Latest news with #AmkorTechnology
Business Upturn
16-05-2025
- Business
- Business Upturn
Flip Chip Market Size to Worth USD 48.70 Billion by 2032, Driven by Demand for High-Performance Electronics and Advanced Semiconductor Packaging
Austin, May 16, 2025 (GLOBE NEWSWIRE) — Flip Chip Market Size & Growth Insights: According to the SNS Insider,'The Flip Chip Market Size was worth USD 30.61 billion in 2023 and is expected to grow to USD 48.70 billion by 2032, at a compound annual growth rate (CAGR) of 5.40% over the forecast period from 2024 to 2032.' Rising Demand for Advanced Electronics Accelerates Flip Chip Market Growth The Flip Chip Market is experiencing strong demand, as advanced semiconductor devices are increasingly being integrated into consumer electronics. With the increasing requirement for cost-effective, high-density, energy-efficient, and portable electronic products, like smartphones, tablets, and wearables etc., flip chip packaging has become a preferred choice. This solution provides superior thermal optimization, greater I/O density, as well as faster performance. Tech giants are integrating flip-chip technology into CPUs, GPUs and chipsets to satisfy the growing demand for higher processing power. And with quick growth of IoT as well as AI enabled devices, there is an urgent demand for advanced interconnection technologies in chips, which also promotes the penetration of flip U.S. market, valued at USD 4.46 billion in 2023, is expected to grow at a CAGR of 5.95%, owing to favorable R&D investments and some of the world's established technological infrastructures. In totality, these factors make flip chip packaging as a required element for global electronics innovation in the coming years. Get a Sample Report of Flip Chip Market Forecast @ Leading Market Players with their Product Listed in this Report are: Amkor Technology –(SWIFT Packaging, Chip-on-Wafer-on-Substrate (CoWoS)) –(SWIFT Packaging, Chip-on-Wafer-on-Substrate (CoWoS)) Intel Corporation –(Foveros 3D Packaging, Embedded Multi-die Interconnect Bridge (EMIB)) –(Foveros 3D Packaging, Embedded Multi-die Interconnect Bridge (EMIB)) Fujitsu –(FC-BGA (Flip Chip Ball Grid Array), High-density Flip Chip Interposer) –(FC-BGA (Flip Chip Ball Grid Array), High-density Flip Chip Interposer) Taiwan Semiconductor Manufacturing Company Limited (TSMC) – (InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate)) – (InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate)) Texas Instruments Incorporated – (Flip Chip BGA Processors, Power Management ICs with Flip Chip Technology) – (Flip Chip BGA Processors, Power Management ICs with Flip Chip Technology) SAMSUNG – (FOPLP (Fan-Out Panel Level Packaging), HBM2E Memory with Flip Chip) – (FOPLP (Fan-Out Panel Level Packaging), HBM2E Memory with Flip Chip) ASE Technology Holding Co., Ltd. – (ASE SiP (System in Package), Flip Chip WLCSP (Wafer Level Chip Scale Package)) – (ASE SiP (System in Package), Flip Chip WLCSP (Wafer Level Chip Scale Package)) Advanced Micro Devices, Inc. (AMD) – (Ryzen 7000 Series (Foveros-style packaging), EPYC Processors with Flip Chip Die Stacking) – (Ryzen 7000 Series (Foveros-style packaging), EPYC Processors with Flip Chip Die Stacking) APPLE INC. – (M1 Ultra with Flip Chip Interconnect, A15 Bionic Flip Chip SoC) – (M1 Ultra with Flip Chip Interconnect, A15 Bionic Flip Chip SoC) Powertech Technology Inc. – (Flip Chip BGA Services, Wafer Level Flip Chip Packaging) Flip Chip Market Report Scope: Report Attributes Details Market Size in 2023 USD 30.61 Billion Market Size by 2032 USD 48.70 Billion CAGR CAGR of 5.40% From 2024 to 2032 Report Scope & Coverage Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook Key Segmentation •By Packaging Technology- ( 3D,2.5D,2.1D)•By Bumping Technology-(Copper Pillar,Tin-Lead Eutectic Solder,Lead-Free Solder,Gold Stud Bumping) •By End-use – (Military and Defense,Medical and Healthcare,Industrial Sector,Automotive,Consumer Electronics,Telecommunications ) Key Drivers • Growing Integration of Advanced Semiconductor Devices in Consumer Electronics Fuels Flip Chip Market Growth. • Emerging Applications in Automotive Electronics and 5G Infrastructure Create Lucrative Opportunities for Flip Chip Technology. Purchase Single User PDF of Flip Chip Market Report (20% Discount) @ Key Industry Segmentation By Packaging Technology In 2023, the 2.5D packaging segment held the largest share of the Flip Chip Market at 45.60%, as it is a cost-effective and allows for the mounting of several dies on an interposer, which provides better thermal and electrical performance. Companies including Intel and AMD serve high-performance processors with 2.5D