Latest news with #AdvancedSysteminPackage
Hans India
3 days ago
- Business
- Hans India
AP semiconductor unit gets Centre's nod
New Delhi: In a major boost to the growing electronics manufacturing sector in Andhra Pradesh, the Union Cabinet on Tuesday approved a semiconductor project for the state with an investment of Rs 468 crore. The AP's new project is a part of four new plants approved by the Union Cabinet with a cumulative investment of nearly Rs 4,600 crore under the India Semiconductor Mission (ISM). The projects are set to create over 2,000 skilled jobs across Andhra Pradesh, Odisha and Punjab. The newly approved proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. With these additions, the total number of approved projects under the ISM now stands at 10, with a combined investment of around Rs 1.60 lakh crore across six states. Advanced System in Package (ASIP) Technologies will establish a new semiconductor manufacturing unit in Andhra Pradesh. This facility will have a technology partnership with South Korea's APACT Co and will produce up to 96 million chips annually. The products will be used in mobile phones, set-top boxes, automotive applications, and other electronics. Two projects will be set up in Info Valley, Bhubaneshwar. SiCSem Private Limited is collaborating with the UK's Clas-SiC Wafer Fab Ltd. to build India's first commercial compound fab for Silicon Carbide (SiC)-based semiconductors. This facility will have an annual capacity of 60,000 wafers and 96 million packaged units, with applications in electric vehicles, defense, and solar power inverters. 3D Glass Solutions Inc. (3DGS) will establish a vertically integrated advanced packaging unit. This facility will bring state-of-the-art glass-based substrate technology to India, with applications in defense, high-performance computing, and automotive electronics. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility in Mohali. This expansion will produce high-power discrete devices like MOSFETs and IGBTs, with an annual capacity of 158.38 million units. The devices will be used in automotive electronics, renewable energy, and industrial applications. These new projects will significantly boost India's self-reliance in the semiconductor sector. They will also complement the country's growing chip design capabilities, which have been supported by the government's talent development programs benefiting over 60,000 students and numerous startups.
Hans India
3 days ago
- Business
- Hans India
Naidu, Lokesh thank Modi
Amaravati: Chief Minister N Chandrababu Naidu expressed his satisfaction with the Union Cabinet's decision to allocate a semiconductor unit to Andhra Pradesh. He extended his gratitude to Prime Minister Narendra Modi and the Central government for the decision. The Chief Minister conveyed his appreciation during a phone call with Union Minister Ashwini Vaishnaw. The semiconductor unit will be set up by Advanced System in Package (ASIP) Technologies in AP in collaboration with APACT Co Ltd, South Korea. The company will produce semiconductors for a wide range of products, including mobile phones, set-top boxes, automotive ECUs, and home electronic appliances. Meanwhile, Minister of HR and IT Nara Lokesh also thanked PM Modi for sanctioning a semiconductor manufacturing unit. 'Semiconductor manufacturing comes to AP, driven by a double engine sarkar! I am grateful to the Prime Minister for sanctioning a semiconductor manufacturing facility to AP as part of a Rs 4,600 crore budgetary allocation,' said Lokesh in a post on X.
Time of India
3 days ago
- Business
- Time of India
Centre green-lights semiconductor facility expansion in Mohali
Mohali: The Union cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor projects under the India Semiconductor Mission (ISM), including the expansion of an existing facility in Mohali. With six projects already under way, these new approvals — SiCSem, Continental Device India Pvt Ltd (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) technologies — will bring cumulative investments of Rs 4,600 crore and create more than 2,000 skilled jobs. This takes the total approved projects under ISM to 10, with investments of Rs 1.60 lakh crore across six states. In Mohali, CDIL will expand its discrete semiconductor manufacturing facility to produce high-power devices such as MOSFETs, IGBTs, Schottky Barrier Diodes, and transistors using silicon and silicon carbide technologies. The upgraded plant will have an annual capacity of 158.38 million units, serving sectors like automotive electronics (including EVs), renewable energy, power conversion, industrial applications, and communication infrastructure. "The Punjab unit of BJP thanked the PM for approving the expansion of a discrete semiconductor manufacturing facility in Mohali," Ashwani Sharma, party's working president, said in a press release. Another BJP leader from Mohali, Vineet Joshi, said this will provide a boost to the economy in Mohali and open up employment opportunities. Stay updated with the latest local news from your city on Times of India (TOI). Check upcoming bank holidays , public holidays , and current gold rates and silver prices in your area.
