Latest news with #Arm®Cortex®-A55
The Sun
6 days ago
- Business
- The Sun
Tria enhances SMARC portfolio with new module based on Renesas RZ/G3E processor for HMI applications
STUTENSEE, GERMANY - Media OutReach Newswire - 7 August 2025 - Tria Technologies, an Avnet company specialising in the manufacturing of embedded compute boards, launches its new SMARC module based on a processor from embedded semiconductor solution provider, Renesas. Tria Technologies is the leading SMARC (Smart Mobility ARChitecture) module vendor with the largest portfolio of its kind in the market. Through its collaboration with Renesas, it is able to extend its offering of advanced SMARC modules with the launch of the TRIA SM2S-G3E SMARC module, one of the first solutions based on Renesas' RZ/G3E processor available to the market. The new module is based on the newly launched Renesas RZ/G3E microprocessor, which comes with up to four Arm® Cortex®-A55 cores running at 1.8GHz, a dedicated Arm Cortex-M33 Real-Time core and an Arm Ethos™-U55 neural processor unit (NPU). It is particularly suited for applications that require a small compute platform with high performance, strong graphics, video and AI capabilities and a rich I/O feature set. The microprocessor features the Arm Mali™-G52 graphics processing unit (GPU) and 4K-capable video processing unit (VPU), as well as rich security features. The RZ/G3E is capable of running AI workloads using the NPU, which is a new class of machine learning (ML) processor specifically designed to accelerate ML inference in area-constrained embedded and IoT devices. Other features include up to 8GB fast LPDDR4 with inline ECC and up to 256Gb eMMC Flash, as well as LVDS, MIPI-DSI and HDMI interface options. In addition, the TRIA SM2S-G3E SMARC module offers such high-speed interfaces as PCIe Gen.3 x2/x1, USB 3.2 Gen 2 x 1 and Dual Gigabit Ethernet. 'We are very excited about the groundbreaking products that our relationship with Renesas continues to enable us to develop,' said Daniel Denzler, Senior Director, Business Line Management for Boards and Systems, Tria Technologies. 'This new long-life SM2S-G3E SMARC module will be welcomed by system/application architects and design engineers around the world.' Thomas Staudinger, President, Tria Technologies, added: 'It is essential for specialists operating in the rapidly developing embedded market to have a firm foothold in the sector and that means continually pushing the boundaries by offering the most advanced solutions. Our collaboration with Renesas enables us to do precisely that with the new TRIA SM2S-G3E SMARC module. Because we are a Renesas Early Adopter, we can offer the best time-to-market anywhere and reduce the risk factor associated with new custom designs.' Daryl Khoo, Vice President of Embedded Processing from Renesas said: 'The RZ/G3E brings a new class of Renesas general-purpose MPUs that target cost-sensitive, secure edge computing beyond traditional HMI applications, with seamless cloud integration and high-speed (5G) connectivity. Furthermore, it can run AI/ML workloads independently, which has become a fast-emerging requirement. Our collaboration with Tria brings a proven industry-standard architecture computer into a small form factor module. This innovative and market-ready solution helps our customers get to market quicker.' SMARC is one of the best and most future-proof standards for small form factor embedded designs and this latest announcement strengthens Tria's SMARC portfolio with the very latest embedded modules.