ICs, and the ASE Group and TSMC are serving AI and data centers with 2.5D solutions. The 3D packaging segment is projected to grow at the highest CAGR of 7.14%, driven by the desire to achieve ultra-high-density integrations in portable consumer devices including smartphones, AR/VR, and AI processors. New technologies, such as Intel's Foveros and Samsung's X-Cube, are enabling faster adoption by enabling reduced size and power while improving performance. By Bumping Technology The Copper Pillar segment led the Flip Chip Market in 2023 with a dominant 61.36% revenue share, driven by its superior electrical performance, thermal management, and fine-pitch capability, making it ideal for high-density applications like processors, FPGAs, and memory devices. Industry players like TSMC and Amkor Technology have advanced their copper pillar bumping technologies to meet growing demands in AI and 5G chip packaging. The Gold Stud Bumping segment is projected to grow at the highest CAGR of 7.79%, owing to the advantages of low-temperature bonding, and lower contamination rate, especially in precision-guided applications such as medical devices, aerospace, and military electronics. By End-use In 2023, Consumer Electronics held the largest revenue share in the Flip Chip Market at 39.64%, driven by rising demand for compact, high-performance devices like smartphones, tablets, and wearables. Flip chip technology enhances processing speed and thermal performance, making it ideal for these applications. Companies like Apple, Samsung, Intel, and ASE Technology continue to adopt and advance flip chip packaging to meet evolving consumer needs. The Automotive segment is set to grow at the highest CAGR of 7.46%, driven by electronics in advanced driver-assistance systems, infotainment, electric vehicle, and autonomous systems. NXP and Infineon are at the forefront of this enabling technology with automotive grade flip chip solutions. Asia Pacific Leads Flip Chip Market While North America Emerges as Fastest-Growing Region In 2023, Asia Pacific dominated the Flip Chip Market with a 42.39% revenue share, due to the existence of big semiconductor manufacturing countries such as Taiwan, South Korea, China, and Japan. Prominent TSM companies such as TSMC, Samsung Electronics, and ASE Technology Riviera further foster innovation in flip chip packaging through their investments in advanced packaging, including high-density production lines. North America is projected to grow at the fastest CAGR of 7.07%, supported by strong R&D investments and increasing demand in AI, automotive, and high-performance computing. Companies like Intel and AMD are advancing next-gen packaging technologies such as EMIB and Foveros, while government initiatives like the CHIPS Act bolster domestic semiconductor production, further accelerating market growth in the region. Do you have any specific queries or need any customized research on Flip Chip Market? Submit your inquiry here @ Recent Developments: In May 2025, Samsung is expected to power the Galaxy Z Flip 7 with its in-house Exynos 2500 chipset. This marks the first use of Exynos in a foldable, replacing the previously expected Snapdragon chip. In May 2025, MediaTek's next-generation flagship SoC and Arm-based processors drive the outsourced semiconductor assembly and test market, helping ASE rake in a year's worth of packaging tool orders in a single quarter. Table of Contents – Major Points 1. Introduction 2. Executive Summary 3. Research Methodology 4. Market Dynamics Impact Analysis 5. Statistical Insights and Trends Reporting 5.1 Technology Adoption Rate (2023) 5.2 Patent Filing Trends (2023) 5.3 Capital Investments (2023) 5.4 Battery Performance Metrics (2023) 5.5 Production Capacity Utilization (2023) 6. Competitive Landscape 7. Flip Chip Market Segmentation, by Packaging Technology 8. Flip Chip Market Segmentation, by Bumping Technology 9. Flip Chip Market Segmentation, by End-Use 10. Regional Analysis 11. Company Profiles 12. Use Cases and Best Practices 13. Conclusion About Us: SNS Insider is one of the leading market research and consulting agencies that dominates the market research industry globally. Our company's aim is to give clients the knowledge they require in order to function in changing circumstances. In order to give you current, accurate market data, consumer insights, and opinions so that you can make decisions with confidence, we employ a variety of techniques, including surveys, video talks, and focus groups around the world. Disclaimer: The above press release comes to you under an arrangement with GlobeNewswire. Business Upturn takes no editorial responsibility for the same.
