Latest news with #CDIL
Time of India
7 days ago
- Business
- Time of India
Cabinet approves four semiconductor units in Odisha, Andhra Pradesh and Punjab
The Union Cabinet has approved the establishment of four new semiconductor manufacturing units at a total cost of ₹4,594 crore. Two of the facilities will be set up in Odisha, with one each in Andhra Pradesh and Punjab, according to a statement by the Ministry of Electronics & IT. These four proposals approved are from SiCSem , Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. While SiCSem and 3D Glass will be set up in Odisha, CDIL is located in Punjab and ASIP will be set up in Andhra Pradesh. Union Minister for Information and Technology Ashwini Vaishnaw had earlier said that India's first domestically produced semiconductor chip would be rolled out 'very soon', with six other semiconductor plants already under construction in Gujarat, Assam and Uttar Pradesh. Vaishnaw reiterated the government's objective of making artificial intelligence technologies widely accessible. He said the India AI mission has made 34,000 graphics processing units (GPUs) available as a common computing resource for innovators. With the approval of these projects, semiconductor ecosystem in the country would get a significant boost as these projects include the country's first commercial compound fab as well as highly advanced glass-based substrate semiconductor packaging unit, the ministry said. About the projects To establish an integrated facility of Silicon Carbide (SiC)-based compound semiconductors in Info Valley, Bhubaneshwar, Odisha, SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK. This will be the first commercial compound fab in the country. Also, 3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. On the other hand, Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, under technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units, the statement added. In addition, Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab, that will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide.
Hindustan Times
7 days ago
- Business
- Hindustan Times
Minister Sanjeev Arora, RS MP Vikramjit Sahney hails approval of semiconductor unit in Mohali
HT Correspondent One of these projects includes CDIL's brownfield expansion at its existing Mohali facility. Chandigarh: The Union cabinet on Tuesday approved the expansion of Continental Device India Private Limited's (CDIL) semiconductor manufacturing facility in Mohali under the India Semiconductor Mission (ISM), as part of four new projects cleared across the country. Punjab industries minister Sanjeev Arora said that the Centre has sanctioned semiconductor manufacturing units in Punjab, Odisha, and Andhra Pradesh with a total outlay of ₹4,600 crore. One of these projects includes CDIL's brownfield expansion at its existing Mohali facility. Welcoming the move, Rajya Sabha MP Vikramjit Singh Sahney reiterated his long-pending demand to upgrade the Semi-Conductor Laboratory (SCL) in Mohali. He recalled that the Centre had already announced a ₹76,000 crore package in 2024 for the development of India's semiconductor and display manufacturing ecosystem, of which ₹10,000 crore was earmarked for modernising SCL Mohali. 'Unfortunately, no progress has been made so far in this regard. The state's full potential in the semiconductor value chain can only be realised with this long-awaited upgradation,' Sahney said.
Hans India
7 days ago
- Business
- Hans India
Big Push For ‘Make In India': Cabinet clears 4 new chip plants
New Delhi: The Union Cabinet on Tuesday approved four semiconductor manufacturing projects worth Rs 4,600 crore in Andhra Pradesh, Odisha and Punjab under the India Semiconductor Mission. The India Semiconductor Mission (ISM) aims to build a strong semiconductor and display ecosystem, positioning India as a global hub for electronics manufacturing and design. The four approved proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc, and Advanced Systems in Package (ASIP) Technologies. SiCSem and 3D Glass Solutions Inc will set up their manufacturing facilities in Odisha. Continental Device India Private Limited (CDIL) is already based in Punjab, and it will expand its discrete manufacturing facility, and ASIP Technologies will start its manufacturing plant in Andhra Pradesh. These proposals are worth Rs 4600 crore and are expected to generate employment opportunities for about 2034 skilled professionals, which will drive up the major creation of indirect jobs. With these four approvals, the total approved projects under ISM reach 10, with cumulative investments of about Rs 1.60 lakh crore in six states. Under this proposal, SiCSem Private Limited partners with Clas-SiC Wafer Fab Ltd, UK, for establishing the integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneswar, Odisha. This is the country's first compound facility producing almost 60,000 wafers and a packaging capacity of 96 million units. Moreover, the products made at this facility will have applications in Missiles, Defence Equipment, Electric Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters. 3D Glass Solutions Inc (3DGS) will also set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubneshwar, Odisha. This step will bring the world's most advanced packaging technologies to India for powering the efficiency of the Semiconductor Industry. This facility has a large variety of advanced technologies, including glass interposers and 3D heterogeneous Integration Modules with a planned production capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. Advanced System in Package (ASIP) Technologies has a tech tie-up with APACT Co., Ltd, South Korea. These companies will jointly set up a semiconductor manufacturing unit in Andhra Pradesh with an annual production capacity of 96 billion units. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab, and manufacture devices like MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors both in Silicon and Silicon carbide. Devices manufactured at this facility will have applications in Automotive Electronics, including EVs, renewable energy systems, power conversion applications, industrial applications, and communication infrastructure. New facilities will support the growing chip design capabilities in the country. The government already supported it by providing 278 academic institutions and 72 start-ups. The decision to set up an additional four plants will drive India's momentum in both the chip and electronics markets. Setting up new plants will also cater to the growing employees. This mission achieved great success as India's semiconductor chip market is expected to reach USD 100- 110 billion by 2030, as per the report. Plus, India's electronics exports witnessed a surge of over 47 pc YoY in Quarter 1 of FY26 as per the India Cellular and Electronics Association (ICEA).
