Latest news with #Blickman
CNA
23-04-2025
- Business
- CNA
Besi posts strong bookings as AI drives demand for hybrid bonding tech
BE Semiconductor Industries (Besi), a supplier of advanced packaging tools for chipmakers, said on Wednesday its order bookings grew in the first quarter as Asian subcontractors ordered more AI-related data centre applications. Investors are banking on growing orders for Besi's hybrid bonding solutions, a critical chip technology allowing two chips to be bonded directly on top of each other, and its first-mover advantage amid a surge in demand for AI-enabling technology. "We received hybrid bonding orders from two leading memory (chip) producers for HBM 4 applications as well as follow-on orders from a leading Asian foundry for logic applications," CEO Richard Blickman said in a statement. The Dutch group's quarterly order bookings, an important indicator of future growth, grew 8.2 per cent to 131.9 million euros ($150.1 million) compared to the fourth quarter of 2024. Besi's shares, which had fallen 30 per cent this year as of the last close, were up 9 per cent by 0730 GMT. Analysts from KBC Securities said in a note that Besi's new orders were "very positive", underscoring its long term potential even if there will be some volatility in the short run. Besi's revenue fell 6.1 per cent quarter-on-quarter to 144.1 million euros, weighed down by muted shipments for mobile and automotive applications. It expects the metric to remain at a similar level in the second quarter, with a possible deviation of 5 per cent into either direction. The timing and trajectory of the expected demand upturn is more difficult to predict now given the uncertainties around the escalating trade war, Blickman said. Besi had said in February it expected mainstream assembly markets to start to recover only in the second half of the year, depending on end market trends and the course of the global trade restrictions. "However, demand for advanced packaging for AI applications remains strong given upcoming new device introductions and use cases planned in the 2026-2028 period," Blickman added. Degroof Petercam analysts said the upturn, which they expect to materialise in late 2025 or early 2026, should be stronger for Besi given its lead in hybrid bonding technology. ($1 = 0.8787 euros)
Yahoo
23-04-2025
- Business
- Yahoo
Besi reports higher bookings as AI demand picks up in Asia
(Reuters) -Dutch chipmaking parts supplier BE Semiconductor Industries (Besi) said on Wednesday that its order bookings, an important indicator of future growth, rose 8.2% against last quarter as orders from Asian subcontractors for AI related data centre applications picked up. Investors are banking on growing orders for Besi's hybrid bonding solutions and its first-mover advantage amid a surge in demand for AI-enabling technology. Besi's CEO Richard Blickman said in a statement the timing and trajectory of the upturn was more difficult to predict now given the uncertainties around the escalating trade war. "However, demand for advanced packaging for AI applications remains strong given upcoming new device introductions and use cases planned in the 2026-2028 period," Blickman added. Besi said in February it expected mainstream assembly markets to start to recover only in the second half of the year, depending also on end market trends and the course of the global trade restrictions. Its revenue was 144.1 million euros ($164.1 million) in the first quarter, down 6.1% from the fourth quarter of 2024, as shipments for mobile and automotive applications remained muted. ($1 = 0.8779 euros) Sign in to access your portfolio