Yahoo
16-05-2025
- Business
- Yahoo
Flip Chip Market Size to Worth USD 48.70 Billion by 2032, Driven by Demand for High-Performance Electronics and Advanced Semiconductor Packaging
The Flip Chip Market is growing due to rising demand for compact electronics, high-performance devices, and advancements in semiconductor packaging. Austin, May 16, 2025 (GLOBE NEWSWIRE) -- Flip Chip Market Size & Growth Insights: According to the SNS Insider,'The Flip Chip Market Size was worth USD 30.61 billion in 2023 and is expected to grow to USD 48.70 billion by 2032, at a compound annual growth rate (CAGR) of 5.40% over the forecast period from 2024 to 2032.' Rising Demand for Advanced Electronics Accelerates Flip Chip Market Growth The Flip Chip Market is experiencing strong demand, as advanced semiconductor devices are increasingly being integrated into consumer electronics. With the increasing requirement for cost-effective, high-density, energy-efficient, and portable electronic products, like smartphones, tablets, and wearables etc., flip chip packaging has become a preferred choice. This solution provides superior thermal optimization, greater I/O density, as well as faster performance. Tech giants are integrating flip-chip technology into CPUs, GPUs and chipsets to satisfy the growing demand for higher processing power. And with quick growth of IoT as well as AI enabled devices, there is an urgent demand for advanced interconnection technologies in chips, which also promotes the penetration of flip U.S. market, valued at USD 4.46 billion in 2023, is expected to grow at a CAGR of 5.95%, owing to favorable R&D investments and some of the world's established technological infrastructures. In totality, these factors make flip chip packaging as a required element for global electronics innovation in the coming years. Get a Sample Report of Flip Chip Market Forecast @ Leading Market Players with their Product Listed in this Report are: Amkor Technology –(SWIFT Packaging, Chip-on-Wafer-on-Substrate (CoWoS)) Intel Corporation –(Foveros 3D Packaging, Embedded Multi-die Interconnect Bridge (EMIB)) Fujitsu –(FC-BGA (Flip Chip Ball Grid Array), High-density Flip Chip Interposer) Taiwan Semiconductor Manufacturing Company Limited (TSMC) – (InFO (Integrated Fan-Out), CoWoS (Chip on Wafer on Substrate)) Texas Instruments Incorporated – (Flip Chip BGA Processors, Power Management ICs with Flip Chip Technology) SAMSUNG – (FOPLP (Fan-Out Panel Level Packaging), HBM2E Memory with Flip Chip) ASE Technology Holding Co., Ltd. – (ASE SiP (System in Package), Flip Chip WLCSP (Wafer Level Chip Scale Package)) Advanced Micro Devices, Inc. (AMD) – (Ryzen 7000 Series (Foveros-style packaging), EPYC Processors with Flip Chip Die Stacking) APPLE INC. – (M1 Ultra with Flip Chip Interconnect, A15 Bionic Flip Chip SoC) Powertech Technology Inc. – (Flip Chip BGA Services, Wafer Level Flip Chip Packaging) Flip Chip Market Report Scope: Report Attributes Details Market Size in 2023 USD 30.61 Billion Market Size by 2032 USD 48.70 Billion CAGR CAGR of 5.40% From 2024 to 2032 Report Scope & Coverage Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook Key Segmentation •By Packaging Technology- ( 3D,2.5D,2.1D)•By Bumping Technology-(Copper Pillar,Tin-Lead Eutectic Solder,Lead-Free Solder,Gold Stud Bumping)•By End-use – (Military and Defense,Medical and Healthcare,Industrial Sector,Automotive,Consumer Electronics,Telecommunications ) Key Drivers • Growing Integration of Advanced Semiconductor Devices in Consumer Electronics Fuels Flip Chip Market Growth.• Emerging Applications in Automotive Electronics and 5G Infrastructure Create Lucrative Opportunities for Flip Chip Technology. Purchase Single User PDF of Flip Chip Market Report (20% Discount) @ Key Industry Segmentation By Packaging Technology In 2023, the 2.5D packaging segment held the largest share of the Flip Chip Market at 45.60%, as it is a cost-effective and allows for the mounting of several dies on an interposer, which provides better thermal and electrical performance. Companies including Intel and AMD serve high-performance processors with 2.5D ICs, and the ASE Group and TSMC are serving AI and data centers with 2.5D solutions. The 3D packaging segment is projected to grow at the highest CAGR of 7.14%, driven by the desire to achieve ultra-high-density integrations in portable consumer devices including smartphones, AR/VR, and AI processors. New technologies, such as Intel's Foveros and Samsung's X-Cube, are enabling faster adoption by enabling reduced size and power while improving