in Odisha, one in Punjab, and one in Andhra Pradesh. Two of the approved projects will come up in Odisha's Info Valley, Bhubaneswar, making the state an emerging hub for the sector. SiCSem Private Limited will set up the country's first commercial compound semiconductor fabrication facility, capable of producing 60,000 wafers annually and packaging 96 million units. The plant's products will cater to applications in electric vehicles, railways, fast chargers, data centres, solar inverters, consumer appliances and missile systems. The second Odisha project, by 3D Glass Solutions Inc. (3DGS), will establish an advanced packaging and embedded glass substrate facility. It will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units and 13,200 3D Heterogeneous Integration (3DHI) modules. The technology will be used in high-performance computing, artificial intelligence, defence electronics, radio frequency and photonics applications. In Andhra Pradesh, Advanced System in Package (ASIP) Technologies, in collaboration with South Korea's APACT Co. Ltd., will set up a semiconductor manufacturing unit with a capacity of 96 million units a year. The plant will serve markets for mobile devices, set-top boxes, automotive electronics and other applications. The fourth project that was approved by the Union Cabinet is for Continental Device India Ltd. (CDIL) in Mohali, Punjab, it will expand the company's discrete semiconductor manufacturing capacity. The upgraded facility will produce 158.38 million units of high-power devices annually, including MOSFETs, IGBTs, Schottky diodes and transistors in both silicon and silicon carbide. These components are used in EV electronics, renewable energy systems, power conversion, industrial automation and communication infrastructure. The approvals mark a decisive step in positioning India as a global semiconductor hub. 'These projects will accelerate our journey towards Atmanirbhar Bharat in electronics manufacturing and create a talent pool that will serve global industry,' the government said in a statement. The ISM has already attracted major investments and fostered a growing design ecosystem, with 72 startups and 278 academic institutions engaged in semiconductor R&D and training. Over 60,000 students are benefitting from semiconductor talent development programmes across the country. (ANI) This report is auto-generated from ANI news service. ThePrint holds no responsibility for its content. Also read: Tesla, Samsung sign $16.5 billion chip supply deal, Elon Musk announces
Mint
7 days ago
- Business
- Mint
Cabinet approves ₹18,500 crore semiconductor, infrastructure projects
NEW DELHI: The Union cabinet on Tuesday approved key manufacturing and infrastructure projects worth approximately ₹ 18,500 crore. Among the approvals are four new semiconductor projects in Odisha, Punjab, and Andhra Pradesh; a 700 MW Tato-II hydroelectric project in Arunachal Pradesh; and the expansion of the Lucknow metro over the next five years. With Tuesday's approvals, the total number of semiconductor projects officially sanctioned by the Centre's India Semiconductor Mission has risen to 10, since Micron's memory chip packaging plant was approved in Sanand, Gujarat, in June 2023. Of these, four projects, including India's only modernized chip fab by Tata Electronics, are located in Gujarat, two in Odisha, and one each in Assam, Uttar Pradesh, Punjab, and Andhra Pradesh. Industry stakeholders noted that while the four new projects may not involve large capital outlays, they are strategically important as part of efforts to consolidate investments under the India Semiconductor Mission's first tranche of nearly $10 billion. The four newly approved proposals—SiCSem, Continental Device India Pvt Ltd (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies—carry a cumulative investment of around ₹ 4,600 crore and are expected to generate employment for approximately 2,034 skilled professionals, according to an official statement. A silicon carbide semiconductor plant will be set up in Bhubaneswar by SiCSem Pvt Ltd. 'The SicSem project in Odisha is an integrated semiconductor project, which means that it will have both a compound semiconductor fabrication plant, as well as a chip testing and packaging unit. The second Odisha project with HIPS is an advanced packaging plant for glass substrates, which are applicable in crucial industries. The applicant is also making the substrates innovatively, in order to maximize yield—which makes the project very interesting,' said a senior government official close to the developments. Compound semiconductors are made from silicon combined with other elements. They require different fabrication techniques and are primarily used in strategic industrial applications such as space launches, high-intensity sectors like automotive and railways, and resilient systems including power grids and oil rigs. Heterogenous Integration Packaging Solutions (HIPL) Pvt Ltd will establish a vertically integrated advanced packaging and embedded glass substrate facility in Bhubaneswar, Odisha, with a planned annual capacity of approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules, according to the official statement. Advanced System in Package Technologies (ASIP) will establish a semiconductor manufacturing unit in Andhra Pradesh under a technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units. The manufactured products will serve applications in mobile phones, set-top boxes, automobile systems, and other electronic products. 'ASIP's Andhra Pradesh project is also an advanced packaging project for industrial chips, while Continental's project—the smallest of the lot—is a brown-field expansion of India's oldest existing and running chip testing plant. Overall, the projects come to add significant depth to the overall semiconductor ecosystem,' the official added. Separately, the Cabinet Committee on Economic Affairs (CCEA) approved an investment of ₹ 8,146.21 crore for the construction of the Tato-II Hydro Electric Project (HEP) in Shi Yomi district, Arunachal Pradesh, with an estimated completion timeline of 72 months. The 700 MW project (4 units of 175 MW each) is expected to generate 2,738.06 million units of energy. It will be implemented through a joint venture between the North Eastern Electric Power Corp. Ltd. (NEEPCO) and the Arunachal Pradesh government. The Centre will provide ₹ 458.79 crore in budgetary support for enabling infrastructure such as roads, bridges, and transmission lines, along with ₹ 436.13 crore as central financial assistance towards the state's equity share, according to another official statement. Arunachal Pradesh will benefit from 12% free power and an additional 1% allocation towards the Local Area Development Fund (LADF), it said. This development aligns with the government's goal to reach 500 GW of non-fossil fuel power generation capacity by 2030 as part of its energy transition and net-zero carbon emission targets. In another significant infrastructure boost, the Union cabinet approved Phase-1B of the Lucknow Metro Rail Project, which includes an 11.16-kilometer corridor with 12 stations, seven underground and five elevated. Once operational, Lucknow's metro network will expand to 34 km. The project has an estimated cost of ₹ 5,801 crore.