Business Wire
29-07-2025
- Business
- Business Wire
Renesas Introduces 64-bit RZ/G3E MPU for High-Performance HMI Systems Requiring AI Acceleration and Edge Computing
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the launch of its new 64-bit RZ/G3E microprocessor (MPU), a general-purpose device optimized for high-performance Human Machine Interface (HMI) applications. Combining a quad-core Arm® Cortex®-A55 running at up to 1.8GHz with a Neural Processing Unit (NPU), the RZ/G3E brings high-performance edge computing with AI inference for faster, more efficient local processing. With Full HD graphics support and high-speed connectivity, the MPU targets HMI systems for industrial and consumer segments including factory equipment, medical monitors, retail terminals and building automation. 'The RZ/G3E builds on the proven performance of the RZ/G series with the addition of an NPU to support AI processing,' said Daryl Khoo, Vice President of Embedded Processing at Renesas. High-Performance Edge Computing and HMI Capabilities At the heart of the RZ/G3E is a quad-core Arm Cortex-A55, a Cortex-M33 core, and the Ethos™-U55 NPU for AI tasks. This architecture efficiently runs AI applications such as image classification, object recognition, voice recognition and anomaly detection while minimizing CPU load. Designed for HMI applications, it delivers smooth Full HD (1920x1080) video at 60fps on two independent displays, with output interfaces including LVDS (dual-link), MIPI-DSI, and parallel RGB. A MIPI-CSI camera interface is also available for video input and sensing applications. 'The RZ/G3E builds on the proven performance of the RZ/G series with the addition of an NPU to support AI processing,' said Daryl Khoo, Vice President of Embedded Processing at Renesas. 'By using the same Ethos-U55 NPU as our recently announced RA8P1 microcontroller, we're expanding our AI embedded processor portfolio and offering a scalable path forward for AI development. These advancements address the demands of next-generation HMI applications across vision, voice and real-time analytics with powerful AI capabilities.' The RZ/G3E is equipped with a range of high-speed communication interfaces essential for edge devices. These include PCI Express 3.0 (2 lanes) for up to 8Gbps, USB 3.2 Gen2 for fast 10Gbps data transfer, and dual-channel Gigabit Ethernet for seamless connectivity with cloud services, storage, and 5G modules. Low-Power Standby with Fast Linux Resume Starting with the third-generation RZ/G3S, the RZ/G series includes advanced power management features to significantly reduce standby power. The RZ/G3E maintains sub-CPU operation and peripheral functions while achieving low power consumption around 50mW and around 1mW in deep standby mode. It supports DDR self-refresh mode to retain memory data, enabling quick wake-up from deep standby for running Linux applications. Comprehensive Linux Software Support Renesas continues to offer the Verified Linux Package (VLP) based on the reliable Civil Infrastructure Platform, with over 10 years of maintenance support. For users requiring the latest versions, Renesas provides Linux BSP Plus, including support for the latest LTS Linux kernel and Yocto. Ubuntu by Canonical and Debian open-source OS are also available for server or desktop Linux environments. Key Features of RZ/G3E CPU: Quad-core Cortex-A55 (up to 1.8GHz), Cortex-M33 NPU: Ethos-U55 (512 GOPS) HMI: Dual Full HD output, MIPI-DSI / Dual-link LVDS / Parallel RGB, 3D graphics, H.264/H.265 codec Memory Interface: 32-bit LPDDR4/LPDDR4X with ECC Connectivity for 5G Communication: PCIe 3.0 (2 lanes), USB 3.2 Gen2, USB 2.0 x2, Gigabit Ethernet x2, CAN-FD Operating Temperature: -40°C to 125°C Package Options: 15mm square 529-pin FCBGA, 21mm square 625-pin FCBGA Product Longevity: 15-year supply under Product Longevity Program (PLP) System-on-Module Solutions from Renesas and Ecosystem Partners Renesas has also introduced system-on-module (SoM) solutions featuring the RZ/G3E. A broad range of SoM solutions will be available from Renesas' ecosystem partners such as a SMARC module from Tria, an OSM (Size-M) from ARIES Embedded, and an OSM (Size-L) from MXT. Winning Combinations Renesas combined the RZ/G3E with other compatible devices to develop Full HD Dual-Display HMI Platform and Digital Otoscope solutions. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at Availability The RZ/G3E is available today, along with the Evaluation Board Kit. The kit includes a SMARC v2.1.1 module board and a carrier board. More information about Renesas RZ/G3E is available at: About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, X, YouTube, and Instagram. (Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