performance. By Bumping Technology The Copper Pillar segment led the Flip Chip Market in 2023 with a dominant 61.36% revenue share, driven by its superior electrical performance, thermal management, and fine-pitch capability, making it ideal for high-density applications like processors, FPGAs, and memory devices. Industry players like TSMC and Amkor Technology have advanced their copper pillar bumping technologies to meet growing demands in AI and 5G chip packaging. The Gold Stud Bumping segment is projected to grow at the highest CAGR of 7.79%, owing to the advantages of low-temperature bonding, and lower contamination rate, especially in precision-guided applications such as medical devices, aerospace, and military electronics. By End-use In 2023, Consumer Electronics held the largest revenue share in the Flip Chip Market at 39.64%, driven by rising demand for compact, high-performance devices like smartphones, tablets, and wearables. Flip chip technology enhances processing speed and thermal performance, making it ideal for these applications. Companies like Apple, Samsung, Intel, and ASE Technology continue to adopt and advance flip chip packaging to meet evolving consumer needs. The Automotive segment is set to grow at the highest CAGR of 7.46%, driven by electronics in advanced driver-assistance systems, infotainment, electric vehicle, and autonomous systems. NXP and Infineon are at the forefront of this enabling technology with automotive grade flip chip solutions. Asia Pacific Leads Flip Chip Market While North America Emerges as Fastest-Growing Region In 2023, Asia Pacific dominated the Flip Chip Market with a 42.39% revenue share, due to the existence of big semiconductor manufacturing countries such as Taiwan, South Korea, China, and Japan. Prominent TSM companies such as TSMC, Samsung Electronics, and ASE Technology Riviera further foster innovation in flip chip packaging through their investments in advanced packaging, including high-density production lines. North America is projected to grow at the fastest CAGR of 7.07%, supported by strong R&D investments and increasing demand in AI, automotive, and high-performance computing. Companies like Intel and AMD are advancing next-gen packaging technologies such as EMIB and Foveros, while government initiatives like the CHIPS Act bolster domestic semiconductor production, further accelerating market growth in the region. Do you have any specific queries or need any customized research on Flip Chip Market? Submit your inquiry here @ Recent Developments: In May 2025, Samsung is expected to power the Galaxy Z Flip 7 with its in-house Exynos 2500 chipset. This marks the first use of Exynos in a foldable, replacing the previously expected Snapdragon chip. In May 2025, MediaTek's next-generation flagship SoC and Arm-based processors drive the outsourced semiconductor assembly and test market, helping ASE rake in a year's worth of packaging tool orders in a single quarter. Table of Contents - Major Points 1. Introduction 2. Executive Summary 3. Research Methodology 4. Market Dynamics Impact Analysis 5. Statistical Insights and Trends Reporting 5.1 Technology Adoption Rate (2023) 5.2 Patent Filing Trends (2023) 5.3 Capital Investments (2023) 5.4 Battery Performance Metrics (2023) 5.5 Production Capacity Utilization (2023) 6. Competitive Landscape 7. Flip Chip Market Segmentation, by Packaging Technology 8. Flip Chip Market Segmentation, by Bumping Technology 9. Flip Chip Market Segmentation, by End-Use 10. Regional Analysis 11. Company Profiles 12. Use Cases and Best Practices 13. Conclusion About Us: SNS Insider is one of the leading market research and consulting agencies that dominates the market research industry globally. Our company's aim is to give clients the knowledge they require in order to function in changing circumstances. In order to give you current, accurate market data, consumer insights, and opinions so that you can make decisions with confidence, we employ a variety of techniques, including surveys, video talks, and focus groups around the world. CONTACT: Contact Us: Jagney Dave - Vice President of Client Engagement Phone: +1-315 636 4242 (US) | +44- 20 3290 5010 (UK)Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Business Wire
29-04-2025
- Business
- Business Wire
Amkor Technology to Present at the J.P. Morgan Global Technology, Media and Communications Conference