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First Post
7 days ago
- Business
- First Post
India boosts semiconductor manufacturing with Rs 4,600 cr Cabinet approval for 4 new units
The Union Cabinet, led by Prime Minister Narendra Modi, has approved four new semiconductor projects worth ₹4,600 crore under the India Semiconductor Mission, boosting local chip manufacturing and creating 2,000 skilled jobs read more The Union Cabinet, led by Prime Minister Narendra Modi, authorised four additional semiconductor manufacturing projects on Tuesday, totalling Rs 4,600 crore under the India Semiconductor Mission (ISM). The initiatives will increase local manufacturing of chips, packaging, and innovative materials, creating approximately 2,000 skilled jobs immediately. Two of the four approved projects are located in Odisha, one in Punjab, and one in Andhra Pradesh. 'Four new semiconductor projects have been approved. You know that six projects are already approved and four new ones have been added to it today. These are in Odisha, Andhra Pradesh and Punjab, at an investment of Rs 4,594 Crore,' Union Minister Ashwini Vaishnaw said at a press conference in New Delhi today. STORY CONTINUES BELOW THIS AD The approvals bring the whole India Semiconductor Mission (ISM) portfolio to ten projects across six states, with a combined investment of Rs 1.6 lakh crore. The government stated that the action is consistent with its objective of developing a robust and self-sufficient semiconductor ecosystem to assist industries ranging from military to consumer devices. Two of the approved projects will be developed in Odisha's Info Valley, Bhubaneswar, establishing the state as an emerging hub for the industry. SiCSem Private Limited will establish the country's first commercial compound semiconductor manufacturing factory, capable of generating 60,000 wafers per year and packaging 96 million units. The plant's goods will find use in electric cars, railroads, rapid chargers, data centres, solar inverters, consumer appliances, and missile systems. The second Odisha project, by 3D Glass Solutions Inc. (3DGS), will establish an advanced packaging and embedded glass substrate facility. It will introduce the world's most advanced semiconductor packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units and 13,200 3D Heterogeneous Integration (3DHI) modules. The technology will be used in high-performance computing, artificial intelligence, defence electronics, radio frequency and photonics applications. In Andhra Pradesh, Advanced System in Package (ASIP) Technologies, in collaboration with South Korea's APACT Co. Ltd., will set up a semiconductor manufacturing unit with a capacity of 96 million units a year. The plant will serve markets for mobile devices, set-top boxes, automotive electronics and other applications. The fourth project that was approved by the Union Cabinet is for Continental Device India Ltd. (CDIL) in Mohali, Punjab, it will expand the company's discrete semiconductor manufacturing capacity. The upgraded facility will produce 158.38 million units of high-power devices annually, including MOSFETs, IGBTs, Schottky diodes and transistors in both silicon and silicon carbide. These components are used in EV electronics, renewable energy systems, power conversion, industrial automation and communication infrastructure. STORY CONTINUES BELOW THIS AD The approvals mark a decisive step in positioning India as a global semiconductor hub. 'These projects will accelerate our journey towards Atmanirbhar Bharat in electronics manufacturing and create a talent pool that will serve global industry,' the government said in a statement. The ISM has already attracted major investments and fostered a growing design ecosystem, with 72 startups and 278 academic institutions engaged in semiconductor R&D and training. Over 60,000 students are benefitting from semiconductor talent development programmes across the country.