Hans India
7 days ago
- Business
- Hans India
AP semiconductor unit gets Centre's nod
New Delhi: In a major boost to the growing electronics manufacturing sector in Andhra Pradesh, the Union Cabinet on Tuesday approved a semiconductor project for the state with an investment of Rs 468 crore. The AP's new project is a part of four new plants approved by the Union Cabinet with a cumulative investment of nearly Rs 4,600 crore under the India Semiconductor Mission (ISM). The projects are set to create over 2,000 skilled jobs across Andhra Pradesh, Odisha and Punjab. The newly approved proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. With these additions, the total number of approved projects under the ISM now stands at 10, with a combined investment of around Rs 1.60 lakh crore across six states. Advanced System in Package (ASIP) Technologies will establish a new semiconductor manufacturing unit in Andhra Pradesh. This facility will have a technology partnership with South Korea's APACT Co and will produce up to 96 million chips annually. The products will be used in mobile phones, set-top boxes, automotive applications, and other electronics. Two projects will be set up in Info Valley, Bhubaneshwar. SiCSem Private Limited is collaborating with the UK's Clas-SiC Wafer Fab Ltd. to build India's first commercial compound fab for Silicon Carbide (SiC)-based semiconductors. This facility will have an annual capacity of 60,000 wafers and 96 million packaged units, with applications in electric vehicles, defense, and solar power inverters. 3D Glass Solutions Inc. (3DGS) will establish a vertically integrated advanced packaging unit. This facility will bring state-of-the-art glass-based substrate technology to India, with applications in defense, high-performance computing, and automotive electronics. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility in Mohali. This expansion will produce high-power discrete devices like MOSFETs and IGBTs, with an annual capacity of 158.38 million units. The devices will be used in automotive electronics, renewable energy, and industrial applications. These new projects will significantly boost India's self-reliance in the semiconductor sector. They will also complement the country's growing chip design capabilities, which have been supported by the government's talent development programs benefiting over 60,000 students and numerous startups.
Time of India
12-08-2025
- Business
- Time of India
Centre green-lights semiconductor facility expansion in Mohali
Mohali: The Union cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor projects under the India Semiconductor Mission (ISM), including the expansion of an existing facility in Mohali. With six projects already under way, these new approvals — SiCSem, Continental Device India Pvt Ltd (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) technologies — will bring cumulative investments of Rs 4,600 crore and create more than 2,000 skilled jobs. This takes the total approved projects under ISM to 10, with investments of Rs 1.60 lakh crore across six states. In Mohali, CDIL will expand its discrete semiconductor manufacturing facility to produce high-power devices such as MOSFETs, IGBTs, Schottky Barrier Diodes, and transistors using silicon and silicon carbide technologies. The upgraded plant will have an annual capacity of 158.38 million units, serving sectors like automotive electronics (including EVs), renewable energy, power conversion, industrial applications, and communication infrastructure. "The Punjab unit of BJP thanked the PM for approving the expansion of a discrete semiconductor manufacturing facility in Mohali," Ashwani Sharma, party's working president, said in a press release. Another BJP leader from Mohali, Vineet Joshi, said this will provide a boost to the economy in Mohali and open up employment opportunities. Stay updated with the latest local news from your city on Times of India (TOI). Check upcoming bank holidays , public holidays , and current gold rates and silver prices in your area.