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that it will participate in the J.P. Morgan Global Technology, Media and Communications Conference on Tuesday, May 13, 2025. Amkor's presentation will occur at 1:50 pm Eastern Time (10:50 am Pacific Time) in Boston, Massachusetts. A webcast and replay of the presentation will be made available on the Investor Relations section of Amkor's website, located at Management will also be available for one-on-one and small group meetings with investors. About Amkor Technology, Inc. Amkor Technology, Inc. is the world's largest U.S. headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey manufacturing services for the communication, computing, automotive and industrial and consumer markets, including smartphones, data centers, artificial intelligence, electric vehicles and wearables. Amkor's operational base includes production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. For more information visit
Yahoo
29-04-2025
- Business
- Yahoo
Amkor Technology (AMKR) Matches Q1 Earnings Estimates
Amkor Technology (AMKR) came out with quarterly earnings of $0.09 per share, in line with the Zacks Consensus Estimate. This compares to earnings of $0.24 per share a year ago. These figures are adjusted for non-recurring items. A quarter ago, it was expected that this chip packaging and test services provider would post earnings of $0.37 per share when it actually produced earnings of $0.43, delivering a surprise of 16.22%. Over the last four quarters, the company has surpassed consensus EPS estimates two times. Amkor Technology , which belongs to the Zacks Electronics - Semiconductors industry, posted revenues of $1.32 billion for the quarter ended March 2025, surpassing the Zacks Consensus Estimate by 3.63%. This compares to year-ago revenues of $1.37 billion. The company has topped consensus revenue estimates three times over the last four quarters. The sustainability of the stock's immediate price movement based on the recently-released numbers and future earnings expectations will mostly depend on management's commentary on the earnings call. Amkor Technology shares have lost about 31.7% since the beginning of the year versus the S&P 500's decline of -6.1%. While Amkor Technology has underperformed the market so far this year, the question that comes to investors' minds is: what's next for the stock? There are no easy answers to this key question, but one reliable measure that can help investors address this is the company's earnings outlook. Not only does this include current consensus earnings expectations for the coming quarter(s), but also how these expectations have changed lately. Empirical research shows a strong correlation between near-term stock movements and trends in earnings estimate revisions. Investors can track such revisions by themselves or rely on a tried-and-tested rating tool like the Zacks Rank, which has an impressive track record of harnessing the power of earnings estimate revisions. Ahead of this earnings release, the estimate revisions trend for Amkor Technology: unfavorable. While the magnitude and direction of estimate revisions could change following the company's just-released earnings report, the current status translates into a Zacks Rank #4 (Sell) for the stock. So, the shares are expected to underperform the market in the near future. You can see the complete list of today's Zacks #1 Rank (Strong Buy) stocks here. It will be interesting to see how estimates for the coming quarters and current fiscal year change in the days ahead. The current consensus EPS estimate is $0.14 on $1.33 billion in revenues for the coming quarter and $1.43 on $6.17 billion in revenues for the current fiscal year. Investors should be mindful of the fact that the outlook for the industry can have a material impact on the performance of the stock as well. In terms of the Zacks Industry Rank, Electronics - Semiconductors is currently in the top 21% of the 250 plus Zacks industries. Our research shows that the top 50% of the Zacks-ranked industries outperform the bottom 50% by a factor of more than 2 to 1. Ichor Holdings (ICHR), another stock in the same industry, has yet to report results for the quarter ended March 2025. The results are expected to be released on May 5. This company is expected to post quarterly earnings of $0.26 per share in its upcoming report, which represents a year-over-year change of +388.9%. The consensus EPS estimate for the quarter has been revised 7.7% lower over the last 30 days to the current level. Ichor Holdings' revenues are expected to be $244.93 million, up 21.6% from the year-ago quarter. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report Amkor Technology, Inc. (AMKR) : Free Stock Analysis Report Ichor Holdings, Ltd. (ICHR) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research Sign in to access your portfolio