Mint
3 days ago
- Business
- Mint
Cabinet approves ₹18,500 crore semiconductor, infrastructure projects
NEW DELHI: The Union cabinet on Tuesday approved key manufacturing and infrastructure projects worth approximately ₹ 18,500 crore. Among the approvals are four new semiconductor projects in Odisha, Punjab, and Andhra Pradesh; a 700 MW Tato-II hydroelectric project in Arunachal Pradesh; and the expansion of the Lucknow metro over the next five years. With Tuesday's approvals, the total number of semiconductor projects officially sanctioned by the Centre's India Semiconductor Mission has risen to 10, since Micron's memory chip packaging plant was approved in Sanand, Gujarat, in June 2023. Of these, four projects, including India's only modernized chip fab by Tata Electronics, are located in Gujarat, two in Odisha, and one each in Assam, Uttar Pradesh, Punjab, and Andhra Pradesh. Industry stakeholders noted that while the four new projects may not involve large capital outlays, they are strategically important as part of efforts to consolidate investments under the India Semiconductor Mission's first tranche of nearly $10 billion. The four newly approved proposals—SiCSem, Continental Device India Pvt Ltd (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies—carry a cumulative investment of around ₹ 4,600 crore and are expected to generate employment for approximately 2,034 skilled professionals, according to an official statement. A silicon carbide semiconductor plant will be set up in Bhubaneswar by SiCSem Pvt Ltd. 'The SicSem project in Odisha is an integrated semiconductor project, which means that it will have both a compound semiconductor fabrication plant, as well as a chip testing and packaging unit. The second Odisha project with HIPS is an advanced packaging plant for glass substrates, which are applicable in crucial industries. The applicant is also making the substrates innovatively, in order to maximize yield—which makes the project very interesting,' said a senior government official close to the developments. Compound semiconductors are made from silicon combined with other elements. They require different fabrication techniques and are primarily used in strategic industrial applications such as space launches, high-intensity sectors like automotive and railways, and resilient systems including power grids and oil rigs. Heterogenous Integration Packaging Solutions (HIPL) Pvt Ltd will establish a vertically integrated advanced packaging and embedded glass substrate facility in Bhubaneswar, Odisha, with a planned annual capacity of approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules, according to the official statement. Advanced System in Package Technologies (ASIP) will establish a semiconductor manufacturing unit in Andhra Pradesh under a technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units. The manufactured products will serve applications in mobile phones, set-top boxes, automobile systems, and other electronic products. 'ASIP's Andhra Pradesh project is also an advanced packaging project for industrial chips, while Continental's project—the smallest of the lot—is a brown-field expansion of India's oldest existing and running chip testing plant. Overall, the projects come to add significant depth to the overall semiconductor ecosystem,' the official added. Separately, the Cabinet Committee on Economic Affairs (CCEA) approved an investment of ₹ 8,146.21 crore for the construction of the Tato-II Hydro Electric Project (HEP) in Shi Yomi district, Arunachal Pradesh, with an estimated completion timeline of 72 months. The 700 MW project (4 units of 175 MW each) is expected to generate 2,738.06 million units of energy. It will be implemented through a joint venture between the North Eastern Electric Power Corp. Ltd. (NEEPCO) and the Arunachal Pradesh government. The Centre will provide ₹ 458.79 crore in budgetary support for enabling infrastructure such as roads, bridges, and transmission lines, along with ₹ 436.13 crore as central financial assistance towards the state's equity share, according to another official statement. Arunachal Pradesh will benefit from 12% free power and an additional 1% allocation towards the Local Area Development Fund (LADF), it said. This development aligns with the government's goal to reach 500 GW of non-fossil fuel power generation capacity by 2030 as part of its energy transition and net-zero carbon emission targets. In another significant infrastructure boost, the Union cabinet approved Phase-1B of the Lucknow Metro Rail Project, which includes an 11.16-kilometer corridor with 12 stations, seven underground and five elevated. Once operational, Lucknow's metro network will expand to 34 km. The project has an estimated cost of ₹ 5,801 crore.