Business Wire
29-04-2025
- Business
- Business Wire
Amkor Technology Reports Financial Results for the First Quarter 2025
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the first quarter ended March 31, 2025. First Quarter 2025 Highlights Net sales $1.32 billion Gross profit $158 million, operating income $32 million Net income $21 million, earnings per diluted share $0.09 EBITDA $197 million 'Amkor delivered first quarter results in line with expectations, with revenue of $1.32 billion and EPS of $0.09,' said Giel Rutten, Amkor's president and chief executive officer. 'We are closely monitoring the evolving landscape with tariffs and trade regulations and potential impacts on our customers' supply chains. Our diversified global footprint and long-standing partnerships allow us to help our customers work through complexity and uncertainty. Within this dynamic environment, our focus remains on staying agile and delivering value by executing on our long-term strategy.' Quarterly Financial Results (1) EBITDA is a non-GAAP measure. The reconciliation to the comparable GAAP measure is included below under 'Selected Operating Data.' At March 31, 2025, total cash and short-term investments was $1.6 billion, and total debt was $1.1 billion. The company paid a quarterly dividend of $0.08269 per share on April 2, 2025. The declaration and payment of future dividends, as well as any record and payment dates, are subject to the approval of the Board of Directors. Business Outlook The following information presents Amkor's guidance for the second quarter 2025 (unless otherwise noted): Net sales of $1.375 billion to $1.475 billion Gross margin of 11.5% to 13.5% Net income of $17 million to $57 million, or $0.07 to $0.23 per diluted share Full year 2025 capital expenditures of approximately $850 million Conference Call Information Amkor will conduct a conference call on Monday, April 28, 2025, at 5:00 p.m. Eastern Time. This call may include material information not included in this press release. To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor's website, located at The live call can also be accessed by dialing 1-877-407-4019 or 1-201-689-8337. About Amkor Technology, Inc. Amkor Technology, Inc. is the world's largest U.S. headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey manufacturing services for the communication, computing, automotive and industrial and consumer markets, including smartphones, data centers, artificial intelligence, electric vehicles and wearables. Amkor's operational base includes production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. For more information visit (1) Advanced products include flip chip, memory and wafer-level processing and related test services. (2) Mainstream products include all other wirebond packaging and related test services. Expand AMKOR TECHNOLOGY, INC. Selected Operating Data Expand In this press release, we refer to EBITDA, which is not defined by U.S. GAAP. We define EBITDA as net income before interest expense, income tax expense and depreciation and amortization. We believe EBITDA to be relevant and useful information to our investors because it provides additional information in assessing our financial operating results. Our management uses EBITDA in evaluating our operating performance, and our ability to service debt, fund capital expenditures and pay dividends. However, EBITDA has certain limitations in that it does not reflect the impact of certain expenses on our consolidated statements of income, including interest expense, which is a necessary element of our costs because we have borrowed money in order to finance our operations, income tax expense, which is a necessary element of our costs because taxes are imposed by law, and depreciation and amortization, which is a necessary element of our costs because we use capital assets to generate income. EBITDA should be considered in addition to, and not as a substitute for, or superior to, operating income, net income or other measures of financial performance prepared in accordance with U.S. GAAP. Furthermore, our definition of EBITDA may not be comparable to similarly titled measures reported by other companies. Below is our reconciliation of EBITDA to U.S. GAAP net income. AMKOR TECHNOLOGY, INC. CONSOLIDATED STATEMENTS OF INCOME (In thousands, except per share data) (Unaudited) For the Three Months Ended March 31, 2025 2024 Net sales $ 1,321,575 $ 1,365,511 Cost of sales 1,163,992 1,163,868 Gross profit 157,583 201,643 Selling, general and administrative 80,408 90,346 Research and development 45,652 38,171 Total operating expenses 126,060 128,517 Operating income 31,523 73,126 Interest expense 16,809 16,439 Other (income) expense, net (11,075 ) (15,295 ) Total other expense, net 5,734 1,144 Income before taxes 25,789 71,982 Income tax expense 3,936 12,196 Net income 21,853 59,786 Net income attributable to non-controlling interests (725 ) (889 ) Net income attributable to Amkor $ 21,128 $ 58,897 Net income attributable to Amkor per common share: Basic $ 0.09 $ 0.24 Diluted $ 0.09 $ 0.24 Shares used in computing per common share amounts: Basic 246,854 246,008 Diluted 247,845 247,614 Expand AMKOR TECHNOLOGY, INC. CONSOLIDATED BALANCE SHEETS (In thousands) (Unaudited) March 31, 2025 December 31, 2024 ASSETS Current assets: Cash and cash equivalents $ 1,057,560 $ 1,133,553 Short-term investments 505,181 512,984 Accounts receivable, net of allowances 1,052,873 1,055,013 Inventories 326,185 310,910 Other current assets 49,325 61,012 Total current assets 2,991,124 3,073,472 Property, plant and equipment, net 3,641,936 3,576,148 Operating lease right of use assets 104,160 109,730 Goodwill 18,813 17,947 Restricted cash 768 759 Other assets 164,440 166,272 Total assets $ 6,921,241 $ 6,944,328 LIABILITIES AND EQUITY Current liabilities: Short-term borrowings and current portion of long-term debt $ 236,459 $ 236,029 Trade accounts payable 608,464 712,887 Capital expenditures payable 250,718 123,195 Short-term operating lease liability 25,604 26,827 Accrued expenses 332,731 356,337 Total current liabilities 1,453,976 1,455,275 Long-term debt 912,863 923,431 Pension and severance obligations 73,421 70,594 Long-term operating lease liabilities 54,535 57,983 Other non-current liabilities 235,856 253,880 Total liabilities 2,730,651 2,761,163 Stockholders' equity: Preferred stock — — Common stock 293 293 Additional paid-in capital 2,036,608 2,031,643 Retained earnings 2,335,830 2,335,132 Accumulated other comprehensive income (loss) 10,031 7,510 Treasury stock (226,352 ) (225,033 ) Total Amkor stockholders' equity 4,156,410 4,149,545 Non-controlling interests in subsidiaries 34,180 33,620 Total equity 4,190,590 4,183,165 Total liabilities and equity $ 6,921,241 $ 6,944,328 Expand AMKOR TECHNOLOGY, INC. CONDENSED CONSOLIDATED STATEMENTS OF CASH FLOWS (In thousands) (Unaudited) For the Three Months Ended March 31, 2025 2024 Cash flows from operating activities: Net income $ 21,853 $ 59,786 Depreciation and amortization 153,821 144,925 Other operating activities and non-cash items 5,967 14,100 Changes in assets and liabilities (157,492 ) (56,499 ) Net cash provided by operating activities 24,149 162,312 Cash flows from investing activities: Payments for property, plant and equipment (79,897 ) (96,169 ) Proceeds from sale of property, plant and equipment 4,209 3,439 Proceeds from foreign exchange forward contracts 16,674 740 Payments for foreign exchange forward contracts (15,992 ) (24,596 ) Payments for short-term investments (169,720 ) (111,760 ) Proceeds from sale of short-term investments 32,345 16,014 Proceeds from maturities of short-term investments 147,825 121,684 Other investing activities 1,502 4,545 Net cash used in investing activities (63,054 ) (86,103 ) Cash flows from financing activities: Proceeds from short-term debt — 5,012 Payments of short-term debt — (5,669 ) Payments of long-term debt (25,493 ) (29,100 ) Payments of finance lease obligations (15,659 ) (19,684 ) Payments of dividends — (19,383 ) Other financing activities (1,099 ) (1,053 ) Net cash used in financing activities (42,251 ) (69,877 ) Effect of exchange rate fluctuations on cash, cash equivalents and restricted cash 5,172 (8,164 ) Net decrease in cash, cash equivalents and restricted cash (75,984 ) (1,832 ) Cash, cash equivalents and restricted cash, beginning of period 1,134,312 1,120,617 Cash, cash equivalents and restricted cash, end of period $ 1,058,328 $ 1,118,785 Expand Forward-Looking Statement Disclaimer This press release contains forward-looking statements within the meaning of the federal securities laws. You are cautioned not to place undue reliance on forward-looking statements, which are often characterized by terminology such as 'may,' 'will,' 'should,' 'expects,' 'plans,' 'anticipates,' 'believes,' 'estimates,' 'predicts,' 'potential,' 'continue' or 'intend,' by the negative of these terms or other comparable terminology or by discussions of strategy, plans or intentions. All forward-looking statements in this press release are made based on our current expectations, forecasts, estimates and assumptions. Because such statements include risks and uncertainties, actual results may differ materially from those anticipated in such forward-looking statements as a result of various factors, including, but not limited to, the following: dependence on the cyclical and volatile semiconductor industry and vulnerability to industry downturns and declines in global economic and financial conditions; changes in costs, quality, availability and delivery times of raw materials, components and equipment; fluctuations in operating results and cash flows; competition with established competitors in the packaging and test business, the internal capabilities of integrated device manufacturers and new competitors, including foundries and contract manufacturers; our substantial investments in equipment and facilities to support the demand of our customers; warranty claims, product return and liability risks, and the risk of negative publicity if our products fail, as well as the risk of litigation incident to our business; difficulty achieving the relatively high-capacity utilization rates necessary to realize satisfactory gross margins given our high percentage of fixed costs; our absence of backlog and the short-term nature of our customers' commitments; the historical downward pressure on the prices of our packaging and test services; fluctuations in our manufacturing yields; a downturn or lower sales to customers in the automotive industry; dependence on key customers or concentration of customers in certain end markets, such as mobile communications and automotive; difficulty funding our liquidity needs; challenges with integrating diverse operations; dependence on international factories and operations and risks relating to trade restrictions and regional conflict, including restrictive trade barriers, export controls, tariffs, customs and duties; our ability to develop new proprietary technology, protect our proprietary technology, operate without infringing the proprietary rights of others and implement new technologies; our continuing development and implementation of changes to, and maintenance and security of, our information technology systems; restrictive covenants in the indentures and agreements governing our current and future indebtedness; our substantial indebtedness; fluctuations in interest rates and changes in credit risk; the ability of certain of our stockholders to effectively determine or substantially influence the outcome of matters requiring stockholder approval; the possibility that we may decrease or suspend our quarterly dividend; difficulty attracting, retaining or replacing qualified personnel; maintaining an effective system of internal controls; any changes in tax laws, taxing authorities not agreeing with our interpretation of applicable tax laws, including whether we continue to qualify for conditional reduced tax rates, or any requirements to establish or adjust valuation allowances on deferred tax assets; environmental, health and safety liabilities and expenditures; conditions and obligations in connection with the receipt of government awards and incentives; and natural disasters and other calamities, health conditions or pandemics, political instability, hostilities or other disruptions. Other important risk factors that could affect the outcome of the events set forth in these statements and that could affect our operating results and financial condition are discussed in the company's Annual Report on Form 10-K for the year ended December 31, 2024 (the 'Form 10-K') and from time to time in our other reports filed with or furnished to the Securities and Exchange Commission ('SEC'). You should carefully consider the trends, risks and uncertainties described in this press release, the Form 10-K and other reports filed with or furnished to the SEC before making any investment decision with respect to our securities. If any of these trends, risks or uncertainties continues or occurs, our business, financial condition or operating results could be materially and adversely affected, the trading prices of our securities could decline, and you could lose part or all of your investment. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by this cautionary statement. We assume no obligation to review or update any forward-looking statements to reflect events or circumstances occurring after the date of this press release except as may be required by applicable law.
